high speed cmos, series 74hc, on semiconductor
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HighSpeed CMOS Data
DL129/DRev. 8, January2005
SCILLC, 2005Previous Edition 2000All Rights Reserved
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ON Semiconductor and are registered trademarks of Semiconductor Components Industries , LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidentaldamages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary overtime. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license underits patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or deathmay occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim ofpersonal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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DL129/D
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Table of Contents
Page
Numeric Data Sheet ListingNumeric Data Sheet Listing 4. . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 1: Selector GuideBuffers/Inverters 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Gates 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Schmitt Triggers 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Bus Transceivers 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Latches 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .FlipFlops 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Digital Data Selectors/Multiplexers 19. . . . . . . . . . . . . . . . . .Decoders/Demultiplexers/Display Drivers 20. . . . . . . . . . . .Analog Switches/Multiplexers/ Demultiplexers 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Shift Registers 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Counters 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Miscellaneous 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Page
Chapter 2: Data SheetsData Sheets 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 3: Case Outlines and PackageDimensionsCase Outlines and Package Dimensions 388. . . . . . . . . . . .
Chapter 4: IndexHighSpeed CMOS Device Index 406. . . . . . . . . . . . . . . . . .
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Numeric Data Sheet Listing
Data Sheet Function Page
MC74HC00A Quad 2Input NAND Gate HighPerformance SiliconGate CMOS 27. . . . . . . . . . . . .
MC74HC02A Quad 2Input NOR Gate HighPerformance SiliconGate CMOS 31. . . . . . . . . . . . . .
MC74HC03A Quad 2Input NAND Gate with OpenDrain Outputs HighPerformanceSiliconGate CMOS 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC04A Hex Inverter HighPerformance SiliconGate CMOS 39. . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC08A Quad 2Input AND Gate HighPerformance SiliconGate CMOS 43. . . . . . . . . . . . . .
MC74HC125A,MC74HC126A Quad 3State Noninverting Buffers HighPerformance SiliconGate CMOS 47 . . . . .
MC74HC132A Quad 2Input NAND Gate with SchmittTrigger Inputs HighPerformanceSiliconGate CMOS 51. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC138A 1of8 Decoder/ Demultiplexer HighPerformance SiliconGate CMOS 58. . . . . . . .
MC74HC139A Dual 1of4 Decoder/Demultiplexer HighPerformance SiliconGate CMOS 63 . . . .
MC74HC14A Hex SchmittTrigger Inverter HighPerformance SiliconGate CMOS 69. . . . . . . . . .
MC74HC157A Quad 2Input Data Selectors / Multiplexers HighPerformance SiliconGateCMOS 74. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC161A,MC74HC163A Presettable Counters HighPerformance SiliconGate CMOS 79. . . . . . . . . . . . . . . . .
MC74HC164A 8Bit SerialInput/ParallelOutput Shift Register HighPerformanceSiliconGate CMOS 92. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC174A Hex D FlipFlop with Common Clock and Reset HighPerformance SiliconGate CMOS 98. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC175A Quad D FlipFlop with Common Clock and Reset HighPerformanceSiliconGate CMOS 104. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC1G00 Single 2Input NAND Gate 110. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC1G02 Single 2Input NOR Gate 114. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC1G04 Single Inverter 118. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC1G08 Single 2Input AND Gate 122. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Data Sheet Function Page
MC74HC1G14 Single Inverter with SchmittTrigger Input 126. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC1G32 Single 2Input OR Gate 130. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC1GU04 Single Unbuffered Inverter 134. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC240A Octal 3State Inverting Buffer/Line Driver/Line Receiver HighPerformanceSiliconGate CMOS 138. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC244A Octal 3State Noninverting Buffer/Line Driver/Line Receiver HighPerformanceSiliconGate CMOS 143. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC245A Octal 3State Noninverting Bus Transceiver HighPerformance SiliconGateCMOS 148. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC273A Octal D FlipFlop with Common Clock and Reset HighPerformance SiliconGate CMOS 154. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC32A Quad 2Input OR Gate HighPerformance SiliconGate CMOS 160. . . . . . . . . . . . . .
MC74HC373A Octal 3State NonInverting Transparent Latch HighPerformance SiliconGate CMOs 164. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC374A Octal 3State NonInverting D FlipFlop HighPerformance SiliconGateCMOS 170. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC390A Dual 4Stage Binary Ripple Counter with 2 and 5 Sections HighPerformance SiliconGate CMOS 175. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC393A Dual 4Stage Binary Ripple Counter HighPerformance SiliconGate CMOS 181 . . .
MC74HC4020A 14Stage Binary Ripple Counter HighPerformance SiliconGate CMOS 187. . . . . .
MC74HC4040A 12Stage Binary Ripple Counter HighPerformance SiliconGate CMOS 193. . . . . .
MC74HC4046A PhaseLocked Loop HighPerformance SiliconGate CMOS 199. . . . . . . . . . . . . . . .
MC74HC4051A,MC74HC4052A,MC74HC4053A Analog Multiplexers / Demultiplexers HighPerformance SiliconGate CMOS 213 . . .
MC74HC4060A 14Stage Binary Ripple Counter With Oscillator HighPerformance SiliconGateCMOS 226. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC4066A Quad Analog Switch/Multiplexer/Demultiplexer HighPerformance SiliconGateCMOS 235. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC4316A Quad Analog Switch/Multiplexer/Demultiplexer with Separate Analog and DigitalPower Supplies HighPerformance SiliconGate CMOS 246. . . . . . . . . . . . . . . . . . . . .
MC74HC4538A Dual Precision Monostable Multivibrator (Retriggerable, Resettable) 257. . . . . . . . . . . . .
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Data Sheet Function Page
MC74HC4851A,MC74HC4852A Analog Multiplexers/Demultiplexers with Injection Current Effect
Control Automotive Customized 270. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC540A Octal 3State Inverting Buffer/Line Driver/Line Receiver HighPerformanceSiliconGate CMOS 280. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC541A Octal 3State Noninverting Buffer/Line Driver/Line Receiver HighPerformanceSiliconGate CMOS 286. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC573A Octal 3State Noninverting Transparent Latch HighPerformanceSiliconGate CMOS 292. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC574A Octal 3State Noninverting D FlipFlop HighPerformance SiliconGateCMOS 298. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC589A 8Bit Serial or ParallelInput/SerialOutput Shift Register with 3StateOutput HighPerformance SiliconGate CMOS 304. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC595A 8Bit SerialInput/Serial or ParallelOutput Shift Register with Latched 3StateOutputs HighPerformance SiliconGate CMOS 313. . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HC74A Dual D FlipFlop with Set and Reset HighPerformance SiliconGate CMOS 321 . . .
MC74HCT04A Hex Inverter With LSTTLCompatible Inputs HighPerformanceSiliconGate CMOS 326. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HCT138A 1of8 Decoder/ Demultiplexer with LSTTL Compatible Inputs HighPerformanceSiliconGate CMOS 330. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HCT14A Hex SchmittTrigger Inverter with LSTTL Compatible Inputs HighPerformanceSiliconGate CMOS 335. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HCT244A Octal 3State Noninverting Buffer/Line Driver/Line Receiver with LSTTLCompatibleInputs HighPerformance SiliconGate CMOS 340. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HCT245A Octal 3State Noninverting Bus Transceiver with LSTTL CompatibleInputs HighPerformance SiliconGate CMOS 344. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HCT273A Octal D FlipFlop with Common Clock and Reset with LSTTLCompatibleInputs HighPerformance SiliconGate CMOS 349. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HCT373A Octal 3State Noninverting Transparent Latch with LSTTLCompatible
Inputs HighPerformance SiliconGate CMOS 353. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HCT374A Octal 3State Noninverting D FlipFlop with LSTTLCompatibleInputs HighPerformance SiliconGate CMOS 359. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HCT541A Octal 3State NonInverting Buffer/Line Driver/Line Receiver With LSTTLCompatibleInputs HighPerformance SiliconGate CMOS 364. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Data Sheet Function Page
MC74HCT573A Octal 3State Noninverting Transparent Latch with LSTTL CompatibleInputs HighPerformance SiliconGate CMOS 368. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HCT574A Octal 3State Noninverting D FlipFlop with LSTTLCompatibleInputs HighPerformance SiliconGate CMOS 373. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HCT74A Dual D FlipFlop with Set and Reset with LSTTL CompatibleInputs HighPerformance SiliconGate CMOS 378. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC74HCU04A Hex Unbuffered Inverter HighPerformance SiliconGate CMOS 383. . . . . . . . . . . . . .
