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    1

    HighSpeed CMOS Data

    DL129/DRev. 8, January2005

    SCILLC, 2005Previous Edition 2000All Rights Reserved

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    ON Semiconductor and are registered trademarks of Semiconductor Components Industries , LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any

    liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidentaldamages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary overtime. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license underits patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or deathmay occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim ofpersonal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

    PUBLICATION ORDERING INFORMATIONN. American Technical Support : 8002829855 Toll FreeUSA/Canada

    Japan : ON Semiconductor, Japan Customer Focus Center291 Kamimeguro, Meguroku, Tokyo, Japan 1530051Phone : 81357733850

    DL129/D

    LITERATURE FULFILLMENT :Literature Distribution Center for ON SemiconductorP.O. Box 5163, Denver, Colorado 80217 USAPhone : 3036752175 or 8003443860 Toll Free USA/CanadaFax : 3036752176 or 8003443867 Toll Free USA/CanadaEmail : [email protected]

    ON Semiconductor Website : http://onsemi.com

    Order Literature : http://www.onsemi.com/litorder

    For additional information, please contact yourlocal Sales Representative.

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    Table of Contents

    Page

    Numeric Data Sheet ListingNumeric Data Sheet Listing 4. . . . . . . . . . . . . . . . . . . . . . . . .

    Chapter 1: Selector GuideBuffers/Inverters 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Gates 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Schmitt Triggers 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Bus Transceivers 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Latches 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .FlipFlops 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Digital Data Selectors/Multiplexers 19. . . . . . . . . . . . . . . . . .Decoders/Demultiplexers/Display Drivers 20. . . . . . . . . . . .Analog Switches/Multiplexers/ Demultiplexers 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    Shift Registers 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Counters 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Miscellaneous 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    Page

    Chapter 2: Data SheetsData Sheets 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    Chapter 3: Case Outlines and PackageDimensionsCase Outlines and Package Dimensions 388. . . . . . . . . . . .

    Chapter 4: IndexHighSpeed CMOS Device Index 406. . . . . . . . . . . . . . . . . .

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    Numeric Data Sheet Listing

    Data Sheet Function Page

    MC74HC00A Quad 2Input NAND Gate HighPerformance SiliconGate CMOS 27. . . . . . . . . . . . .

    MC74HC02A Quad 2Input NOR Gate HighPerformance SiliconGate CMOS 31. . . . . . . . . . . . . .

    MC74HC03A Quad 2Input NAND Gate with OpenDrain Outputs HighPerformanceSiliconGate CMOS 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC04A Hex Inverter HighPerformance SiliconGate CMOS 39. . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC08A Quad 2Input AND Gate HighPerformance SiliconGate CMOS 43. . . . . . . . . . . . . .

    MC74HC125A,MC74HC126A Quad 3State Noninverting Buffers HighPerformance SiliconGate CMOS 47 . . . . .

    MC74HC132A Quad 2Input NAND Gate with SchmittTrigger Inputs HighPerformanceSiliconGate CMOS 51. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC138A 1of8 Decoder/ Demultiplexer HighPerformance SiliconGate CMOS 58. . . . . . . .

    MC74HC139A Dual 1of4 Decoder/Demultiplexer HighPerformance SiliconGate CMOS 63 . . . .

    MC74HC14A Hex SchmittTrigger Inverter HighPerformance SiliconGate CMOS 69. . . . . . . . . .

    MC74HC157A Quad 2Input Data Selectors / Multiplexers HighPerformance SiliconGateCMOS 74. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC161A,MC74HC163A Presettable Counters HighPerformance SiliconGate CMOS 79. . . . . . . . . . . . . . . . .

    MC74HC164A 8Bit SerialInput/ParallelOutput Shift Register HighPerformanceSiliconGate CMOS 92. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC174A Hex D FlipFlop with Common Clock and Reset HighPerformance SiliconGate CMOS 98. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC175A Quad D FlipFlop with Common Clock and Reset HighPerformanceSiliconGate CMOS 104. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC1G00 Single 2Input NAND Gate 110. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC1G02 Single 2Input NOR Gate 114. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC1G04 Single Inverter 118. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC1G08 Single 2Input AND Gate 122. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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    Data Sheet Function Page

    MC74HC1G14 Single Inverter with SchmittTrigger Input 126. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC1G32 Single 2Input OR Gate 130. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC1GU04 Single Unbuffered Inverter 134. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC240A Octal 3State Inverting Buffer/Line Driver/Line Receiver HighPerformanceSiliconGate CMOS 138. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC244A Octal 3State Noninverting Buffer/Line Driver/Line Receiver HighPerformanceSiliconGate CMOS 143. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC245A Octal 3State Noninverting Bus Transceiver HighPerformance SiliconGateCMOS 148. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC273A Octal D FlipFlop with Common Clock and Reset HighPerformance SiliconGate CMOS 154. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC32A Quad 2Input OR Gate HighPerformance SiliconGate CMOS 160. . . . . . . . . . . . . .

    MC74HC373A Octal 3State NonInverting Transparent Latch HighPerformance SiliconGate CMOs 164. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC374A Octal 3State NonInverting D FlipFlop HighPerformance SiliconGateCMOS 170. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC390A Dual 4Stage Binary Ripple Counter with 2 and 5 Sections HighPerformance SiliconGate CMOS 175. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC393A Dual 4Stage Binary Ripple Counter HighPerformance SiliconGate CMOS 181 . . .

    MC74HC4020A 14Stage Binary Ripple Counter HighPerformance SiliconGate CMOS 187. . . . . .

    MC74HC4040A 12Stage Binary Ripple Counter HighPerformance SiliconGate CMOS 193. . . . . .

    MC74HC4046A PhaseLocked Loop HighPerformance SiliconGate CMOS 199. . . . . . . . . . . . . . . .

    MC74HC4051A,MC74HC4052A,MC74HC4053A Analog Multiplexers / Demultiplexers HighPerformance SiliconGate CMOS 213 . . .

    MC74HC4060A 14Stage Binary Ripple Counter With Oscillator HighPerformance SiliconGateCMOS 226. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC4066A Quad Analog Switch/Multiplexer/Demultiplexer HighPerformance SiliconGateCMOS 235. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC4316A Quad Analog Switch/Multiplexer/Demultiplexer with Separate Analog and DigitalPower Supplies HighPerformance SiliconGate CMOS 246. . . . . . . . . . . . . . . . . . . . .

    MC74HC4538A Dual Precision Monostable Multivibrator (Retriggerable, Resettable) 257. . . . . . . . . . . . .

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    Data Sheet Function Page

    MC74HC4851A,MC74HC4852A Analog Multiplexers/Demultiplexers with Injection Current Effect

    Control Automotive Customized 270. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC540A Octal 3State Inverting Buffer/Line Driver/Line Receiver HighPerformanceSiliconGate CMOS 280. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC541A Octal 3State Noninverting Buffer/Line Driver/Line Receiver HighPerformanceSiliconGate CMOS 286. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC573A Octal 3State Noninverting Transparent Latch HighPerformanceSiliconGate CMOS 292. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC574A Octal 3State Noninverting D FlipFlop HighPerformance SiliconGateCMOS 298. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC589A 8Bit Serial or ParallelInput/SerialOutput Shift Register with 3StateOutput HighPerformance SiliconGate CMOS 304. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC595A 8Bit SerialInput/Serial or ParallelOutput Shift Register with Latched 3StateOutputs HighPerformance SiliconGate CMOS 313. . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HC74A Dual D FlipFlop with Set and Reset HighPerformance SiliconGate CMOS 321 . . .

    MC74HCT04A Hex Inverter With LSTTLCompatible Inputs HighPerformanceSiliconGate CMOS 326. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HCT138A 1of8 Decoder/ Demultiplexer with LSTTL Compatible Inputs HighPerformanceSiliconGate CMOS 330. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HCT14A Hex SchmittTrigger Inverter with LSTTL Compatible Inputs HighPerformanceSiliconGate CMOS 335. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HCT244A Octal 3State Noninverting Buffer/Line Driver/Line Receiver with LSTTLCompatibleInputs HighPerformance SiliconGate CMOS 340. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HCT245A Octal 3State Noninverting Bus Transceiver with LSTTL CompatibleInputs HighPerformance SiliconGate CMOS 344. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HCT273A Octal D FlipFlop with Common Clock and Reset with LSTTLCompatibleInputs HighPerformance SiliconGate CMOS 349. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HCT373A Octal 3State Noninverting Transparent Latch with LSTTLCompatible

    Inputs HighPerformance SiliconGate CMOS 353. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HCT374A Octal 3State Noninverting D FlipFlop with LSTTLCompatibleInputs HighPerformance SiliconGate CMOS 359. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HCT541A Octal 3State NonInverting Buffer/Line Driver/Line Receiver With LSTTLCompatibleInputs HighPerformance SiliconGate CMOS 364. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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    Data Sheet Function Page

    MC74HCT573A Octal 3State Noninverting Transparent Latch with LSTTL CompatibleInputs HighPerformance SiliconGate CMOS 368. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HCT574A Octal 3State Noninverting D FlipFlop with LSTTLCompatibleInputs HighPerformance SiliconGate CMOS 373. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HCT74A Dual D FlipFlop with Set and Reset with LSTTL CompatibleInputs HighPerformance SiliconGate CMOS 378. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    MC74HCU04A Hex Unbuffered Inverter HighPerformance SiliconGate CMOS 383. . . . . . . . . . . . . .

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    CHAPTER 1Selector Guide

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    BUFFERS/INVERTERS

    DeviceNumber

    MC74

    Function

    FunctionalEquivalent

    LSTTLDevice

    74

    FunctionalEquivalent

    CMOSDevice

    MC1XXXXor CDXXXX

    Direct PinCompatibility

    Numberof

    Pins

    HC04AHCT04AHCU04AHC14A

    HCT14A

    Hex InverterHex Inverter with LSTTLCompatible InputsHex Unbuffered InverterHex SchmittTrigger InverterHex SchmittTrigger Inverter with LSTTLCompatible

    Inputs

    LS04LS04LS04LS14LS14

    *4069*4069406945844584

    LS/CMOSLS/CMOSLS/CMOSLS/CMOSLS/CMOS

    1414141414

    HC125AHC126AHC240A

    Quad 3State Noninverting BufferQuad 3State Noninverting BufferOctal 3State Inverting Buffer/Line Driver/Line Receiver

    LS125,LS125ALS126,LS126A

    LS240

    LSLSLS

    141420

    HC244A

    HCT244A

    HC245AHCT245A

    Octal 3State Noninverting Buffer/Line Driver/LineReceiver

    Octal 3State Noninverting Buffer/Line Driver/Line

    Receiver with LSTTLCompatible InputsOctal 3State Noninverting Bus TransceiverOctal 3State Noninverting Bus Transceiver with

    LSTTLCompatible Inputs

    LS244

    LS244

    LS245LS245

    LS

    LS

    LSLS

    20

    20

    2020

    HC540A

    Octal 3State Inverting Buffer/Line Driver/Line Receiver

    20

    HC541A

    HCT541A

    Octal 3State Noninverting Buffer/Line Driver/LineReceiver

    Octal 3State Noninverting Buffer/Line Driver/LineReceiver with LSTTLCompatible Inputs

    LS541

    LS541

    LS

    LS

    20

    20

    HC Devices Have CMOSCompatible Inputs. HCT Devices Have LSTTLCompatible Inputs.

    Device

    HCHCT04A

    HCU04A

    HC14A

    HC125A

    HC126A

    HC240A

    HCHCT244A

    HCHCT245A

    # Pins

    14

    14

    14

    14

    14

    20

    20

    20

    Quad DeviceHex DeviceOctal DeviceNineWide Device

    D

    D

    D

    D

    D

    D

    D

    D

    Noninverting OutputsInverting Outputs

    D

    D

    D

    D

    D

    D

    D

    D

    Single Stage (unbuffered)

    D

    Schmitt Trigger

    D

    3State Outputs

    OpenDrain OutputsCommon Output EnablesActiveLow Output EnablesActiveHigh Output EnablesSeparate 4Bit SectionsSeparate 2Bit and 4Bit Sections

    D

    D

    D

    D

    D

    D

    D

    D

    D

    D

    D

    D

    D

    D

    D

    TransceiverDirection Control

    D

    D

    LogicLevel Down Converter

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    BUFFERS/INVERTERS (Continued)

    HC Devices Have CMOSCompatible Inputs. HCT Devices Have LSTTLCompatible Inputs.

    Device

    HC540A

    HCHCT541A

    # Pins

    20

    20

    Quad DeviceHex DeviceOctal DeviceNineWide Device

    D

    D

    Noninverting OutputsInverting Outputs

    D

    D

    Single Stage (unbuffered)

    Schmitt Trigger

    3State OutputsOpenDrain OutputsCommon Output EnablesActiveLow Output Enables

    D

    D

    D

    D

    D

    D

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    GATES

    DeviceNumber

    MC74

    Function

    FunctionalEquivalent

    LSTTLDevice

    74

    FunctionalEquivalent

    CMOSDevice

    MC1XXXXor CDXXXX

    Direct PinCompatibility

    Numberof

    Pins

    HC00AHC02AHC03AHC08AHC32AHC86A

    HC132A

    Quad 2Input NAND GateQuad 2Input NOR GateQuad 2Input NAND Gate with OpenDrain OutputsQuad 2Input AND GateQuad 2Input OR GateQuad 2Input Exclusive OR GateQuad 2Input NAND Gate with SchmittTrigger Inputs

    LS00

    LS08LS32LS86

    LS132

    40114001*40114081407140704093

    LS

    LSLSLSLS

    14141414141414

    HC Devices Have CMOSCompatible Inputs.

    Device

    HC00A

    HC02A

    HC03A

    HC08A

    HC32A

    # Pins

    14

    14

    14

    14

    14

    Single DeviceDual DeviceTriple DeviceQuad Device

    D

    D

    D

    D

    D

    NANDNORANDOR

    D

    D

    D

    D

    D

    Exclusive ORExclusive NORANDNORANDOR

    2Input3Input4Input8Input13Input

    D

    D

    D

    D

    D

    SchmittTrigger Inputs

    OpenDrain Outputs

    D

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    GATES (Continued)

    HC Devices Have CMOSCompatible Inputs.

    Device

    HC86A

    HC132A

    # Pins

    14

    14

    Single Device

    Dual DeviceTriple DeviceQuad Device

    D

    D

    NANDNORANDOR

    D

    Exclusive ORExclusive NORANDNORANDOR

    D

    2Input

    3Input4Input8Input13Input

    D

    D

    SchmittTrigger Inputs

    D

    OpenDrain Outputs

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    SCHMITT TRIGGERS

    DeviceNumber

    MC74

    Function

    FunctionalEquivalent

    LSTTLDevice

    74

    FunctionalEquivalent

    CMOSDevice

    MC1XXXXor CDXXXX

    Direct PinCompatibility

    Numberof

    Pins

    HC14AHCT14A

    HC132A

    Hex SchmittTrigger InverterHex SchmittTrigger Inverter with LSTTLCompatible

    InputsQuad 2Input NAND Gate with SchmittTrigger Inputs

    LS14LS14

    LS132

    45844584

    4093

    LS/CMOSLS

    LS

    1414

    14

    BUS TRANSCEIVERS

    Device

    NumberMC74

    Function

    FunctionalEquivalent

    LSTTL

    Device74

    FunctionalEquivalent

    CMOSDevice

    MC1XXXXor CDXXXX

    Direct PinCompatibility

    Number

    ofPins

    HC245AHCT245A

    Octal 3State Noninverting Bus TransceiverOctal 3State Noninverting Bus Transceiver withLSTTLCompatible Inputs

    LS245LS245

    LSLS

    2020

    HC Devices Have CMOSCompatible Inputs. HCT Devices Have LSTTLCompatible Inputs.

    Device

    HCHCT245A

    # Pins

    20

    Quad DeviceOctal Device

    D

    BufferStorage Capability

    D

    Inverting OutputsNoninverting Outputs

    D

    Common Output EnableActiveLow Output EnableActiveHigh Output Enable

    D

    D

    Direction Control

    D

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    LATCHES

    DeviceNumber

    MC74

    Function

    FunctionalEquivalent

    LSTTLDevice

    74

    FunctionalEquivalent

    CMOSDevice

    MC1XXXXor CDXXXX

    Direct PinCompatibility

    Numberof

    Pins

    HC373AHCT373A

    Octal 3State Noninverting Transparent LatchOctal 3State Noninverting Transparent Latch with

    LSTTLCompatible Inputs

    LS373LS373

    LS373LS373

    2020

    HC573AHCT573A

    Octal 3State Noninverting Transparent LatchOctal 3State Noninverting Transparent Latch with

    LSTTLCompatible Inputs

    LS373LS373

    LS573LS573

    2020

    HC Devices Have CMOSCompatible Inputs. HCT Devices Have LSTTLCompatible Inputs.

    Device

    HCHCT373A

    HCHCT573A

    # Pins

    20

    20

    Single DeviceDual DeviceOctal Device

    D

    D

    Number of Bits Controlled by Latch Enable :28

    D

    D

    TransparentAddressableReadback Capability

    D

    D

    Noninverting Outputs

    Inverting Outputs

    D

    D

    Common Latch Enable, ActiveLow

    D

    D

    3State OutputsCommon Output Enable, ActiveLow

    D

    D

    D

    D

    These devices are identical in function and are different in pinout only: HC/HCT373A and HC/HCT573A

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    FLIPFLOPS

    DeviceNumber

    MC74

    Function

    FunctionalEquivalent

    LSTTLDevice

    74

    FunctionalEquivalent

    CMOSDevice

    MC1XXXXor CDXXXX

    Direct PinCompatibility

    Numberof

    Pins

    HC74AHCT74A

    Dual D FlipFlop with Set and ResetDual D FlipFlop with Set and Reset with

    LSTTLCompatible Inputs

    LS74,LS74ALS74,LS74A

    *40134013

    LSLS

    1414

    HC174AHC175A

    Hex D FlipFlop with Common Clock and ResetQuad D FlipFlop with Common Clock and Reset

    LS174LS175

    41744175

    LS/CMOSLS/CMOS

    1616

    HC273AHCT273A

    HC374AHCT374A

    Octal D FlipFlop with Common Clock and ResetOctal D FlipFlop with Common Clock and Reset with

    LSTTLCompatible InputsOctal 3State Noninverting D FlipFlopOctal 3State Noninverting D FlipFlop with

    LSTTLCompatible Inputs

    LS273LS273

    LS374LS374

    LSLS

    LS374LS374

    2020

    2020

    HC574AHCT574A

    Octal 3State Noninverting D FlipFlopOctal 3State Noninverting D FlipFlop withLSTTLCompatible Inputs

    LS374LS374

    2020

    *Suggested alternative

    HC Devices Have CMOSCompatible Inputs. HCT Devices Have LSTTLCompatible Inputs.