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CHAPTER 1Selector Guide
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BUFFERS/INVERTERS
DeviceNumber
MC74
Function
FunctionalEquivalent
LSTTLDevice
74
FunctionalEquivalent
CMOSDevice
MC1XXXXor CDXXXX
Direct PinCompatibility
Numberof
Pins
HC04AHCT04AHCU04AHC14A
HCT14A
Hex InverterHex Inverter with LSTTLCompatible InputsHex Unbuffered InverterHex SchmittTrigger InverterHex SchmittTrigger Inverter with LSTTLCompatible
Inputs
LS04LS04LS04LS14LS14
*4069*4069406945844584
LS/CMOSLS/CMOSLS/CMOSLS/CMOSLS/CMOS
1414141414
HC125AHC126AHC240A
Quad 3State Noninverting BufferQuad 3State Noninverting BufferOctal 3State Inverting Buffer/Line Driver/Line Receiver
LS125,LS125ALS126,LS126A
LS240
LSLSLS
141420
HC244A
HCT244A
HC245AHCT245A
Octal 3State Noninverting Buffer/Line Driver/LineReceiver
Octal 3State Noninverting Buffer/Line Driver/Line
Receiver with LSTTLCompatible InputsOctal 3State Noninverting Bus TransceiverOctal 3State Noninverting Bus Transceiver with
LSTTLCompatible Inputs
LS244
LS244
LS245LS245
LS
LS
LSLS
20
20
2020
HC540A
Octal 3State Inverting Buffer/Line Driver/Line Receiver
20
HC541A
HCT541A
Octal 3State Noninverting Buffer/Line Driver/LineReceiver
Octal 3State Noninverting Buffer/Line Driver/LineReceiver with LSTTLCompatible Inputs
LS541
LS541
LS
LS
20
20
HC Devices Have CMOSCompatible Inputs. HCT Devices Have LSTTLCompatible Inputs.
Device
HCHCT04A
HCU04A
HC14A
HC125A
HC126A
HC240A
HCHCT244A
HCHCT245A
# Pins
14
14
14
14
14
20
20
20
Quad DeviceHex DeviceOctal DeviceNineWide Device
D
D
D
D
D
D
D
D
Noninverting OutputsInverting Outputs
D
D
D
D
D
D
D
D
Single Stage (unbuffered)
D
Schmitt Trigger
D
3State Outputs
OpenDrain OutputsCommon Output EnablesActiveLow Output EnablesActiveHigh Output EnablesSeparate 4Bit SectionsSeparate 2Bit and 4Bit Sections
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
TransceiverDirection Control
D
D
LogicLevel Down Converter
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BUFFERS/INVERTERS (Continued)
HC Devices Have CMOSCompatible Inputs. HCT Devices Have LSTTLCompatible Inputs.
Device
HC540A
HCHCT541A
# Pins
20
20
Quad DeviceHex DeviceOctal DeviceNineWide Device
D
D
Noninverting OutputsInverting Outputs
D
D
Single Stage (unbuffered)
Schmitt Trigger
3State OutputsOpenDrain OutputsCommon Output EnablesActiveLow Output Enables
D
D
D
D
D
D
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GATES
DeviceNumber
MC74
Function
FunctionalEquivalent
LSTTLDevice
74
FunctionalEquivalent
CMOSDevice
MC1XXXXor CDXXXX
Direct PinCompatibility
Numberof
Pins
HC00AHC02AHC03AHC08AHC32AHC86A
HC132A
Quad 2Input NAND GateQuad 2Input NOR GateQuad 2Input NAND Gate with OpenDrain OutputsQuad 2Input AND GateQuad 2Input OR GateQuad 2Input Exclusive OR GateQuad 2Input NAND Gate with SchmittTrigger Inputs
LS00
LS08LS32LS86
LS132
40114001*40114081407140704093
LS
LSLSLSLS
14141414141414
HC Devices Have CMOSCompatible Inputs.
Device
HC00A
HC02A
HC03A
HC08A
HC32A
# Pins
14
14
14
14
14
Single DeviceDual DeviceTriple DeviceQuad Device
D
D
D
D
D
NANDNORANDOR
D
D
D
D
D
Exclusive ORExclusive NORANDNORANDOR
2Input3Input4Input8Input13Input
D
D
D
D
D
SchmittTrigger Inputs
OpenDrain Outputs
D
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GATES (Continued)
HC Devices Have CMOSCompatible Inputs.
Device
HC86A
HC132A
# Pins
14
14
Single Device
Dual DeviceTriple DeviceQuad Device
D
D
NANDNORANDOR
D
Exclusive ORExclusive NORANDNORANDOR
D
2Input
3Input4Input8Input13Input
D
D
SchmittTrigger Inputs
D
OpenDrain Outputs
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SCHMITT TRIGGERS
DeviceNumber
MC74
Function
FunctionalEquivalent
LSTTLDevice
74
FunctionalEquivalent
CMOSDevice
MC1XXXXor CDXXXX
Direct PinCompatibility
Numberof
Pins
HC14AHCT14A
HC132A
Hex SchmittTrigger InverterHex SchmittTrigger Inverter with LSTTLCompatible
InputsQuad 2Input NAND Gate with SchmittTrigger Inputs
LS14LS14
LS132
45844584
4093
LS/CMOSLS
LS
1414
14
BUS TRANSCEIVERS
Device
NumberMC74
Function
FunctionalEquivalent
LSTTL
Device74
FunctionalEquivalent
CMOSDevice
MC1XXXXor CDXXXX
Direct PinCompatibility
Number
ofPins
HC245AHCT245A
Octal 3State Noninverting Bus TransceiverOctal 3State Noninverting Bus Transceiver withLSTTLCompatible Inputs
LS245LS245
LSLS
2020
HC Devices Have CMOSCompatible Inputs. HCT Devices Have LSTTLCompatible Inputs.
Device
HCHCT245A
# Pins
20
Quad DeviceOctal Device
D
BufferStorage Capability
D
Inverting OutputsNoninverting Outputs
D
Common Output EnableActiveLow Output EnableActiveHigh Output Enable
D
D
Direction Control
D
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LATCHES
DeviceNumber
MC74
Function
FunctionalEquivalent
LSTTLDevice
74
FunctionalEquivalent
CMOSDevice
MC1XXXXor CDXXXX
Direct PinCompatibility
Numberof
Pins
HC373AHCT373A
Octal 3State Noninverting Transparent LatchOctal 3State Noninverting Transparent Latch with
LSTTLCompatible Inputs
LS373LS373
LS373LS373
2020
HC573AHCT573A
Octal 3State Noninverting Transparent LatchOctal 3State Noninverting Transparent Latch with
LSTTLCompatible Inputs
LS373LS373
LS573LS573
2020
HC Devices Have CMOSCompatible Inputs. HCT Devices Have LSTTLCompatible Inputs.
Device
HCHCT373A
HCHCT573A
# Pins
20
20
Single DeviceDual DeviceOctal Device
D
D
Number of Bits Controlled by Latch Enable :28
D
D
TransparentAddressableReadback Capability
D
D
Noninverting Outputs
Inverting Outputs
D
D
Common Latch Enable, ActiveLow
D
D
3State OutputsCommon Output Enable, ActiveLow
D
D
D
D
These devices are identical in function and are different in pinout only: HC/HCT373A and HC/HCT573A
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FLIPFLOPS
DeviceNumber
MC74
Function
FunctionalEquivalent
LSTTLDevice
74
FunctionalEquivalent
CMOSDevice
MC1XXXXor CDXXXX
Direct PinCompatibility
Numberof
Pins
HC74AHCT74A
Dual D FlipFlop with Set and ResetDual D FlipFlop with Set and Reset with
LSTTLCompatible Inputs
LS74,LS74ALS74,LS74A
*40134013
LSLS
1414
HC174AHC175A
Hex D FlipFlop with Common Clock and ResetQuad D FlipFlop with Common Clock and Reset
LS174LS175
41744175
LS/CMOSLS/CMOS
1616
HC273AHCT273A
HC374AHCT374A
Octal D FlipFlop with Common Clock and ResetOctal D FlipFlop with Common Clock and Reset with
LSTTLCompatible InputsOctal 3State Noninverting D FlipFlopOctal 3State Noninverting D FlipFlop with
LSTTLCompatible Inputs
LS273LS273
LS374LS374
LSLS
LS374LS374
2020
2020
HC574AHCT574A
Octal 3State Noninverting D FlipFlopOctal 3State Noninverting D FlipFlop withLSTTLCompatible Inputs
LS374LS374
2020
*Suggested alternative
HC Devices Have CMOSCompatible Inputs. HCT Devices Have LSTTLCompatible Inputs.
Device
HCHCT74A
HC174A
HC175/A
# Pins
14
16
16
Type
D
D
D
Dual DeviceQuad DeviceHex DeviceOctal Device
D
D
D
Common ClockNegativeTransition ClockingPositiveTransition Clocking
D
D
D
D
D
Common, ActiveLow Data Enables
Noninverting OutputsInverting Outputs
D
D
D
D
D
3State OutputsCommon, ActiveLow Output Enables
Common ResetActiveLow ResetActiveHigh Reset
D
D
D
D
D
ActiveLow Set
D
TransceiverDirection Control
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FLIPFLOPS (Continued)
HC Devices Have CMOSCompatible Inputs. HCT Devices Have LSTTLCompatible Inputs.