    Device

    HCHCT74A

    HC174A

    HC175/A

    # Pins

    14

    16

    16

    Type

    D

    D

    D

    Dual DeviceQuad DeviceHex DeviceOctal Device

    D

    D

    D

    Common ClockNegativeTransition ClockingPositiveTransition Clocking

    D

    D

    D

    D

    D

    Common, ActiveLow Data Enables

    Noninverting OutputsInverting Outputs

    D

    D

    D

    D

    D

    3State OutputsCommon, ActiveLow Output Enables

    Common ResetActiveLow ResetActiveHigh Reset

    D

    D

    D

    D

    D

    ActiveLow Set

    D

    TransceiverDirection Control

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    FLIPFLOPS (Continued)

    HC Devices Have CMOSCompatible Inputs. HCT Devices Have LSTTLCompatible Inputs.

    Device

    HCHCT273A

    HCHCT374A

    HCHCT574A

    # Pins

    20

    20

    20

    Type

    D

    D

    D

    Dual DeviceQuad DeviceHex DeviceOctal Device

    D

    D

    D

    Common ClockNegativeTransition ClockingPositiveTransition Clocking

    D

    D

    D

    D

    D

    D

    Common, ActiveLow Data Enables

    Noninverting OutputsInverting Outputs

    D

    D

    D

    3State Outputs

    Common, ActiveLow Output Enables

    D

    D

    D

    D

    Common ResetActiveLow ResetActiveHigh Reset

    D

    D

    ActiveLow Set

    TransceiverDirection Control

    These devices are identical in function and are different in pinout only: HC374A and HC574A

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    DIGITAL DATA SELECTORS/MULTIPLEXERS

    DeviceNumber

    MC74

    Function

    FunctionalEquivalent

    LSTTLDevice

    74

    FunctionalEquivalent

    CMOSDevice

    MC1XXXXor CDXXXX

    Direct PinCompatibility

    Numberof

    Pins

    HC157A

    Quad 2Input Noninverting Data Selector/Multiplexer

    LS157

    LS

    16

    HC251HC253

    HC257

    8Input Data Selector/Multiplexer with 3State OutputsDual 4Input Data Selector/Multiplexer with 3State

    OutputsQuad 2Input Data Selector/Multiplexer with 3State

    Outputs

    LS251LS253

    LS257B

    *4512

    LSLS

    LS

    1616

    16

    *Suggested alternative

    HC Devices Have CMOSCompatible Inputs.

    Device

    HC157A

    # Pins

    16

    Description

    One oftwo 4bitwords isselected

    Single DeviceDual DeviceQuad Device

    D

    Data Latch with ActiveLow Latch Enable

    Common Address1Bit Binary Address2Bit Binary Address3Bit Binary Address

    D

    D

    Address Latch (Transparent)Address Latch (Nontransparent)ActiveLow Address Latch Enable

    Noninverting OutputInverting Output

    D

    3State Outputs

    Common Output EnableActiveHigh Output EnableActiveLow Output Enable

    D

    D

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    DECODERS/DEMULTIPLEXERS/DISPLAY DRIVERS

    DeviceNumber

    MC74

    Function

    FunctionalEquivalent

    LSTTLDevice

    74

    FunctionalEquivalent

    CMOSDevice

    MC1XXXXor CDXXXX

    Direct PinCompatibility

    Numberof

    Pins

    HC138AHCT138A

    HC139A

    1of8 Decoder/Demultiplexer1of8 Decoder/Demultiplexer with LSTTLCompatible

    InputsDual 1of4 Decoder/Demultiplexer

    LS138LS138

    LS139

    *4028*4028

    4556

    LSLS

    LS/CMOS

    1616

    16*Suggested alternative

    HC Devices Have CMOSCompatible Inputs.

    Device

    HCHCT138A

    HC139A

    # Pins

    16

    16

    Input Description

    3Bit Binary

    Address

    2Bit Binary

    Address

    Output Description

    One of 8

    One of 4

    Single DeviceDual Device

    D

    D

    Address Input LatchActiveHigh Latch EnableActiveLow Latch Enable

    ActiveLow Inputs

    ActiveLow OutputsActiveHigh Outputs

    D

    D

    ActiveLow Output EnableActiveHigh Output Enable

    DD

    D

    D

    ActiveLow Reset

    ActiveLow Blanking InputActiveHigh Blanking Input

    ActiveLow LampTest Input

    Phase Input (for LCDs)

    DD Implies the device has two such enables

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    ANALOG SWITCHES/MULTIPLEXERS/DEMULTIPLEXERS

    DeviceNumber

    MC74

    Function

    FunctionalEquivalent

    LSTTLDevice

    74

    FunctionalEquivalent

    CMOSDevice

    MC1XXXXor CDXXXX

    Direct PinCompatibility

    Numberof

    Pins

    HC4051AHC4052AHC4053AHC4066A

    8Channel Analog Multiplexer/DemultiplexerDual 4Channel Analog Multiplexer/DemultiplexerTriple 2Channel Analog Multiplexer/DemultiplexerQuad Analog Switch/Multiplexer/Demultiplexer

    405140524053

    4066,4016

    CMOSCMOSCMOSCMOS

    16161614

    K HC4316/A

    K HC4851A

    K HC4852A

    Quad Analog Switch/Multiplexer/Demultiplexer withSeparate Analog and Digital Power Supplies

    Analog Multiplexer/Demultiplexer with Injection CurrentEffect Control

    Analog Multiplexer/Demultiplexer with Injection CurrentEffect Control

    *4016

    *4051

    *4052

    16

    20

    20

    *Suggested alternative K HighSpeed CMOS design only

    HC Devices Have CMOSCompatible Inputs.

    Device

    HC4051A

    HC4052A

    HC4053A

    HC4066A

    # Pins

    16

    16

    16

    14

    Description

    A 3Bit AddressSelects One of 8

    Switches

    A 2Bit AddressSelects One of 4

    Switches

    A 3Bit AddressSelects VaryingCombinations ofthe 6 Switches

    4 IndependentlyControlledSwitches

    Single DeviceDual DeviceTriple DeviceQuad Device

    D

    D

    D

    D

    1to1 Multiplexing2to1 Multiplexing4to1 Multiplexing8to1 Multiplexing

    D

    D

    D

    D

    ActiveHigh ON/OFF Control

    D

    Common Address Inputs2Bit Binary Address3Bit Binary Address

    Address Latch with ActiveLow LatchEnable

    D

    D

    D

    D

    D

    Common Switch EnableActiveLow EnableActiveHigh Enable

    D

    D

    D

    D

    D

    D

    Separate Analog and Control ReferencePower Supplies

    D

    D

    D

    Switched Tubs (for R ON and Prop. DelayImprovement)

    D

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    ANALOG SWITCHES/MULTIPLEXERS/DEMULTIPLEXERS (Continued)

    HC Devices Have CMOSCompatible Inputs.

    Device

    HC4316A

    HC4851A

    HC4852A

    # Pins

    16

    20

    20

    Description

    4 Independently

    Controlled Switches(Has a Separate

    Analog LowerPower Supply)

    A 3Bit Address

    Selects One of 8Switches

    (Has Injection CurrentProtection)

    A 3Bit Address

    Selects VaryingCombinations ofthe 6 Switches

    (Has Injection CurrentProtection)

    Single DeviceDual DeviceTriple DeviceQuad Device

    D

    D

    D

    1to1 Multiplexing2to1 Multiplexing4to1 Multiplexing8to1 Multiplexing

    D

    D

    D

    ActiveHigh ON/OFF Control

    D

    Common Address Inputs2Bit Binary Address3Bit Binary Address

    D

    D

    D

    D

    Common Switch EnableActiveLow EnableActiveHigh Enable

    D

    D

    D

    D

    D

    D

    Separate Analog and Control Reference Power Supplies

    D

    D

    D

    Switched Tubs (for R ON and Prop. Delay Improvement)

    njection Current Protection

    D

    D

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    SHIFT REGISTERS

    DeviceNumber

    MC74

    Function

    FunctionalEquivalent

    LSTTLDevice

    74

    FunctionalEquivalent

    CMOSDevice

    MC1XXXXor CDXXXX

    Direct PinCompatibility

    Numberof

    Pins

    HC164AHC165A

    8Bit SerialInput/ParallelOutput Shift Register8Bit Serial or ParallelInput/SerialOutput Shift Register

    LS164LS165

    *4021

    LSLS

    1416

    HC589A

    HC595A

    8Bit Serial or ParallelInput/SerialOutput Shift Registerwith 3State Output

    8Bit SerialInput/Serial or ParallelOutput Shift Registerwith Latched 3State Outputs

    16

    16

    *Suggested alternative

    HC Devices Have CMOSCompatible Inputs.

    Device

    HC164A

    HC165A

    HC589A

    HC595A

    # Pins

    14

    16

    16

    16

    4Bit Register8Bit Register

    D

    D

    D

    D

    Serial Data InputParallel Data Inputs

    D

    D

    D

    D

    D

    D

    Serial Output OnlyParallel OutputsInverting OutputNoninverting Output

    D

    D

    D

    D

    D

    D

    D

    D

    D

    Serial Shift/Parallel Load ControlShifts One Direction OnlyShifts Both Directions

    D

    D

    D

    D

    D

    D

    PositiveTransition ClockingActiveHigh Clock Enable

    D

    D

    D

    D

    D

    Input Data Enable

    D

    Data Latch with ActiveHigh Latch Clock

    D

    Output Latch with ActiveHigh Latch Clock

    D

    3State OutputsActiveLow Output Enable

    D

    D

    D

    D

    ActiveLow Reset

    D

    D

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    COUNTERS

    DeviceNumber

    MC74

    Function

    FunctionalEquivalent

    LSTTLDevice

    74

    FunctionalEquivalent

    CMOSDevice

    MC1XXXXor CDXXXX

    Direct PinCompatibility

    Numberof

    Pins

    HC161A

    HC163AHC390A

    Presettable 4Bit Binary Counter with AsynchronousReset

    Presettable 4Bit Binary Counter with Synchronous ResetDual 4Stage Binary Ripple Counter with 2 and 5

    Sections

    LS161,LS161A

    LS161,LS161A

    LS

    LS

    16

    161616

    HC393 AHC4020AHC4040AHC4060A

    Dual 4Stage Binary Ripple Counter14Stage Binary Ripple Counter12Stage Binary Ripple Counter14Stage Binary Ripple Counter with Oscillator

    LS393

    *4520402040404060

    LSCMOSCMOSCMOS

    14161616

    *Suggested alternative

    HC Devices Have CMOSCompatible Inputs.

    Device

    HC161A

    HC163A

    HC390A

    HC393A

    HC4020A

    HC4040A

    HC4060A

    # Pins

    16

    16

    16

    14

    16

    16

    16

    Single DeviceDual Device

    D

    D

    D

    D

    D

    D

    D

    Ripple CounterNumber of Ripple Counter Internal StagesNumber of Stages with Available Outputs

    D

    44

    D

    44

    D

    1412

    D

    1212

    D

    1410

    Count Up

    D

    D

    D

    D

    D

    D

    D

    4Bit Binary CounterBCD CounterDecimal Counter

    D

    D

    D

    D

    Separate 2 SectionSeparate 5 Section

    D

    D

    OnChip Oscillator Capability

    D

    PositiveTransition ClockingNegativeTransition ClockingActiveHigh Clock EnableActiveLow Clock Enable

    D

    D

    D

    D

    D

    D

    D

    ActiveHigh Count Enable

    DD

    DD

    ActiveHigh Reset

    D

    D

    D

    D

    D

    D

    D

    4Bit Binary Preset Data Inputs

    BCD Preset Data InputsActiveLow Load Preset

    D

    D

    D

    D

    Carry Output

    D

    D

    DD implies the device has two such enables

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    MISCELLANEOUS DEVICES

    DeviceNumber

    MC74

    Function

    FunctionalEquivalent

    LSTTLDevice

    74

    FunctionalEquivalent

    CMOSDevice

    MC1XXXXor CDXXXX

    Direct PinCompatibility

    Numberof

    Pins

    HC4046AHC4538A

    PhaseLocked LoopDual Precision Monostable Multivibrator

    (Retriggerable, Resettable)

    40464538,4528

    CMOSCMOS

    1616

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    CHAPTER 2Data Sheets

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    Semiconductor Components Industries, LLC, 2004

    December, 2004 Rev. 9

    27 Publication Order Number:

    MC74HC00A/D

    MC74HC00A

    Quad 2Input NAND GateHighPerformance SiliconGate CMOS

    The MC74HC00A is identical in pinout to the LS00. The deviceinputs are compatible with Standard CMOS outputs; with pullupresistors, they are compatible with LSTTL outputs.

    Features

    PbFree Packages are Available* Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS and TTL Operating Voltage Range: 2 to 6 V Low Input Current: 1 mA High Noise Immunity Characteristic of CMOS Devices In Compliance With the JEDEC Standard No. 7 A Requirements Chip Complexity: 32 FETs or 8 Equivalent Gates

    3 Y1

    1 A1

    PIN 14 = VCCPIN 7 = GND

    LOGIC DIAGRAM

    2B1

    6 Y2

    4 A2

    5B2

    8 Y3

    9 A3

    10B3

    11 Y4

    12 A4

    13B4

    Y = AB

    Pinout: 14Lead Packages (Top View)

    1314 12 11 10 9 8

    21 3 4 5 6 7

    VCC B4 A4 Y4 B3 A3 Y3

    A1 B1 Y1 A2 B2 Y2 GND

    *For additional information on our PbFree strategy and soldering details, pleasedownload the ON Semiconductor Soldering and Mounting TechniquesReference Manual, SOLDERRM/D.

    MARKINGDIAGRAMS

    A = Assembly LocationWL or L = Wafer LotYY or Y = YearWW or W = Work Week

    TSSOP14DT SUFFIXCASE 948G

    HC00A

    ALYW

    1

    14

    1

    14PDIP14

    N SUFFIXCASE 646

    MC74HC00ANAWLYYWW

    SOIC14

    D SUFFIXCASE 751A

    1

    14

    HC00AAWLYWW

    LLHH

    LHLH

    FUNCTION TABLE

    Inputs Output

    A B

    HHHL

    Y

    See detailed ordering and shipping information in the packagedimensions section on pag e 28 of this data sheet.

    ORDERING INFORMATION

    http://onsemi.com

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    MAXIMUM RATINGS

    Symbol

    Parameter

    Value

    Unit

    VCC

    DC Supply Voltage (Referenced to GND)

    0.5 to + 7.0

    V

    Vin

    DC Input Voltage (Referenced to GND)

    0.5 to V CC + 0.5

    V

    Vout

    DC Output Voltage (Referenced to GND)

    0.5 to V CC + 0.5

    V

    Iin

    DC Input Current, per Pin

    20

    mA

    Iout

    DC Output Current, per Pin

    25

    mA

    ICC

    DC Supply Current, V CC and GND Pins

    50

    mA

    P D

    Power Dissipation in Still Air, Plastic DIPSOIC Package

    TSSOP Package

    750500450

    mW

    Tstg

    Storage Temperature

    65 to + 150

    C

    TL

    Lead Temperature, 1 mm from Case for 10 SecondsPlastic DIP, SOIC or TSSOP Package

    260

    C

    Maximum ratings are those values beyond which device damage can occur. Maximum ratingsapplied to the device are individual stress limit values (not normal operating conditions) and arenot valid simultaneously. If these limits are exceeded, device functional operation is not implied,damage may occur and reliability may be affected.

    Derating Plastic DIP: 10 mW/ C from 65 to 125 CSOIC Package: 7 mW/ C from 65 to 125 CTSSOP Package: 6.1 mW/ C from 65 to 125 C

    For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).

    RECOMMENDED OPERATING CONDITIONS

    Symbol

    Parameter

    Min

    Max

    Unit

    VCC

    DC Supply Voltage (Referenced to GND)

    2.0

    6.0

    V

    Vin, Vout

    DC Input Voltage, Output Voltage (Referenced to GND)

    0

    VCC

    V

    TA

    Operating Temperature, All Package Types

    55

    + 125

    C

    tr, tf

    Input Rise and Fall Time V CC = 2.0 V(Figure 1) V CC = 4.5 V

    VCC = 6.0 V

    000

    1000500400

    ns

    ORDERING INFORMATION

    Device Package Shipping

    MC74HC00AN PDIP14 2000 Units / Box

    MC74HC00ANG PDIP14(PbFree)

    2000 Units / Box

    MC74HC00AD SOIC14 55 Units / Rail

    MC74HC00ADG SOIC14(PbFree)

    55 Units / Rail

    MC74HC00ADR2 SOIC14 2500 Units / Reel

    MC74HC00ADR2G SOIC14(PbFree) 2500 Units / Reel

    MC74HC00ADT TSSOP14* 96 Units / Rail

    MC74HC00ADTR2 TSSOP14* 2500 Units / Reel

    For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.

    *This package is inherently PbFree.

    This device contains protectioncircuitry to guard against damagedue to high static voltages or electricfields. However, precautions mustbe taken to avoid applications of anyvoltage higher than maximum ratedvoltages to this highimpedance cir-cuit. For proper operation, V in andVout should be constrained to therange GND v (Vin or Vout ) v VCC .

    Unused inputs must always betied to an appropriate logic voltagelevel (e.g., either GND or V CC ).Unused outputs must be left open.

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    DC CHARACTERISTICS (Voltages Referenced to GND)

    Guaranteed Limit

    Symbol Parameter ConditionCCV 55 to 25 C 85 C 125 C Unit

    VIH Minimum HighLevel InputVoltage

    Vout = 0.1V or V CC 0.1V|Iout | 20 mA

    2.03.04.56.0

    1.502.103.154.20

    1.502.103.154.20

    1.502.103.154.20

    V

    VIL Maximum LowLevel InputVoltage

    Vout = 0.1V or V CC 0.1V|Iout | 20 mA

    2.03.04.56.0

    0.500.901.351.80

    0.500.901.351.80

    0.500.901.351.80

    V

    VOH Minimum HighLevel OutputVoltage

    Vin = VIH or VIL|Iout | 20 mA

    2.04.56.0

    1.94.45.9

    1.94.45.9

    1.94.45.9

    V

    Vin =VIH or VIL |Iout | 2.4mA|Iout | 4.0mA|Iout | 5.2mA

    3.04.56.0

    2.483.985.48

    2.343.845.34

    2.203.705.20

    VOL Maximum LowLevel OutputVoltage

    Vin = VIH or VIL|Iout | 20 mA

    2.04.56.0

    0.10.10.1

    0.10.10.1

    0.10.10.1

    V

    Vin = VIH or VIL |Iout | 2.4mA|Iout | 4.0mA|Iout | 5.2mA

    3.04.56.0

    0.260.260.26

    0.330.330.33

    0.400.400.40

    Iin Maximum Input LeakageCurrent

    Vin = VCC or GND 6.0 0.1 1.0 1.0 mA

    ICC Maximum Quiescent SupplyCurrent (per Package)

    Vin = VCC or GNDIout = 0 mA

    6.0 1.0 10 40 mA

    NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book(DL129/D).