Device
HCHCT273A
HCHCT374A
HCHCT574A
# Pins
20
20
20
Type
D
D
D
Dual DeviceQuad DeviceHex DeviceOctal Device
D
D
D
Common ClockNegativeTransition ClockingPositiveTransition Clocking
D
D
D
D
D
D
Common, ActiveLow Data Enables
Noninverting OutputsInverting Outputs
D
D
D
3State Outputs
Common, ActiveLow Output Enables
D
D
D
D
Common ResetActiveLow ResetActiveHigh Reset
D
D
ActiveLow Set
TransceiverDirection Control
These devices are identical in function and are different in pinout only: HC374A and HC574A
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DIGITAL DATA SELECTORS/MULTIPLEXERS
DeviceNumber
MC74
Function
FunctionalEquivalent
LSTTLDevice
74
FunctionalEquivalent
CMOSDevice
MC1XXXXor CDXXXX
Direct PinCompatibility
Numberof
Pins
HC157A
Quad 2Input Noninverting Data Selector/Multiplexer
LS157
LS
16
HC251HC253
HC257
8Input Data Selector/Multiplexer with 3State OutputsDual 4Input Data Selector/Multiplexer with 3State
OutputsQuad 2Input Data Selector/Multiplexer with 3State
Outputs
LS251LS253
LS257B
*4512
LSLS
LS
1616
16
*Suggested alternative
HC Devices Have CMOSCompatible Inputs.
Device
HC157A
# Pins
16
Description
One oftwo 4bitwords isselected
Single DeviceDual DeviceQuad Device
D
Data Latch with ActiveLow Latch Enable
Common Address1Bit Binary Address2Bit Binary Address3Bit Binary Address
D
D
Address Latch (Transparent)Address Latch (Nontransparent)ActiveLow Address Latch Enable
Noninverting OutputInverting Output
D
3State Outputs
Common Output EnableActiveHigh Output EnableActiveLow Output Enable
D
D
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DECODERS/DEMULTIPLEXERS/DISPLAY DRIVERS
DeviceNumber
MC74
Function
FunctionalEquivalent
LSTTLDevice
74
FunctionalEquivalent
CMOSDevice
MC1XXXXor CDXXXX
Direct PinCompatibility
Numberof
Pins
HC138AHCT138A
HC139A
1of8 Decoder/Demultiplexer1of8 Decoder/Demultiplexer with LSTTLCompatible
InputsDual 1of4 Decoder/Demultiplexer
LS138LS138
LS139
*4028*4028
4556
LSLS
LS/CMOS
1616
16*Suggested alternative
HC Devices Have CMOSCompatible Inputs.
Device
HCHCT138A
HC139A
# Pins
16
16
Input Description
3Bit Binary
Address
2Bit Binary
Address
Output Description
One of 8
One of 4
Single DeviceDual Device
D
D
Address Input LatchActiveHigh Latch EnableActiveLow Latch Enable
ActiveLow Inputs
ActiveLow OutputsActiveHigh Outputs
D
D
ActiveLow Output EnableActiveHigh Output Enable
DD
D
D
ActiveLow Reset
ActiveLow Blanking InputActiveHigh Blanking Input
ActiveLow LampTest Input
Phase Input (for LCDs)
DD Implies the device has two such enables
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ANALOG SWITCHES/MULTIPLEXERS/DEMULTIPLEXERS
DeviceNumber
MC74
Function
FunctionalEquivalent
LSTTLDevice
74
FunctionalEquivalent
CMOSDevice
MC1XXXXor CDXXXX
Direct PinCompatibility
Numberof
Pins
HC4051AHC4052AHC4053AHC4066A
8Channel Analog Multiplexer/DemultiplexerDual 4Channel Analog Multiplexer/DemultiplexerTriple 2Channel Analog Multiplexer/DemultiplexerQuad Analog Switch/Multiplexer/Demultiplexer
405140524053
4066,4016
CMOSCMOSCMOSCMOS
16161614
K HC4316/A
K HC4851A
K HC4852A
Quad Analog Switch/Multiplexer/Demultiplexer withSeparate Analog and Digital Power Supplies
Analog Multiplexer/Demultiplexer with Injection CurrentEffect Control
Analog Multiplexer/Demultiplexer with Injection CurrentEffect Control
*4016
*4051
*4052
16
20
20
*Suggested alternative K HighSpeed CMOS design only
HC Devices Have CMOSCompatible Inputs.
Device
HC4051A
HC4052A
HC4053A
HC4066A
# Pins
16
16
16
14
Description
A 3Bit AddressSelects One of 8
Switches
A 2Bit AddressSelects One of 4
Switches
A 3Bit AddressSelects VaryingCombinations ofthe 6 Switches
4 IndependentlyControlledSwitches
Single DeviceDual DeviceTriple DeviceQuad Device
D
D
D
D
1to1 Multiplexing2to1 Multiplexing4to1 Multiplexing8to1 Multiplexing
D
D
D
D
ActiveHigh ON/OFF Control
D
Common Address Inputs2Bit Binary Address3Bit Binary Address
Address Latch with ActiveLow LatchEnable
D
D
D
D
D
Common Switch EnableActiveLow EnableActiveHigh Enable
D
D
D
D
D
D
Separate Analog and Control ReferencePower Supplies
D
D
D
Switched Tubs (for R ON and Prop. DelayImprovement)
D
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ANALOG SWITCHES/MULTIPLEXERS/DEMULTIPLEXERS (Continued)
HC Devices Have CMOSCompatible Inputs.
Device
HC4316A
HC4851A
HC4852A
# Pins
16
20
20
Description
4 Independently
Controlled Switches(Has a Separate
Analog LowerPower Supply)
A 3Bit Address
Selects One of 8Switches
(Has Injection CurrentProtection)
A 3Bit Address
Selects VaryingCombinations ofthe 6 Switches
(Has Injection CurrentProtection)
Single DeviceDual DeviceTriple DeviceQuad Device
D
D
D
1to1 Multiplexing2to1 Multiplexing4to1 Multiplexing8to1 Multiplexing
D
D
D
ActiveHigh ON/OFF Control
D
Common Address Inputs2Bit Binary Address3Bit Binary Address
D
D
D
D
Common Switch EnableActiveLow EnableActiveHigh Enable
D
D
D
D
D
D
Separate Analog and Control Reference Power Supplies
D
D
D
Switched Tubs (for R ON and Prop. Delay Improvement)
njection Current Protection
D
D
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SHIFT REGISTERS
DeviceNumber
MC74
Function
FunctionalEquivalent
LSTTLDevice
74
FunctionalEquivalent
CMOSDevice
MC1XXXXor CDXXXX
Direct PinCompatibility
Numberof
Pins
HC164AHC165A
8Bit SerialInput/ParallelOutput Shift Register8Bit Serial or ParallelInput/SerialOutput Shift Register
LS164LS165
*4021
LSLS
1416
HC589A
HC595A
8Bit Serial or ParallelInput/SerialOutput Shift Registerwith 3State Output
8Bit SerialInput/Serial or ParallelOutput Shift Registerwith Latched 3State Outputs
16
16
*Suggested alternative
HC Devices Have CMOSCompatible Inputs.
Device
HC164A
HC165A
HC589A
HC595A
# Pins
14
16
16
16
4Bit Register8Bit Register
D
D
D
D
Serial Data InputParallel Data Inputs
D
D
D
D
D
D
Serial Output OnlyParallel OutputsInverting OutputNoninverting Output
D
D
D
D
D
D
D
D
D
Serial Shift/Parallel Load ControlShifts One Direction OnlyShifts Both Directions
D
D
D
D
D
D
PositiveTransition ClockingActiveHigh Clock Enable
D
D
D
D
D
Input Data Enable
D
Data Latch with ActiveHigh Latch Clock
D
Output Latch with ActiveHigh Latch Clock
D
3State OutputsActiveLow Output Enable
D
D
D
D
ActiveLow Reset
D
D
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COUNTERS
DeviceNumber
MC74
Function
FunctionalEquivalent
LSTTLDevice
74
FunctionalEquivalent
CMOSDevice
MC1XXXXor CDXXXX
Direct PinCompatibility
Numberof
Pins
HC161A
HC163AHC390A
Presettable 4Bit Binary Counter with AsynchronousReset
Presettable 4Bit Binary Counter with Synchronous ResetDual 4Stage Binary Ripple Counter with 2 and 5
Sections
LS161,LS161A
LS161,LS161A
LS
LS
16
161616
HC393 AHC4020AHC4040AHC4060A
Dual 4Stage Binary Ripple Counter14Stage Binary Ripple Counter12Stage Binary Ripple Counter14Stage Binary Ripple Counter with Oscillator
LS393
*4520402040404060
LSCMOSCMOSCMOS
14161616
*Suggested alternative
HC Devices Have CMOSCompatible Inputs.
Device
HC161A
HC163A
HC390A
HC393A
HC4020A
HC4040A
HC4060A
# Pins
16
16
16
14
16
16
16
Single DeviceDual Device
D
D
D
D
D
D
D
Ripple CounterNumber of Ripple Counter Internal StagesNumber of Stages with Available Outputs
D
44
D
44
D
1412
D
1212
D
1410
Count Up
D
D
D
D
D
D
D
4Bit Binary CounterBCD CounterDecimal Counter
D
D
D
D
Separate 2 SectionSeparate 5 Section
D
D
OnChip Oscillator Capability
D
PositiveTransition ClockingNegativeTransition ClockingActiveHigh Clock EnableActiveLow Clock Enable
D
D
D
D
D
D
D
ActiveHigh Count Enable
DD
DD
ActiveHigh Reset
D
D
D
D
D
D
D
4Bit Binary Preset Data Inputs
BCD Preset Data InputsActiveLow Load Preset
D
D
D
D
Carry Output
D
D
DD implies the device has two such enables
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MISCELLANEOUS DEVICES
DeviceNumber
MC74
Function
FunctionalEquivalent
LSTTLDevice
74
FunctionalEquivalent
CMOSDevice
MC1XXXXor CDXXXX
Direct PinCompatibility
Numberof
Pins
HC4046AHC4538A
PhaseLocked LoopDual Precision Monostable Multivibrator
(Retriggerable, Resettable)
40464538,4528
CMOSCMOS
1616
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CHAPTER 2Data Sheets
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Semiconductor Components Industries, LLC, 2004
December, 2004 Rev. 9
27 Publication Order Number:
MC74HC00A/D
MC74HC00A
Quad 2Input NAND GateHighPerformance SiliconGate CMOS
The MC74HC00A is identical in pinout to the LS00. The deviceinputs are compatible with Standard CMOS outputs; with pullupresistors, they are compatible with LSTTL outputs.
Features
PbFree Packages are Available* Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS and TTL Operating Voltage Range: 2 to 6 V Low Input Current: 1 mA High Noise Immunity Characteristic of CMOS Devices In Compliance With the JEDEC Standard No. 7 A Requirements Chip Complexity: 32 FETs or 8 Equivalent Gates
3 Y1
1 A1
PIN 14 = VCCPIN 7 = GND
LOGIC DIAGRAM
2B1
6 Y2
4 A2
5B2
8 Y3
9 A3
10B3
11 Y4
12 A4
13B4
Y = AB
Pinout: 14Lead Packages (Top View)
1314 12 11 10 9 8
21 3 4 5 6 7
VCC B4 A4 Y4 B3 A3 Y3
A1 B1 Y1 A2 B2 Y2 GND
*For additional information on our PbFree strategy and soldering details, pleasedownload the ON Semiconductor Soldering and Mounting TechniquesReference Manual, SOLDERRM/D.
MARKINGDIAGRAMS
A = Assembly LocationWL or L = Wafer LotYY or Y = YearWW or W = Work Week
TSSOP14DT SUFFIXCASE 948G
HC00A
ALYW
1
14
1
14PDIP14
N SUFFIXCASE 646
MC74HC00ANAWLYYWW
SOIC14
D SUFFIXCASE 751A
1
14
HC00AAWLYWW
LLHH
LHLH
FUNCTION TABLE
Inputs Output
A B
HHHL
Y
See detailed ordering and shipping information in the packagedimensions section on pag e 28 of this data sheet.
ORDERING INFORMATION
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MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
0.5 to V CC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
0.5 to V CC + 0.5
V
Iin
DC Input Current, per Pin
20
mA
Iout
DC Output Current, per Pin
25
mA
ICC
DC Supply Current, V CC and GND Pins
50
mA
P D
Power Dissipation in Still Air, Plastic DIPSOIC Package
TSSOP Package
750500450
mW
Tstg
Storage Temperature
65 to + 150
C
TL
Lead Temperature, 1 mm from Case for 10 SecondsPlastic DIP, SOIC or TSSOP Package
260
C
Maximum ratings are those values beyond which device damage can occur. Maximum ratingsapplied to the device are individual stress limit values (not normal operating conditions) and arenot valid simultaneously. If these limits are exceeded, device functional operation is not implied,damage may occur and reliability may be affected.
Derating Plastic DIP: 10 mW/ C from 65 to 125 CSOIC Package: 7 mW/ C from 65 to 125 CTSSOP Package: 6.1 mW/ C from 65 to 125 C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, Vout
DC Input Voltage, Output Voltage (Referenced to GND)
0
VCC
V
TA
Operating Temperature, All Package Types
55
+ 125
C
tr, tf
Input Rise and Fall Time V CC = 2.0 V(Figure 1) V CC = 4.5 V
VCC = 6.0 V
000
1000500400
ns
ORDERING INFORMATION
Device Package Shipping
MC74HC00AN PDIP14 2000 Units / Box
MC74HC00ANG PDIP14(PbFree)
2000 Units / Box
MC74HC00AD SOIC14 55 Units / Rail
MC74HC00ADG SOIC14(PbFree)
55 Units / Rail
MC74HC00ADR2 SOIC14 2500 Units / Reel
MC74HC00ADR2G SOIC14(PbFree) 2500 Units / Reel
MC74HC00ADT TSSOP14* 96 Units / Rail
MC74HC00ADTR2 TSSOP14* 2500 Units / Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.
*This package is inherently PbFree.
This device contains protectioncircuitry to guard against damagedue to high static voltages or electricfields. However, precautions mustbe taken to avoid applications of anyvoltage higher than maximum ratedvoltages to this highimpedance cir-cuit. For proper operation, V in andVout should be constrained to therange GND v (Vin or Vout ) v VCC .
Unused inputs must always betied to an appropriate logic voltagelevel (e.g., either GND or V CC ).Unused outputs must be left open.
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DC CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol Parameter ConditionCCV 55 to 25 C 85 C 125 C Unit
VIH Minimum HighLevel InputVoltage
Vout = 0.1V or V CC 0.1V|Iout | 20 mA
2.03.04.56.0
1.502.103.154.20
1.502.103.154.20
1.502.103.154.20
V
VIL Maximum LowLevel InputVoltage
Vout = 0.1V or V CC 0.1V|Iout | 20 mA
2.03.04.56.0
0.500.901.351.80
0.500.901.351.80
0.500.901.351.80
V
VOH Minimum HighLevel OutputVoltage
Vin = VIH or VIL|Iout | 20 mA
2.04.56.0
1.94.45.9
1.94.45.9
1.94.45.9
V
Vin =VIH or VIL |Iout | 2.4mA|Iout | 4.0mA|Iout | 5.2mA
3.04.56.0
2.483.985.48
2.343.845.34
2.203.705.20
VOL Maximum LowLevel OutputVoltage
Vin = VIH or VIL|Iout | 20 mA
2.04.56.0
0.10.10.1
0.10.10.1
0.10.10.1
V
Vin = VIH or VIL |Iout | 2.4mA|Iout | 4.0mA|Iout | 5.2mA
3.04.56.0
0.260.260.26
0.330.330.33
0.400.400.40
Iin Maximum Input LeakageCurrent
Vin = VCC or GND 6.0 0.1 1.0 1.0 mA
ICC Maximum Quiescent SupplyCurrent (per Package)
Vin = VCC or GNDIout = 0 mA
6.0 1.0 10 40 mA
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book(DL129/D).
AC CHARACTERISTICS (CL = 50 pF, Input t r = tf = 6 ns)
VGuaranteed Limit
Symbol ParameterCCV 55 to 25 C 85 C 125 C Unit
tPLH ,tPHL
Maximum Propagation Delay, Input A or B to Output Y(Figures 1 and 2)
2.03.04.56.0
75301513
95401916
110552219
ns
tTLH,tTHL
Maximum Output Transition Time, Any Output(Figures 1 and 2)
2.03.04.56.0
75271513
95321916
110362219
ns
Cin Maximum Input Capacitance 10 10 10 pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ONSemiconductor HighSpeed CMOS Data Book (DL129/D).
Typical @ 25 C, V CC = 5.0 V, V EE = 0 VCPD Power Dissipation Capacitance (Per Buffer)* 22 pF
* Used to determine the noload dynamic power consumption: P D = CPD VCC 2f + ICC VCC . For load considerations, see Chapter 2 of theON Semiconductor HighSpeed CMOS Data Book (DL129/D).