    AC CHARACTERISTICS (CL = 50 pF, Input t r = tf = 6 ns)

    VGuaranteed Limit

    Symbol ParameterCCV 55 to 25 C 85 C 125 C Unit

    tPLH ,tPHL

    Maximum Propagation Delay, Input A or B to Output Y(Figures 1 and 2)

    2.03.04.56.0

    75301513

    95401916

    110552219

    ns

    tTLH,tTHL

    Maximum Output Transition Time, Any Output(Figures 1 and 2)

    2.03.04.56.0

    75271513

    95321916

    110362219

    ns

    Cin Maximum Input Capacitance 10 10 10 pF

    NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ONSemiconductor HighSpeed CMOS Data Book (DL129/D).

    Typical @ 25 C, V CC = 5.0 V, V EE = 0 VCPD Power Dissipation Capacitance (Per Buffer)* 22 pF

    * Used to determine the noload dynamic power consumption: P D = CPD VCC 2f + ICC VCC . For load considerations, see Chapter 2 of theON Semiconductor HighSpeed CMOS Data Book (DL129/D).

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    30

    Figure 1. Switching Waveforms

    GND

    VCC

    OUTPUT Y

    INPUT A OR B

    CL *

    *Includes all probe and jig capacitance

    TESTPOINT

    90%

    50%10%

    tTLH

    DEVICEUNDERTEST

    OUTPUT

    Figure 2. Test Circuit

    Y A

    B

    Figure 3. Expanded Logic Diagram(1/4 of the Device)

    tTHL

    90%50%

    10%

    tPLH tPHL

    tf tr

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    Semiconductor Components Industries, LLC, 2004

    December, 2004 Rev. 9

    31 Publication Order Number:

    MC74HC02A/D

    MC74HC02A

    Quad 2Input NOR GateHighPerformance SiliconGate CMOS

    The MC74HC02A is identical in pinout to the LS02. The deviceinputs are compatible with standard CMOS outputs; with pullupresistors, they are compatible with LSTTL outputs.

    Features

    PbFree Packages are Available* Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 mA High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard

    No. 7.0 A Chip Complexity: 40 FETs or 10 Equivalent Gates

    LOGIC DIAGRAM

    1 Y1

    2 A1

    PIN 14 = VCCPIN 7 = GND

    3B1

    Y4

    Y = A + B

    4 Y2

    5 A2

    6B2

    10 Y3

    8 A3

    9B3

    1311

    A412

    B4

    PIN ASSIGNMENT

    11

    12

    13

    14

    8

    9

    105

    4

    3

    2

    1

    7

    6

    Y3

    A4

    B4

    Y4

    VCC

    A3

    B3

    Y2

    B1

    A1

    Y1

    GND

    B2

    A2

    *For additional information on our PbFree strategy and soldering details, pleasedownload the ON Semiconductor Soldering and Mounting TechniquesReference Manual, SOLDERRM/D.

    MARKINGDIAGRAMS

    A = Assembly LocationWL or L = Wafer LotYY or Y = YearWW or W = Work Week

    TSSOP14DT SUFFIXCASE 948G

    HC02A

    ALYW

    1

    14

    1

    14PDIP14

    N SUFFIXCASE 646

    MC74HC02ANAWLYYWW

    SOIC14D SUFFIX

    CASE 751A1

    14

    HC02A

    AWLYWW

    FUNCTION TABLE

    A

    LLHH

    Inputs Output

    B

    LHLH

    Y

    HLLL

    See detailed ordering and shipping information in the packagedimensions section on pag e 34 of this data sheet.

    ORDERING INFORMATION

    http://onsemi.com

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    32

    MAXIMUM RATINGS*

    Symbol

    Parameter

    Value

    Unit

    VCC

    DC Supply Voltage (Referenced to GND)

    0.5 to + 7.0

    V

    Vin

    DC Input Voltage (Referenced to GND)

    0.5 to V CC + 0.5

    V

    Vout

    DC Output Voltage (Referenced to GND)

    0.5 to V CC + 0.5

    V

    Iin

    DC Input Current, per Pin

    20

    mA

    Iout

    DC Output Current, per Pin

    25

    mA

    ICC

    DC Supply Current, V CC and GND Pins

    50

    mA

    P D

    Power Dissipation in Still Air, Plastic DIPSOIC Package

    TSSOP Package

    750500450

    mW

    Tstg

    Storage Temperature

    65 to + 150

    C

    TL

    Lead Temperature, 1 mm from Case for 10 SecondsPlastic DIP, SOIC or TSSOP Package

    260

    C

    Maximum ratings are those values beyond which device damage can occur. Maximum ratingsapplied to the device are individual stress limit values (not normal operating conditions) and arenot valid simultaneously. If these limits are exceeded, device functional operation is not implied,damage may occur and reliability may be affected.

    Derating Plastic DIP: 10 mW/ C from 65 to 125 CSOIC Package: 7 mW/ C from 65 to 125 CTSSOP Package: 6.1 mW/ C from 65 to 125 C

    For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).

    RECOMMENDED OPERATING CONDITIONS

    Symbol

    Parameter

    Min

    Max

    Unit

    VCC

    DC Supply Voltage (Referenced to GND)

    2.0

    6.0

    V

    Vin, Vout

    DC Input Voltage, Output Voltage (Referenced to GND)

    0

    VCC

    V

    TA

    Operating Temperature, All Package Types

    55

    + 125

    C

    tr, tf

    Input Rise and Fall Time V CC = 2.0 V(Figure 1) V CC = 4.5 V

    VCC = 6.0 V

    000

    1000500400

    ns

    This device contains protectioncircuitry to guard against damagedue to high static voltages or electricfields. However, precautions mustbe taken to avoid applications of anyvoltage higher than maximum ratedvoltages to this highimpedance cir-cuit. For proper operation, V in andVout should be constrained to therange GND v (Vin or Vout ) v VCC .

    Unused inputs must always betied to an appropriate logic voltagelevel (e.g., either GND or V CC ).Unused outputs must be left open.

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    DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

    Guaranteed Limit

    Symbol

    Parameter

    Test Conditions

    VCCV

    55 to25 C

    v 85 C

    v 125 C

    Unit

    VIH

    Minimum HighLevel InputVoltage

    Vout = 0.1 V or V CC 0.1 V|Iout | v 20 mA

    2.03.04.56.0

    1.52.1

    3.154.2

    1.52.1

    3.154.2

    1.52.1

    3.154.2

    V

    VIL

    Maximum LowLevel InputVoltage

    Vout = 0.1 V or V CC 0.1 V|Iout | v 20 mA

    2.03.04.56.0

    0.50.9

    1.351.8

    0.50.9

    1.351.8

    0.50.9

    1.351.8

    V

    VOH

    Minimum HighLevel OutputVoltage

    Vin = VIH or VIL|Iout | v 20 mA

    2.04.56.0

    1.94.45.9

    1.94.45.9

    1.94.45.9

    V

    Vin = VIH or VIL |Iout | v 2.4 mA|Iout | v 4.0 mA|Iout | v 5.2 mA

    3.04.56.0

    2.483.985.48

    2.343.845.34

    2.203.75.2

    VOL

    Maximum LowLevel OutputVoltage

    Vin = VIH or VIL|Iout | v 20 mA

    2.04.56.0

    0.10.10.1

    0.10.10.1

    0.10.10.1

    V

    Vin = VIH or VIL |Iout | v 2.4 mA|Iout | v 4.0 mA|Iout | v 5.2 mA

    3.04.56.0

    0.260.260.26

    0.330.330.33

    0.40.40.4

    Iin

    Maximum Input LeakageCurrent

    Vin = VCC or GND

    6.0

    0.1

    1.0

    1.0

    mA

    ICC

    Maximum Quiescent SupplyCurrent (per Package)

    Vin = VCC or GND|Iout | = 0 mA

    6.0

    1.0

    10

    40

    mA

    NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book(DL129/D).

    AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input t r = tf = 6.0 ns)

    Guaranteed Limit

    Symbol

    Parameter

    VCCV

    55 to25 C

    v 85 C

    v 125 C

    Unit

    tPLH ,tPHL

    Maximum Propagation Delay, Input A or B to Output Y(Figures 1 and 2)

    2.03.04.56.0

    75301513

    95401916

    110552219

    ns

    tTLH,tTHL

    Maximum Output Transition Time, Any Output(Figures 1 and 2)

    2.03.04.56.0

    75301513

    95401916

    110552219

    ns

    Cin

    Maximum Input Capacitance

    10

    10

    10

    pF

    NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ONSemiconductor HighSpeed CMOS Data Book (DL129/D).

    Typical @ 25 C, V CC = 5.0 V

    CPD Power Dissipation Capacitance (Per Gate)* 22 pF

    * Used to determine the noload dynamic power consumption: P D = CPD VCC 2f + ICC VCC . For load considerations, see Chapter 2 of theON Semiconductor HighSpeed CMOS Data Book (DL129/D).

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    34

    ORDERING INFORMATION

    Device Package Shipping

    MC74HC02AN PDIP14 2000 Units / Box

    MC74HC02ANG PDIP14(PbFree)

    2000 Units / Box

    MC74HC02AD SOIC14 55 Units / Rail

    MC74HC02ADG SOIC14(PbFree)

    55 Units / Rail

    MC74HC02ADR2 SOIC14 2500 Units / Reel

    MC74HC02ADR2G SOIC14(PbFree)

    2500 Units / Reel

    MC74HC02ADT TSSOP14* 96 Units / Rail

    MC74HC02ADTR2 TSSOP14* 2500 Units / Reel

    For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.

    *This package is inherently PbFree.

    Figure 1. Switching Waveforms

    tf trVCC

    GND

    90%50%10%

    90%50%

    10%

    INPUT A OR B

    OUTPUT Y

    tPHL tPLH

    tTLH tTHL *Includes all probe and jig capacitance

    Figure 2. Test Circuit

    CL *

    TEST POINT

    DEVICEUNDERTEST

    OUTPUT

    EXPANDED LOGIC DIAGRAM(1/4 OF THE DEVICE)

    Y

    A

    B

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    Semiconductor Components Industries, LLC, 2000

    March, 2000 Rev. 8

    35 Publication Order Number:

    MC74HC03A/D

    MC74HC03A

    Quad 2Input NAND Gatewith OpenDrain OutputsHighPerformance SiliconGate CMOS

    The MC74HC03A is identical in pinout to the LS03. The deviceinputs are compatible with Standard CMOS outputs; with pullupresistors, they are compatible with LSTTL outputs.

    The HC03A NAND gate has, as its outputs, a highperformanceMOS NChannel transistor. This NAND gate can, therefore, with asuitable pullup resistor, be used in wiredAND applications. Havingthe output characteristic curves given in this data sheet, this device canbe used as an LED driver or in any other application that only requiresa sinking current. Output Drive Capability: 10 LSTTL Loads With Suitable Pullup

    Resistor Outputs Directly Interface to CMOS, NMOS and TTL High Noise Immunity Characteristic of CMOS Devices Operating Voltage Range: 2 to 6V Low Input Current: 1 A In Compliance With the JEDEC Standard No. 7A Requirements Chip Complexity: 28 FETs or 7 Equivalent GatesDESIGN GUIDE

    Criteria Value Unit

    Internal Gate Count* 7.0 ea

    Internal Gate Propagation Delay 1.5 ns

    Internal Gate Power Dissipation 5.0 W

    Speed Power Product 0.0075 pJ

    * Equivalent to a twoinput NAND gate

    PIN 14 = VCCPIN 7 = GND* Denotes opendrain outputs

    LOGIC DIAGRAM

    3,6,8,11 Y*

    1,4,9,12 A

    2,5,10,13B

    OUTPUTPROTECTION

    DIODE

    VCC

    Pinout: 14Lead Packages (Top View)

    1314 12 11 10 9 8

    21 3 4 5 6 7

    VCC B4 A4 Y4 B3 A3 Y3

    A1 B1 Y1 A2 B2 Y2 GND

    Device Package Shipping

    ORDERING INFORMATION

    MC74HC03AN PDIP14 2000 / Box

    MC74HC03AD SOIC14

    http://onsemi.com

    55 / Rail

    MC74HC03ADR2 SOIC14 2500 / Reel

    MARKINGDIAGRAMS

    A = Assembly LocationWL or L = Wafer LotYY or Y = YearWW or W = Work Week

    MC74HC03ADT TSSOP14 96 / Rail

    MC74HC03ADTR2 TSSOP14 2500 / Reel

    TSSOP14DT SUFFIXCASE 948G

    HC03A

    ALYW

    1

    14

    1

    14PDIP14

    N SUFFIXCASE 646

    MC74HC03ANAWLYYWW

    SOIC14D SUFFIX

    CASE 751A

    1

    14

    HC03AAWLYWW

    LLHH

    LHLH

    FUNCTION TABLE

    Inputs Output

    A B

    ZZZL

    Y

    Z = High Impedance

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    36

    MAXIMUM RATINGS*

    Symbol

    Parameter

    Value

    Unit

    VCC

    DC Supply Voltage (Referenced to GND)

    0.5 to + 7.0

    V

    Vin

    DC Input Voltage (Referenced to GND)

    0.5 to V CC + 0.5

    V

    Vout

    DC Output Voltage (Referenced to GND)

    0.5 to V CC + 0.5

    V

    Iin

    DC Input Current, per Pin

    20

    mA

    Iout

    DC Output Current, per Pin

    25

    mA

    ICC

    DC Supply Current, V CC and GND Pins

    50

    mA

    P D

    Power Dissipation in Still Air Plastic DIPSOIC Package

    TSSOP Package

    750500450

    mW

    Tstg

    Storage Temperature

    65 to + 150

    C

    TL

    Lead Temperature, 1 mm from Case for 10 SecondsPlastic DIP, SOIC or TSSOP Package

    260

    C

    *Maximum Ratings are those values beyond which damage to the device may occur.Functional operation should be restricted to the Recommended Operating Conditions.

    Derating Plastic DIP: 10 mW/ C from 65 to 125 CSOIC Package: 7 mW/ C from 65 to 125 CTSSOP Package: 6.1 mW/ C from 65 to 125 C

    For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).

    RECOMMENDED OPERATING CONDITIONS

    Symbol

    Parameter

    Min

    Max

    Unit

    VCC

    DC Supply Voltage (Referenced to GND)

    2.0

    6.0

    V

    Vin, Vout

    DC Input Voltage, Output Voltage (Referenced to GND)

    0

    VCC

    V

    TA

    Operating Temperature, All Package Types

    55

    + 125

    C

    tr, tf

    Input Rise and Fall Time V CC = 2.0 V(Figure 1) V CC = 4.5 V

    VCC = 6.0 V

    000

    1000500400

    ns

    DC CHARACTERISTICS (Voltages Referenced to GND)

    V Guaranteed Limit

    Symbol Parameter Condition V 55 to 25 C 85 C 125 C Unit

    VIH Minimum HighLevel InputVoltage

    Vout = 0.1V or V CC 0.1V|Iout | 20 A

    2.03.04.56.0

    1.502.103.154.20

    1.502.103.154.20

    1.502.103.154.20

    V

    VIL Maximum LowLevel InputVoltage

    Vout = 0.1V or V CC 0.1V|Iout | 20 A

    2.03.04.56.0

    0.500.901.351.80

    0.500.901.351.80

    0.500.901.351.80

    V

    VOL Maximum LowLevel OutputVoltage

    Vout = 0.1V or V CC 0.1V|Iout | 20 A

    2.04.56.0

    0.10.10.1

    0.10.10.1

    0.10.10.1

    V

    Vin = VIH or VIL |Iout | 2.4mA|Iout | 4.0mA|Iout | 5.2mA

    3.04.56.0

    0.260.260.26

    0.330.330.33

    0.400.400.40

    Iin Maximum Input Leakage Current V in = VCC or GND 6.0 0.1 1.0 1.0 A

    ICC Maximum Quiescent SupplyCurrent (per Package)

    Vin = VCC or GNDIout = 0 A

    6.0 1.0 10 40 A

    IOZ Maximum ThreeState LeakageCurrent

    Output in HighImpedance StateVin = VIL or VIHVout = VCC or GND

    6.0 0.5 5.0 10 A

    NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).

    This device contains protectioncircuitry to guard against damagedue to high static voltages or electricfields. However, precautions mustbe taken to avoid applications of anyvoltage higher than maximum ratedvoltages to this highimpedance cir-cuit. For proper operation, V in andVout should be constrained to therange GND v (Vin or Vout ) v VCC .

    Unused inputs must always betied to an appropriate logic voltagelevel (e.g., either GND or V CC ).Unused outputs must be left open.

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    37

    AC CHARACTERISTICS (CL = 50pF, Input t r = tf = 6ns)

    Guaranteed Limit

    Symbol ParameterCCV 55 to 25 C 85 C 125 C Unit

    tPLZ,tPZL

    Maximum Propagation Delay, Input A or B to Output Y(Figures 1 and 2)

    2.03.04.56.0

    120452420

    150603026

    180753631

    ns

    tTLH,tTHL

    Maximum Output Transition Time, Any Output(Figures 1 and 2)

    2.03.04.56.0

    75271513

    95321916

    110362219

    ns

    Cin Maximum Input Capacitance 10 10 10 pF

    Cout Maximum ThreeState Output Capacitance(Output in HighImpedance State)

    10 10 10 pF

    NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ONSemiconductor HighSpeed CMOS Data Book (DL129/D).

    Typical @ 25 C, V CC = 5.0 V, V EE = 0 V

    CPD Power Dissipation Capacitance (Per Buffer)* 8.0 pF

    * Used to determine the noload dynamic power consumption: P D = CPD VCC 2f + ICC VCC . For load considerations, see Chapter 2 of theON Semiconductor HighSpeed CMOS Data Book (DL129/D).