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Figure 1. Switching Waveforms
GND
VCC
OUTPUT Y
INPUT A OR B
CL *
*Includes all probe and jig capacitance
TESTPOINT
90%
50%10%
tTLH
DEVICEUNDERTEST
OUTPUT
Figure 2. Test Circuit
Y A
B
Figure 3. Expanded Logic Diagram(1/4 of the Device)
tTHL
90%50%
10%
tPLH tPHL
tf tr
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Semiconductor Components Industries, LLC, 2004
December, 2004 Rev. 9
31 Publication Order Number:
MC74HC02A/D
MC74HC02A
Quad 2Input NOR GateHighPerformance SiliconGate CMOS
The MC74HC02A is identical in pinout to the LS02. The deviceinputs are compatible with standard CMOS outputs; with pullupresistors, they are compatible with LSTTL outputs.
Features
PbFree Packages are Available* Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 mA High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard
No. 7.0 A Chip Complexity: 40 FETs or 10 Equivalent Gates
LOGIC DIAGRAM
1 Y1
2 A1
PIN 14 = VCCPIN 7 = GND
3B1
Y4
Y = A + B
4 Y2
5 A2
6B2
10 Y3
8 A3
9B3
1311
A412
B4
PIN ASSIGNMENT
11
12
13
14
8
9
105
4
3
2
1
7
6
Y3
A4
B4
Y4
VCC
A3
B3
Y2
B1
A1
Y1
GND
B2
A2
*For additional information on our PbFree strategy and soldering details, pleasedownload the ON Semiconductor Soldering and Mounting TechniquesReference Manual, SOLDERRM/D.
MARKINGDIAGRAMS
A = Assembly LocationWL or L = Wafer LotYY or Y = YearWW or W = Work Week
TSSOP14DT SUFFIXCASE 948G
HC02A
ALYW
1
14
1
14PDIP14
N SUFFIXCASE 646
MC74HC02ANAWLYYWW
SOIC14D SUFFIX
CASE 751A1
14
HC02A
AWLYWW
FUNCTION TABLE
A
LLHH
Inputs Output
B
LHLH
Y
HLLL
See detailed ordering and shipping information in the packagedimensions section on pag e 34 of this data sheet.
ORDERING INFORMATION
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MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
0.5 to V CC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
0.5 to V CC + 0.5
V
Iin
DC Input Current, per Pin
20
mA
Iout
DC Output Current, per Pin
25
mA
ICC
DC Supply Current, V CC and GND Pins
50
mA
P D
Power Dissipation in Still Air, Plastic DIPSOIC Package
TSSOP Package
750500450
mW
Tstg
Storage Temperature
65 to + 150
C
TL
Lead Temperature, 1 mm from Case for 10 SecondsPlastic DIP, SOIC or TSSOP Package
260
C
Maximum ratings are those values beyond which device damage can occur. Maximum ratingsapplied to the device are individual stress limit values (not normal operating conditions) and arenot valid simultaneously. If these limits are exceeded, device functional operation is not implied,damage may occur and reliability may be affected.
Derating Plastic DIP: 10 mW/ C from 65 to 125 CSOIC Package: 7 mW/ C from 65 to 125 CTSSOP Package: 6.1 mW/ C from 65 to 125 C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, Vout
DC Input Voltage, Output Voltage (Referenced to GND)
0
VCC
V
TA
Operating Temperature, All Package Types
55
+ 125
C
tr, tf
Input Rise and Fall Time V CC = 2.0 V(Figure 1) V CC = 4.5 V
VCC = 6.0 V
000
1000500400
ns
This device contains protectioncircuitry to guard against damagedue to high static voltages or electricfields. However, precautions mustbe taken to avoid applications of anyvoltage higher than maximum ratedvoltages to this highimpedance cir-cuit. For proper operation, V in andVout should be constrained to therange GND v (Vin or Vout ) v VCC .
Unused inputs must always betied to an appropriate logic voltagelevel (e.g., either GND or V CC ).Unused outputs must be left open.
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DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
VCCV
55 to25 C
v 85 C
v 125 C
Unit
VIH
Minimum HighLevel InputVoltage
Vout = 0.1 V or V CC 0.1 V|Iout | v 20 mA
2.03.04.56.0
1.52.1
3.154.2
1.52.1
3.154.2
1.52.1
3.154.2
V
VIL
Maximum LowLevel InputVoltage
Vout = 0.1 V or V CC 0.1 V|Iout | v 20 mA
2.03.04.56.0
0.50.9
1.351.8
0.50.9
1.351.8
0.50.9
1.351.8
V
VOH
Minimum HighLevel OutputVoltage
Vin = VIH or VIL|Iout | v 20 mA
2.04.56.0
1.94.45.9
1.94.45.9
1.94.45.9
V
Vin = VIH or VIL |Iout | v 2.4 mA|Iout | v 4.0 mA|Iout | v 5.2 mA
3.04.56.0
2.483.985.48
2.343.845.34
2.203.75.2
VOL
Maximum LowLevel OutputVoltage
Vin = VIH or VIL|Iout | v 20 mA
2.04.56.0
0.10.10.1
0.10.10.1
0.10.10.1
V
Vin = VIH or VIL |Iout | v 2.4 mA|Iout | v 4.0 mA|Iout | v 5.2 mA
3.04.56.0
0.260.260.26
0.330.330.33
0.40.40.4
Iin
Maximum Input LeakageCurrent
Vin = VCC or GND
6.0
0.1
1.0
1.0
mA
ICC
Maximum Quiescent SupplyCurrent (per Package)
Vin = VCC or GND|Iout | = 0 mA
6.0
1.0
10
40
mA
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book(DL129/D).
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input t r = tf = 6.0 ns)
Guaranteed Limit
Symbol
Parameter
VCCV
55 to25 C
v 85 C
v 125 C
Unit
tPLH ,tPHL
Maximum Propagation Delay, Input A or B to Output Y(Figures 1 and 2)
2.03.04.56.0
75301513
95401916
110552219
ns
tTLH,tTHL
Maximum Output Transition Time, Any Output(Figures 1 and 2)
2.03.04.56.0
75301513
95401916
110552219
ns
Cin
Maximum Input Capacitance
10
10
10
pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ONSemiconductor HighSpeed CMOS Data Book (DL129/D).
Typical @ 25 C, V CC = 5.0 V
CPD Power Dissipation Capacitance (Per Gate)* 22 pF
* Used to determine the noload dynamic power consumption: P D = CPD VCC 2f + ICC VCC . For load considerations, see Chapter 2 of theON Semiconductor HighSpeed CMOS Data Book (DL129/D).
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MC74HC02A
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ORDERING INFORMATION
Device Package Shipping
MC74HC02AN PDIP14 2000 Units / Box
MC74HC02ANG PDIP14(PbFree)
2000 Units / Box
MC74HC02AD SOIC14 55 Units / Rail
MC74HC02ADG SOIC14(PbFree)
55 Units / Rail
MC74HC02ADR2 SOIC14 2500 Units / Reel
MC74HC02ADR2G SOIC14(PbFree)
2500 Units / Reel
MC74HC02ADT TSSOP14* 96 Units / Rail
MC74HC02ADTR2 TSSOP14* 2500 Units / Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.
*This package is inherently PbFree.
Figure 1. Switching Waveforms
tf trVCC
GND
90%50%10%
90%50%
10%
INPUT A OR B
OUTPUT Y
tPHL tPLH
tTLH tTHL *Includes all probe and jig capacitance
Figure 2. Test Circuit
CL *
TEST POINT
DEVICEUNDERTEST
OUTPUT
EXPANDED LOGIC DIAGRAM(1/4 OF THE DEVICE)
Y
A
B
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Semiconductor Components Industries, LLC, 2000
March, 2000 Rev. 8
35 Publication Order Number:
MC74HC03A/D
MC74HC03A
Quad 2Input NAND Gatewith OpenDrain OutputsHighPerformance SiliconGate CMOS
The MC74HC03A is identical in pinout to the LS03. The deviceinputs are compatible with Standard CMOS outputs; with pullupresistors, they are compatible with LSTTL outputs.
The HC03A NAND gate has, as its outputs, a highperformanceMOS NChannel transistor. This NAND gate can, therefore, with asuitable pullup resistor, be used in wiredAND applications. Havingthe output characteristic curves given in this data sheet, this device canbe used as an LED driver or in any other application that only requiresa sinking current. Output Drive Capability: 10 LSTTL Loads With Suitable Pullup
Resistor Outputs Directly Interface to CMOS, NMOS and TTL High Noise Immunity Characteristic of CMOS Devices Operating Voltage Range: 2 to 6V Low Input Current: 1 A In Compliance With the JEDEC Standard No. 7A Requirements Chip Complexity: 28 FETs or 7 Equivalent GatesDESIGN GUIDE
Criteria Value Unit
Internal Gate Count* 7.0 ea
Internal Gate Propagation Delay 1.5 ns
Internal Gate Power Dissipation 5.0 W
Speed Power Product 0.0075 pJ
* Equivalent to a twoinput NAND gate
PIN 14 = VCCPIN 7 = GND* Denotes opendrain outputs
LOGIC DIAGRAM
3,6,8,11 Y*
1,4,9,12 A
2,5,10,13B
OUTPUTPROTECTION
DIODE
VCC
Pinout: 14Lead Packages (Top View)
1314 12 11 10 9 8
21 3 4 5 6 7
VCC B4 A4 Y4 B3 A3 Y3
A1 B1 Y1 A2 B2 Y2 GND
Device Package Shipping
ORDERING INFORMATION
MC74HC03AN PDIP14 2000 / Box
MC74HC03AD SOIC14
http://onsemi.com
55 / Rail
MC74HC03ADR2 SOIC14 2500 / Reel
MARKINGDIAGRAMS
A = Assembly LocationWL or L = Wafer LotYY or Y = YearWW or W = Work Week
MC74HC03ADT TSSOP14 96 / Rail
MC74HC03ADTR2 TSSOP14 2500 / Reel
TSSOP14DT SUFFIXCASE 948G
HC03A
ALYW
1
14
1
14PDIP14
N SUFFIXCASE 646
MC74HC03ANAWLYYWW
SOIC14D SUFFIX
CASE 751A
1
14
HC03AAWLYWW
LLHH
LHLH
FUNCTION TABLE
Inputs Output
A B
ZZZL
Y
Z = High Impedance
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MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
0.5 to V CC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
0.5 to V CC + 0.5
V
Iin
DC Input Current, per Pin
20
mA
Iout
DC Output Current, per Pin
25
mA
ICC
DC Supply Current, V CC and GND Pins
50
mA
P D
Power Dissipation in Still Air Plastic DIPSOIC Package
TSSOP Package
750500450
mW
Tstg
Storage Temperature
65 to + 150
C
TL
Lead Temperature, 1 mm from Case for 10 SecondsPlastic DIP, SOIC or TSSOP Package
260
C
*Maximum Ratings are those values beyond which damage to the device may occur.Functional operation should be restricted to the Recommended Operating Conditions.
Derating Plastic DIP: 10 mW/ C from 65 to 125 CSOIC Package: 7 mW/ C from 65 to 125 CTSSOP Package: 6.1 mW/ C from 65 to 125 C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, Vout
DC Input Voltage, Output Voltage (Referenced to GND)
0
VCC
V
TA
Operating Temperature, All Package Types
55
+ 125
C
tr, tf
Input Rise and Fall Time V CC = 2.0 V(Figure 1) V CC = 4.5 V
VCC = 6.0 V
000
1000500400
ns
DC CHARACTERISTICS (Voltages Referenced to GND)
V Guaranteed Limit
Symbol Parameter Condition V 55 to 25 C 85 C 125 C Unit
VIH Minimum HighLevel InputVoltage
Vout = 0.1V or V CC 0.1V|Iout | 20 A
2.03.04.56.0
1.502.103.154.20
1.502.103.154.20
1.502.103.154.20
V
VIL Maximum LowLevel InputVoltage
Vout = 0.1V or V CC 0.1V|Iout | 20 A
2.03.04.56.0
0.500.901.351.80
0.500.901.351.80
0.500.901.351.80
V
VOL Maximum LowLevel OutputVoltage
Vout = 0.1V or V CC 0.1V|Iout | 20 A
2.04.56.0
0.10.10.1
0.10.10.1
0.10.10.1
V
Vin = VIH or VIL |Iout | 2.4mA|Iout | 4.0mA|Iout | 5.2mA
3.04.56.0
0.260.260.26
0.330.330.33
0.400.400.40
Iin Maximum Input Leakage Current V in = VCC or GND 6.0 0.1 1.0 1.0 A
ICC Maximum Quiescent SupplyCurrent (per Package)
Vin = VCC or GNDIout = 0 A
6.0 1.0 10 40 A
IOZ Maximum ThreeState LeakageCurrent
Output in HighImpedance StateVin = VIL or VIHVout = VCC or GND
6.0 0.5 5.0 10 A
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
This device contains protectioncircuitry to guard against damagedue to high static voltages or electricfields. However, precautions mustbe taken to avoid applications of anyvoltage higher than maximum ratedvoltages to this highimpedance cir-cuit. For proper operation, V in andVout should be constrained to therange GND v (Vin or Vout ) v VCC .
Unused inputs must always betied to an appropriate logic voltagelevel (e.g., either GND or V CC ).Unused outputs must be left open.
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37
AC CHARACTERISTICS (CL = 50pF, Input t r = tf = 6ns)
Guaranteed Limit
Symbol ParameterCCV 55 to 25 C 85 C 125 C Unit
tPLZ,tPZL
Maximum Propagation Delay, Input A or B to Output Y(Figures 1 and 2)
2.03.04.56.0
120452420
150603026
180753631
ns
tTLH,tTHL
Maximum Output Transition Time, Any Output(Figures 1 and 2)
2.03.04.56.0
75271513
95321916
110362219
ns
Cin Maximum Input Capacitance 10 10 10 pF
Cout Maximum ThreeState Output Capacitance(Output in HighImpedance State)
10 10 10 pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ONSemiconductor HighSpeed CMOS Data Book (DL129/D).
Typical @ 25 C, V CC = 5.0 V, V EE = 0 V
CPD Power Dissipation Capacitance (Per Buffer)* 8.0 pF
* Used to determine the noload dynamic power consumption: P D = CPD VCC 2f + ICC VCC . For load considerations, see Chapter 2 of theON Semiconductor HighSpeed CMOS Data Book (DL129/D).
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Figure 1. Switching Waveforms
CL *
*Includes all probe and jig capacitance
TESTPOINTDEVICE
UNDERTEST
OUTPUT
Figure 2. Test Circuit
1k Rpd
VCC
INPUT A90%50%10%
tftr
GND
VCC
OUTPUT Y
tPZL
tTHL
HIGHIMPEDANCE
VOL 10%
tPLZ
90%50%10%
VO, OUTPUT VOLTAGE (VOLTS)0 1 2 3 4 5
0
5
10
15
20
25
I D , S
I N K C U R R E N T ( m A )
Figure 3. OpenDrain Output Characteristics
A1
B1
A2
B2
An
Bn
1/4HC03
1/4
HC03
1/4HC03
Y1
Y2
Yn
TYPICAL T=25C
T=25C
T=85C
T=125C
EXPECTED MINIMUM*
VCC =5V
*The expected minimum curves are not guarantees, but are design aids.
VCC
PULLUPRESISTOR
OUTPUT
OUTPUT = Y1 Y2 . . . Yn= A1B1 A2B2 . . . AnBn
Figure 4. Wired AND
LED11/4
HC03
LED2
LEDENABLE
VCC+
VR+
VF
1/4HC03
VCC
DESIGN EXAMPLECONDITIONS: I
D^ 10mA
USING FIGURE NO TAG TYPICAL CURVE, at ID=10mA, VDS^ 0.4V
N R +VCC * VF * VO
ID
+ 5V* 1.7V* 0.4V10mA
USE R = 270
+ 290W
Figure 5. LED Driver With Blanking
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Semiconductor Components Industries, LLC, 2004
November, 2004 Rev. 9
39 Publication Order Number:
MC74HC04A/D
MC74HC04A
Hex InverterHighPerformance SiliconGate CMOS
The MC74HC04A is identical in pinout to the LS04 and theMC14069. The device inputs are compatible with Standard CMOSoutputs; with pullup resistors, they are compatible with LSTTLoutputs.
The device consists of six threestage inverters.
Features Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS and TTL Operating Voltage Range: 2 to 6V Low Input Current: 1 mA High Noise Immunity Characteristic of CMOS Devices
In Compliance With the JEDEC Standard No. 7A Requirements Chip Complexity: 36 FETs or 9 Equivalent Gates PbFree Packages are Available*
LOGIC DIAGRAM
Y1 A1
A2
A3
A4
A5
A6
Y2
Y3
Y4
Y5
Y6
1
3
5
9
11
13
2
4
6
8
10
12
Y = A
Pinout: 14Lead Packages (Top View)
1314 12 11 10 9 8
21 3 4 5 6 7
VCC A6 Y6 A5 Y5 A4 Y4
A1 Y1 A2 Y2 A3 Y3 GND
*For additional information on our PbFree strategy and soldering details, pleasedownload the ON Semiconductor Soldering and Mounting TechniquesReference Manual, SOLDERRM/D.
MARKING DIAGRAMS
A = Assembly LocationWL or L = Wafer LotYY or Y = YearWW or W = Work Week
TSSOP14DT SUFFIXCASE 948G
HC04A
ALYW
1
14
PDIP14N SUFFIXCASE 646
SOIC14D SUFFIX
CASE 751A
LH
FUNCTION TABLEInputs Outputs
A
HL
Y
See detailed ordering and shipping information in the packagedimensions section on pag e 40 of this data sheet.