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    38

    Figure 1. Switching Waveforms

    CL *

    *Includes all probe and jig capacitance

    TESTPOINTDEVICE

    UNDERTEST

    OUTPUT

    Figure 2. Test Circuit

    1k Rpd

    VCC

    INPUT A90%50%10%

    tftr

    GND

    VCC

    OUTPUT Y

    tPZL

    tTHL

    HIGHIMPEDANCE

    VOL 10%

    tPLZ

    90%50%10%

    VO, OUTPUT VOLTAGE (VOLTS)0 1 2 3 4 5

    0

    5

    10

    15

    20

    25

    I D , S

    I N K C U R R E N T ( m A )

    Figure 3. OpenDrain Output Characteristics

    A1

    B1

    A2

    B2

    An

    Bn

    1/4HC03

    1/4

    HC03

    1/4HC03

    Y1

    Y2

    Yn

    TYPICAL T=25C

    T=25C

    T=85C

    T=125C

    EXPECTED MINIMUM*

    VCC =5V

    *The expected minimum curves are not guarantees, but are design aids.

    VCC

    PULLUPRESISTOR

    OUTPUT

    OUTPUT = Y1 Y2 . . . Yn= A1B1 A2B2 . . . AnBn

    Figure 4. Wired AND

    LED11/4

    HC03

    LED2

    LEDENABLE

    VCC+

    VR+

    VF

    1/4HC03

    VCC

    DESIGN EXAMPLECONDITIONS: I

    D^ 10mA

    USING FIGURE NO TAG TYPICAL CURVE, at ID=10mA, VDS^ 0.4V

    N R +VCC * VF * VO

    ID

    + 5V* 1.7V* 0.4V10mA

    USE R = 270

    + 290W

    Figure 5. LED Driver With Blanking

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    Semiconductor Components Industries, LLC, 2004

    November, 2004 Rev. 9

    39 Publication Order Number:

    MC74HC04A/D

    MC74HC04A

    Hex InverterHighPerformance SiliconGate CMOS

    The MC74HC04A is identical in pinout to the LS04 and theMC14069. The device inputs are compatible with Standard CMOSoutputs; with pullup resistors, they are compatible with LSTTLoutputs.

    The device consists of six threestage inverters.

    Features Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS and TTL Operating Voltage Range: 2 to 6V Low Input Current: 1 mA High Noise Immunity Characteristic of CMOS Devices

    In Compliance With the JEDEC Standard No. 7A Requirements Chip Complexity: 36 FETs or 9 Equivalent Gates PbFree Packages are Available*

    LOGIC DIAGRAM

    Y1 A1

    A2

    A3

    A4

    A5

    A6

    Y2

    Y3

    Y4

    Y5

    Y6

    1

    3

    5

    9

    11

    13

    2

    4

    6

    8

    10

    12

    Y = A

    Pinout: 14Lead Packages (Top View)

    1314 12 11 10 9 8

    21 3 4 5 6 7

    VCC A6 Y6 A5 Y5 A4 Y4

    A1 Y1 A2 Y2 A3 Y3 GND

    *For additional information on our PbFree strategy and soldering details, pleasedownload the ON Semiconductor Soldering and Mounting TechniquesReference Manual, SOLDERRM/D.

    MARKING DIAGRAMS

    A = Assembly LocationWL or L = Wafer LotYY or Y = YearWW or W = Work Week

    TSSOP14DT SUFFIXCASE 948G

    HC04A

    ALYW

    1

    14

    PDIP14N SUFFIXCASE 646

    SOIC14D SUFFIX

    CASE 751A

    LH

    FUNCTION TABLEInputs Outputs

    A

    HL

    Y

    See detailed ordering and shipping information in the packagedimensions section on pag e 40 of this data sheet.

    ORDERING INFORMATION

    MC74HC04ANAWLYYWW

    1

    14

    HC04A

    AWLYWW

    1

    14

    http://onsemi.com

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    MC74HC04A

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    40

    MAXIMUM RATINGS

    Symbol

    Parameter

    Value

    Unit

    VCC

    DC Supply Voltage (Referenced to GND)

    0.5 to + 7.0

    V

    Vin

    DC Input Voltage (Referenced to GND)

    0.5 to V CC + 0.5

    V

    Vout

    DC Output Voltage (Referenced to GND)

    0.5 to V CC + 0.5

    V

    Iin

    DC Input Current, per Pin

    20

    mA

    Iout

    DC Output Current, per Pin

    25

    mA

    ICC

    DC Supply Current, V CC and GND Pins

    50

    mA

    P D

    Power Dissipation in Still Air, Plastic DIPSOIC Package

    TSSOP Package

    750500450

    mW

    Tstg

    Storage Temperature

    65 to + 150

    C

    TL

    Lead Temperature, 1 mm from Case for 10 SecondsPlastic DIP, SOIC or TSSOP Package

    260

    C

    This device contains protection circuitry to guard against damage due to high static voltages or electric f ields. However, precautions mustbe taken to avoid applications of any voltage higher than maximum rated voltages to this highimpedance circuit. For proper operation,Vin and V out should be constrained to the range GND v (Vin or Vout ) v VCC . Unused inputs must always be tied to an appropriate logicvoltage level (e.g., either GND or V CC ). Unused outputs must be left open.

    Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limitvalues (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,damage may occur and reliability may be affected.Derating Plastic DIP: 10 mW/ C from 65 to 125 C

    SOIC Package: 7 mW/ C from 65 to 125 CTSSOP Package: 6.1 mW/ C from 65 to 125 C

    For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).

    RECOMMENDED OPERATING CONDITIONS

    Symbol

    Parameter

    Min

    Max

    Unit

    VCC

    DC Supply Voltage (Referenced to GND)

    2.0

    6.0

    V

    Vin, Vout

    DC Input Voltage, Output Voltage (Referenced to GND)

    0

    VCC

    V

    TA

    Operating Temperature, All Package Types

    55

    + 125

    C

    tr, tf

    Input Rise and Fall Time V CC = 2.0 V(Figure 1) V CC = 4.5 VVCC = 6.0 V

    000

    1000500400

    ns

    ORDERING INFORMATION

    Device Order Number Package Shipping

    MC74HC04AN PDIP14 2000 / Box

    MC74HC04ANG PDIP14(PbFree)

    2000 / Box

    MC74HC04AN SOIC14 55 / Rail

    MC74HC04ADR2 SOIC14 2500 / Tape & Reel

    MC74HC04ADR2G SOIC14(PbFree)

    2500 / Tape & Reel

    MC74HC04ADT TSSOP14*(PbFree)

    96 / Rail

    MC74HC04ADTR2 TSSOP14*(PbFree)

    2500 / Tape & Reel

    For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.

    *This package is inherently PbFree.

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    MC74HC04A

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    41

    DC CHARACTERISTICS (Voltages Referenced to GND)

    Guaranteed Limit

    Symbol Parameter ConditionCCV 55 to 25 C 85 C 125 C Unit

    VIH Minimum HighLevel InputVoltage

    Vout = 0.1V or V CC 0.1V|Iout | 20 mA

    2.03.04.56.0

    1.502.103.154.20

    1.502.103.154.20

    1.502.103.154.20

    V

    VIL Maximum LowLevel InputVoltage

    Vout = 0.1V or V CC 0.1V|Iout | 20 mA

    2.03.04.56.0

    0.500.901.351.80

    0.500.901.351.80

    0.500.901.351.80

    V

    VOH Minimum HighLevel OutputVoltage

    Vin = VIH or VIL|Iout | 20 mA

    2.04.56.0

    1.94.45.9

    1.94.45.9

    1.94.45.9

    V

    Vin =VIH or VIL |Iout | 2.4mA|Iout | 4.0mA|Iout | 5.2mA

    3.04.56.0

    2.483.985.48

    2.343.845.34

    2.203.705.20

    VOL Maximum LowLevel OutputVoltage

    Vin = VIH or VIL|Iout | 20 mA

    2.04.56.0

    0.10.10.1

    0.10.10.1

    0.10.10.1

    V

    Vin = VIH or VIL |Iout | 2.4mA|Iout | 4.0mA|Iout | 5.2mA

    3.04.56.0

    0.260.260.26

    0.330.330.33

    0.400.400.40

    Iin Maximum Input LeakageCurrent

    Vin = VCC or GND 6.0 0.1 1.0 1.0 mA

    ICC Maximum Quiescent SupplyCurrent (per Package)

    Vin = VCC or GNDIout = 0 mA

    6.0 1.0 10 40 mA

    NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).

    AC CHARACTERISTICS (CL = 50pF, Input t r = tf = 6ns)

    Guaranteed Limit

    Symbol ParameterCCV 55 to 25 C 85 C 125 C Unit

    tPLH ,tPHL

    Maximum Propagation Delay, Input A or B to Output Y(Figures 1 and 2)

    2.03.04.56.0

    75301513

    95401916

    110552219

    ns

    tTLH,tTHL

    Maximum Output Transition Time, Any Output(Figures 1 and 2)

    2.03.04.56.0

    75271513

    95321916

    110362219

    ns

    Cin Maximum Input Capacitance 10 10 10 pF

    NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ONSemiconductor HighSpeed CMOS Data Book (DL129/D).

    Typical @ 25 C, VCC = 5.0 V

    CPD Power Dissipation Capacitance (Per Inverter)* 20 pF

    * Used to determine the noload dynamic power consumption: P D = C PD VCC 2f + ICC VCC . For load considerations, see Chapter 2 of theON Semiconductor HighSpeed CMOS Data Book (DL129/D).