ORDERING INFORMATION
MC74HC04ANAWLYYWW
1
14
HC04A
AWLYWW
1
14
http://onsemi.com
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40
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
0.5 to V CC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
0.5 to V CC + 0.5
V
Iin
DC Input Current, per Pin
20
mA
Iout
DC Output Current, per Pin
25
mA
ICC
DC Supply Current, V CC and GND Pins
50
mA
P D
Power Dissipation in Still Air, Plastic DIPSOIC Package
TSSOP Package
750500450
mW
Tstg
Storage Temperature
65 to + 150
C
TL
Lead Temperature, 1 mm from Case for 10 SecondsPlastic DIP, SOIC or TSSOP Package
260
C
This device contains protection circuitry to guard against damage due to high static voltages or electric f ields. However, precautions mustbe taken to avoid applications of any voltage higher than maximum rated voltages to this highimpedance circuit. For proper operation,Vin and V out should be constrained to the range GND v (Vin or Vout ) v VCC . Unused inputs must always be tied to an appropriate logicvoltage level (e.g., either GND or V CC ). Unused outputs must be left open.
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limitvalues (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,damage may occur and reliability may be affected.Derating Plastic DIP: 10 mW/ C from 65 to 125 C
SOIC Package: 7 mW/ C from 65 to 125 CTSSOP Package: 6.1 mW/ C from 65 to 125 C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, Vout
DC Input Voltage, Output Voltage (Referenced to GND)
0
VCC
V
TA
Operating Temperature, All Package Types
55
+ 125
C
tr, tf
Input Rise and Fall Time V CC = 2.0 V(Figure 1) V CC = 4.5 VVCC = 6.0 V
000
1000500400
ns
ORDERING INFORMATION
Device Order Number Package Shipping
MC74HC04AN PDIP14 2000 / Box
MC74HC04ANG PDIP14(PbFree)
2000 / Box
MC74HC04AN SOIC14 55 / Rail
MC74HC04ADR2 SOIC14 2500 / Tape & Reel
MC74HC04ADR2G SOIC14(PbFree)
2500 / Tape & Reel
MC74HC04ADT TSSOP14*(PbFree)
96 / Rail
MC74HC04ADTR2 TSSOP14*(PbFree)
2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.
*This package is inherently PbFree.
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MC74HC04A
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41
DC CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol Parameter ConditionCCV 55 to 25 C 85 C 125 C Unit
VIH Minimum HighLevel InputVoltage
Vout = 0.1V or V CC 0.1V|Iout | 20 mA
2.03.04.56.0
1.502.103.154.20
1.502.103.154.20
1.502.103.154.20
V
VIL Maximum LowLevel InputVoltage
Vout = 0.1V or V CC 0.1V|Iout | 20 mA
2.03.04.56.0
0.500.901.351.80
0.500.901.351.80
0.500.901.351.80
V
VOH Minimum HighLevel OutputVoltage
Vin = VIH or VIL|Iout | 20 mA
2.04.56.0
1.94.45.9
1.94.45.9
1.94.45.9
V
Vin =VIH or VIL |Iout | 2.4mA|Iout | 4.0mA|Iout | 5.2mA
3.04.56.0
2.483.985.48
2.343.845.34
2.203.705.20
VOL Maximum LowLevel OutputVoltage
Vin = VIH or VIL|Iout | 20 mA
2.04.56.0
0.10.10.1
0.10.10.1
0.10.10.1
V
Vin = VIH or VIL |Iout | 2.4mA|Iout | 4.0mA|Iout | 5.2mA
3.04.56.0
0.260.260.26
0.330.330.33
0.400.400.40
Iin Maximum Input LeakageCurrent
Vin = VCC or GND 6.0 0.1 1.0 1.0 mA
ICC Maximum Quiescent SupplyCurrent (per Package)
Vin = VCC or GNDIout = 0 mA
6.0 1.0 10 40 mA
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
AC CHARACTERISTICS (CL = 50pF, Input t r = tf = 6ns)
Guaranteed Limit
Symbol ParameterCCV 55 to 25 C 85 C 125 C Unit
tPLH ,tPHL
Maximum Propagation Delay, Input A or B to Output Y(Figures 1 and 2)
2.03.04.56.0
75301513
95401916
110552219
ns
tTLH,tTHL
Maximum Output Transition Time, Any Output(Figures 1 and 2)
2.03.04.56.0
75271513
95321916
110362219
ns
Cin Maximum Input Capacitance 10 10 10 pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ONSemiconductor HighSpeed CMOS Data Book (DL129/D).
Typical @ 25 C, VCC = 5.0 V
CPD Power Dissipation Capacitance (Per Inverter)* 20 pF
* Used to determine the noload dynamic power consumption: P D = C PD VCC 2f + ICC VCC . For load considerations, see Chapter 2 of theON Semiconductor HighSpeed CMOS Data Book (DL129/D).
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42
Figure 1. Switching Waveforms
GND
VCC
OUTPUT Y
INPUT A
CL *
*Includes all probe and jig capacitance
TESTPOINT
90%
50%10%
tTLH
DEVICEUNDERTEST
OUTPUT
Figure 2. Test Circuit
Y A
Figure 3. Expanded Logic Diagram(1/6 of the Device Shown)
tTHL
90%50%
10%
tPLH tPHL
tf tr
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Semiconductor Components Industries, LLC, 2000
March, 2000 Rev. 8
43 Publication Order Number:
MC74HC08A/D
MC74HC08A
Quad 2Input AND GateHighPerformance SiliconGate CMOS
The MC74HC08A is identical in pinout to the LS08. The deviceinputs are compatible with Standard CMOS outputs; with pullupresistors, they are compatible with LSTTL outputs.
Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS and TTL Operating Voltage Range: 2 to 6V Low Input Current: 1 A High Noise Immunity Characteristic of CMOS Devices In Compliance With the JEDEC Standard No. 7A Requirements Chip Complexity: 24 FETs or 6 Equivalent Gates
3 Y1
1 A1
PIN 14 = VCCPIN 7 = GND
LOGIC DIAGRAM
2B1
6 Y2
4 A2
5B2
8 Y3
9 A3
10B3
11 Y4
12 A4
13B4
Y = AB
Pinout: 14Lead Packages (Top View)
1314 12 11 10 9 8
21 3 4 5 6 7
VCC B4 A4 Y4 B3 A3 Y3
A1 B1 Y1 A2 B2 Y2 GND
Device Package Shipping
ORDERING INFORMATION
MC74HC08AN PDIP14 2000 / Box
MC74HC08AD SOIC14
http://onsemi.com
55 / Rail
MC74HC08ADR2 SOIC14 2500 / Reel
MARKINGDIAGRAMS
A = Assembly LocationWL or L = Wafer LotYY or Y = YearWW or W = Work Week
MC74HC08ADT TSSOP14 96 / Rail
MC74HC08ADTR2 TSSOP14 2500 / Reel
TSSOP14DT SUFFIXCASE 948G
HC08A
ALYW
1
14
1
14PDIP14
N SUFFIXCASE 646
MC74HC08ANAWLYYWW
SOIC14D SUFFIX
CASE 751A1
14
HC08AAWLYWW
LLHH
LHLH
FUNCTION TABLE
Inputs Output
A B
LLLH
Y
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44
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
0.5 to V CC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
0.5 to V CC + 0.5
V
Iin
DC Input Current, per Pin
20
mA
Iout
DC Output Current, per Pin
25
mA
ICC
DC Supply Current, V CC and GND Pins
50
mA
P D
Power Dissipation in Still Air, Plastic DIPSOIC Package
TSSOP Package
750500450
mW
Tstg
Storage Temperature
65 to + 150
C
TL
Lead Temperature, 1 mm from Case for 10 SecondsPlastic DIP, SOIC or TSSOP Package
260
C
*Maximum Ratings are those values beyond which damage to the device may occur.Functional operation should be restricted to the Recommended Operating Conditions.
Derating Plastic DIP: 10 mW/ C from 65 to 125 CSOIC Package: 7 mW/ C from 65 to 125 CTSSOP Package: 6.1 mW/ C from 65 to 125 C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, Vout
DC Input Voltage, Output Voltage (Referenced to GND)
0
VCC
V
TA
Operating Temperature, All Package Types
55
+ 125
C
tr, tf
Input Rise and Fall Time V CC = 2.0 V(Figure 1) V CC = 4.5 V
VCC = 6.0 V
000
1000500400
ns
This device contains protectioncircuitry to guard against damagedue to high static voltages or electricfields. However, precautions mustbe taken to avoid applications of anyvoltage higher than maximum ratedvoltages to this highimpedance cir-cuit. For proper operation, V in andVout should be constrained to therange GND v (Vin or Vout ) v VCC .
Unused inputs must always betied to an appropriate logic voltagelevel (e.g., either GND or V CC ).Unused outputs must be left open.
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MC74HC08A
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45
DC CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol Parameter ConditionCCV 55 to 25 C 85 C 125 C Unit
VIH Minimum HighLevel InputVoltage
Vout = 0.1V or V CC 0.1V|Iout | 20 A
2.03.04.56.0
1.502.103.154.20
1.502.103.154.20
1.502.103.154.20
V
VIL Maximum LowLevel InputVoltage
Vout = 0.1V or V CC 0.1V|Iout | 20 A
2.03.04.56.0
0.500.901.351.80
0.500.901.351.80
0.500.901.351.80
V
VOH Minimum HighLevel OutputVoltage
Vin = VIH or VIL|Iout | 20 A
2.04.56.0
1.94.45.9
1.94.45.9
1.94.45.9
V
Vin =VIH or VIL |Iout | 2.4mA|Iout | 4.0mA|Iout | 5.2mA
3.04.56.0
2.483.985.48
2.343.845.34
2.203.705.20
VOL Maximum LowLevel OutputVoltage
Vin = VIH or VIL|Iout | 20 A
2.04.56.0
0.10.10.1
0.10.10.1
0.10.10.1
V
Vin = VIH or VIL |Iout | 2.4mA|Iout | 4.0mA|Iout | 5.2mA
3.04.56.0
0.260.260.26
0.330.330.33
0.400.400.40
Iin Maximum Input LeakageCurrent
Vin = VCC or GND 6.0 0.1 1.0 1.0 A
ICC Maximum Quiescent SupplyCurrent (per Package)
Vin = VCC or GNDIout = 0 A
6.0 1.0 10 40 A
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
AC CHARACTERISTICS (CL = 50pF, Input t r = tf = 6ns)
Guaranteed Limit
Symbol ParameterCCV 55 to 25 C 85 C 125 C Unit
tPLH ,tPHL
Maximum Propagation Delay, Input A or B to Output Y(Figures 1 and 2)
2.03.04.56.0
75301513
95401916
110552219
ns
tTLH,tTHL
Maximum Output Transition Time, Any Output(Figures 1 and 2)
2.03.04.56.0
75271513
95321916
110362219
ns
Cin Maximum Input Capacitance 10 10 10 pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ONSemiconductor HighSpeed CMOS Data Book (DL129/D).
Typical @ 25 C, V CC = 5.0 V, V EE = 0 V
CPD Power Dissipation Capacitance (Per Buffer)* 20 pF
* Used to determine the noload dynamic power consumption: P D = C PD VCC 2f + ICC VCC . For load considerations, see Chapter 2 of theON Semiconductor HighSpeed CMOS Data Book (DL129/D).
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Figure 1. Switching Waveforms
OUTPUT Y
INPUT A OR B
CL *
*Includes all probe and jig capacitance
TESTPOINT
90%
50%10%
tTLH
DEVICEUNDERTEST
OUTPUT
Figure 2. Test Circuit
Y A
B
Figure 3. Expanded Logic Diagram(1/4 of the Device)
tTHL
tPLH tPHL
tr tf
GND
VCC90%50%
10%
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Semiconductor Components Industries, LLC, 2000
March, 2000 Rev. 9
47 Publication Order Number:
MC74HC125A/D
MC74HC125A,MC74HC126A
Quad 3State NoninvertingBuffersHighPerformance SiliconGate CMOS
The MC74HC125A and MC74HC126A are identical in pinout tothe LS125 and LS126. The device inputs are compatible with standardCMOS outputs; with pullup resistors, they are compatible withLSTTL outputs.
The HC125A and HC126A noninverting buffers are designed to beused with 3state memory address drivers, clock drivers, and otherbusoriented systems. The devices have four separate output enablesthat are activelow (HC125A) or activehigh (HC126A).
Output Drive Capability: 15 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 A High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard
No. 7A Chip Complexity: 72 FETs or 18 Equivalent Gates
LOGIC DIAGRAMHC125A
ActiveLow Output EnablesHC126A
ActiveHigh Output Enables
Y1
Y2
Y4
3
6
8
11
13
12
10
9
4
5
1
2 A1
OE1
A2
OE2
A3
OE3
A4
OE4
PIN 14 = VCCPIN 7 = GND
A1
OE1
A2
OE2
A3
OE3
A4
OE4
Y3
Y1
Y2
Y4
Y3
13
12
10
9
4
5
1
2 3
6
8
11
FUNCTION TABLE
HC125AInputs Output
A OE Y
H L HL L LX H Z
HC126AInputs Output
A OE Y
H H HL H LX L Z
Device Package Shipping
ORDERING INFORMATION
MC74HC12xAN PDIP14 2000 / Box
MC74HC12xAD SOIC14
http://onsemi.com
55 / Rail
MC74HC12xADR2 SOIC14 2500 / Reel
MARKINGDIAGRAMS
A = Assembly LocationWL or L = Wafer LotYY or Y = YearWW or W = Work Week
MC74HC12xADT TSSOP14 96 / Rail
MC74HC12xADTR2 TSSOP14 2500 / Reel
TSSOP14DT SUFFIXCASE 948G
HC12xAALYW
1
14
1
14PDIP14
N SUFFIXCASE 646
MC74HC12xANAWLYYWW
SOIC14D SUFFIX
CASE 751A
1
14
HC12xA
AWLYWW
PIN ASSIGNMENT
11
12
13
14
8
9
105
4
3
2
1
7
6
OE3
Y4
A4
OE4
VCC
Y3
A3
OE2
Y1
A1
OE1
GND
Y2
A2
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MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
0.5 to V CC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
0.5 to V CC + 0.5
V
Iin
DC Input Current, per Pin
20
mA
Iout
DC Output Current, per Pin
35
mA
ICC
DC Supply Current, V CC and GND Pins
75
mA
P D
Power Dissipation in Still Air Plastic DIPSOIC Package
TSSOP Package
750500450
mW
Tstg
Storage Temperature
65 to + 150
C
TL
Lead Temperature, 1 mm from Case for 10 Seconds(Plastic DIP, SOIC or TSSOP Package)
260
C
*Maximum Ratings are those values beyond which damage to the device may occur.Functional operation should be restricted to the Recommended Operating Conditions.
Derating Plastic DIP: 10 mW/ C from 65 to 125 CSOIC Package: 7 mW/ C from 65 to 125 CTSSOP Package: 6.1 mW/ C from 65 to 125 C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, Vout
DC Input Voltage, Output Voltage(Referenced to GND)
0
VCC
V
TA
Operating Temperature, All Package Types
55
+ 125
C
tr, tf
Input Rise and Fall Time V CC = 2.0 V(Figure 1) V CC = 4.5 V
VCC = 6.0 V
000
1000500400
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
VCCV
55 to25 C
v 85 C
v 125 C
Unit
VIH
Minimum HighLevel InputVoltage
Vout = VCC 0.1 V|Iout | v 20 A
2.03.04.56.0
1.52.1
3.154.2
1.52.1
3.154.2
1.52.1
3.154.2
V
VIL
Maximum LowLevel InputVoltage
Vout = 0.1 V|Iout | v 20 A
2.03.04.56.0
0.50.9
1.351.8
0.50.9
1.351.8
0.50.9
1.351.8
V
VOH
Minimum HighLevel OutputVoltage
Vin = VIH|Iout | v 20 A
2.04.56.0
1.94.45.9
1.94.45.9
1.94.45.9
V
Vin = VIH |Iout | v 3.6 mA
|Iout | v 6.0 mA|Iout | v 7.8 mA
3.0
4.56.0
2.48
3.985.48
2.34
3.845.34
2.2
3.75.2
VOL
Maximum LowLevel OutputVoltage
Vin = VIL|Iout | v 20 A
2.04.56.0
0.10.10.1
0.10.10.1
0.10.10.1
V
Vin = VIL |Iout | v 3.6 mA|Iout | v 6.0 mA|Iout | v 7.8 mA
3.04.56.0
0.260.260.26
0.330.330.33
0.40.40.4
This device contains protectioncircuitry to guard against damagedue to high static voltages or electricfields. However, precautions mustbe taken to avoid applications of anyvoltage higher than maximum ratedvoltages to this highimpedance cir-cuit. For proper operation, V in andVout should be constrained to therange GND v (Vin or Vout ) v VCC .
Unused inputs must always betied to an appropriate logic voltagelevel (e.g., either GND or V CC ).Unused outputs must be left open.
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SWITCHING WAVEFORMS
Figure 1.
Figure 2.
OUTPUT Y
50%
50%
50%
50%90%
10%
VCC
VCC
GND
GND
HIGHIMPEDANCE
VOL
VOH
OUTPUT Y
OUTPUT Y