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    Figure 1. Switching Waveforms

    GND

    VCC

    OUTPUT Y

    INPUT A

    CL *

    *Includes all probe and jig capacitance

    TESTPOINT

    90%

    50%10%

    tTLH

    DEVICEUNDERTEST

    OUTPUT

    Figure 2. Test Circuit

    Y A

    Figure 3. Expanded Logic Diagram(1/6 of the Device Shown)

    tTHL

    90%50%

    10%

    tPLH tPHL

    tf tr

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    Semiconductor Components Industries, LLC, 2000

    March, 2000 Rev. 8

    43 Publication Order Number:

    MC74HC08A/D

    MC74HC08A

    Quad 2Input AND GateHighPerformance SiliconGate CMOS

    The MC74HC08A is identical in pinout to the LS08. The deviceinputs are compatible with Standard CMOS outputs; with pullupresistors, they are compatible with LSTTL outputs.

    Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS and TTL Operating Voltage Range: 2 to 6V Low Input Current: 1 A High Noise Immunity Characteristic of CMOS Devices In Compliance With the JEDEC Standard No. 7A Requirements Chip Complexity: 24 FETs or 6 Equivalent Gates

    3 Y1

    1 A1

    PIN 14 = VCCPIN 7 = GND

    LOGIC DIAGRAM

    2B1

    6 Y2

    4 A2

    5B2

    8 Y3

    9 A3

    10B3

    11 Y4

    12 A4

    13B4

    Y = AB

    Pinout: 14Lead Packages (Top View)

    1314 12 11 10 9 8

    21 3 4 5 6 7

    VCC B4 A4 Y4 B3 A3 Y3

    A1 B1 Y1 A2 B2 Y2 GND

    Device Package Shipping

    ORDERING INFORMATION

    MC74HC08AN PDIP14 2000 / Box

    MC74HC08AD SOIC14

    http://onsemi.com

    55 / Rail

    MC74HC08ADR2 SOIC14 2500 / Reel

    MARKINGDIAGRAMS

    A = Assembly LocationWL or L = Wafer LotYY or Y = YearWW or W = Work Week

    MC74HC08ADT TSSOP14 96 / Rail

    MC74HC08ADTR2 TSSOP14 2500 / Reel

    TSSOP14DT SUFFIXCASE 948G

    HC08A

    ALYW

    1

    14

    1

    14PDIP14

    N SUFFIXCASE 646

    MC74HC08ANAWLYYWW

    SOIC14D SUFFIX

    CASE 751A1

    14

    HC08AAWLYWW

    LLHH

    LHLH

    FUNCTION TABLE

    Inputs Output

    A B

    LLLH

    Y

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    MAXIMUM RATINGS*

    Symbol

    Parameter

    Value

    Unit

    VCC

    DC Supply Voltage (Referenced to GND)

    0.5 to + 7.0

    V

    Vin

    DC Input Voltage (Referenced to GND)

    0.5 to V CC + 0.5

    V

    Vout

    DC Output Voltage (Referenced to GND)

    0.5 to V CC + 0.5

    V

    Iin

    DC Input Current, per Pin

    20

    mA

    Iout

    DC Output Current, per Pin

    25

    mA

    ICC

    DC Supply Current, V CC and GND Pins

    50

    mA

    P D

    Power Dissipation in Still Air, Plastic DIPSOIC Package

    TSSOP Package

    750500450

    mW

    Tstg

    Storage Temperature

    65 to + 150

    C

    TL

    Lead Temperature, 1 mm from Case for 10 SecondsPlastic DIP, SOIC or TSSOP Package

    260

    C

    *Maximum Ratings are those values beyond which damage to the device may occur.Functional operation should be restricted to the Recommended Operating Conditions.

    Derating Plastic DIP: 10 mW/ C from 65 to 125 CSOIC Package: 7 mW/ C from 65 to 125 CTSSOP Package: 6.1 mW/ C from 65 to 125 C

    For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).

    RECOMMENDED OPERATING CONDITIONS

    Symbol

    Parameter

    Min

    Max

    Unit

    VCC

    DC Supply Voltage (Referenced to GND)

    2.0

    6.0

    V

    Vin, Vout

    DC Input Voltage, Output Voltage (Referenced to GND)

    0

    VCC

    V

    TA

    Operating Temperature, All Package Types

    55

    + 125

    C

    tr, tf

    Input Rise and Fall Time V CC = 2.0 V(Figure 1) V CC = 4.5 V

    VCC = 6.0 V

    000

    1000500400

    ns

    This device contains protectioncircuitry to guard against damagedue to high static voltages or electricfields. However, precautions mustbe taken to avoid applications of anyvoltage higher than maximum ratedvoltages to this highimpedance cir-cuit. For proper operation, V in andVout should be constrained to therange GND v (Vin or Vout ) v VCC .

    Unused inputs must always betied to an appropriate logic voltagelevel (e.g., either GND or V CC ).Unused outputs must be left open.

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    DC CHARACTERISTICS (Voltages Referenced to GND)

    Guaranteed Limit

    Symbol Parameter ConditionCCV 55 to 25 C 85 C 125 C Unit

    VIH Minimum HighLevel InputVoltage

    Vout = 0.1V or V CC 0.1V|Iout | 20 A

    2.03.04.56.0

    1.502.103.154.20

    1.502.103.154.20

    1.502.103.154.20

    V

    VIL Maximum LowLevel InputVoltage

    Vout = 0.1V or V CC 0.1V|Iout | 20 A

    2.03.04.56.0

    0.500.901.351.80

    0.500.901.351.80

    0.500.901.351.80

    V

    VOH Minimum HighLevel OutputVoltage

    Vin = VIH or VIL|Iout | 20 A

    2.04.56.0

    1.94.45.9

    1.94.45.9

    1.94.45.9

    V

    Vin =VIH or VIL |Iout | 2.4mA|Iout | 4.0mA|Iout | 5.2mA

    3.04.56.0

    2.483.985.48

    2.343.845.34

    2.203.705.20

    VOL Maximum LowLevel OutputVoltage

    Vin = VIH or VIL|Iout | 20 A

    2.04.56.0

    0.10.10.1

    0.10.10.1

    0.10.10.1

    V

    Vin = VIH or VIL |Iout | 2.4mA|Iout | 4.0mA|Iout | 5.2mA

    3.04.56.0

    0.260.260.26

    0.330.330.33

    0.400.400.40

    Iin Maximum Input LeakageCurrent

    Vin = VCC or GND 6.0 0.1 1.0 1.0 A

    ICC Maximum Quiescent SupplyCurrent (per Package)

    Vin = VCC or GNDIout = 0 A

    6.0 1.0 10 40 A

    NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).

    AC CHARACTERISTICS (CL = 50pF, Input t r = tf = 6ns)

    Guaranteed Limit

    Symbol ParameterCCV 55 to 25 C 85 C 125 C Unit

    tPLH ,tPHL

    Maximum Propagation Delay, Input A or B to Output Y(Figures 1 and 2)

    2.03.04.56.0

    75301513

    95401916

    110552219

    ns

    tTLH,tTHL

    Maximum Output Transition Time, Any Output(Figures 1 and 2)

    2.03.04.56.0

    75271513

    95321916

    110362219

    ns

    Cin Maximum Input Capacitance 10 10 10 pF

    NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ONSemiconductor HighSpeed CMOS Data Book (DL129/D).

    Typical @ 25 C, V CC = 5.0 V, V EE = 0 V

    CPD Power Dissipation Capacitance (Per Buffer)* 20 pF

    * Used to determine the noload dynamic power consumption: P D = C PD VCC 2f + ICC VCC . For load considerations, see Chapter 2 of theON Semiconductor HighSpeed CMOS Data Book (DL129/D).

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    Figure 1. Switching Waveforms

    OUTPUT Y

    INPUT A OR B

    CL *

    *Includes all probe and jig capacitance

    TESTPOINT

    90%

    50%10%

    tTLH

    DEVICEUNDERTEST

    OUTPUT

    Figure 2. Test Circuit

    Y A

    B

    Figure 3. Expanded Logic Diagram(1/4 of the Device)

    tTHL

    tPLH tPHL

    tr tf

    GND

    VCC90%50%

    10%

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    Semiconductor Components Industries, LLC, 2000

    March, 2000 Rev. 9

    47 Publication Order Number:

    MC74HC125A/D

    MC74HC125A,MC74HC126A

    Quad 3State NoninvertingBuffersHighPerformance SiliconGate CMOS

    The MC74HC125A and MC74HC126A are identical in pinout tothe LS125 and LS126. The device inputs are compatible with standardCMOS outputs; with pullup resistors, they are compatible withLSTTL outputs.

    The HC125A and HC126A noninverting buffers are designed to beused with 3state memory address drivers, clock drivers, and otherbusoriented systems. The devices have four separate output enablesthat are activelow (HC125A) or activehigh (HC126A).

    Output Drive Capability: 15 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 A High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard

    No. 7A Chip Complexity: 72 FETs or 18 Equivalent Gates

    LOGIC DIAGRAMHC125A

    ActiveLow Output EnablesHC126A

    ActiveHigh Output Enables

    Y1

    Y2

    Y4

    3

    6

    8

    11

    13

    12

    10

    9

    4

    5

    1

    2 A1

    OE1

    A2

    OE2

    A3

    OE3

    A4

    OE4

    PIN 14 = VCCPIN 7 = GND

    A1

    OE1

    A2

    OE2

    A3

    OE3

    A4

    OE4

    Y3

    Y1

    Y2

    Y4

    Y3

    13

    12

    10

    9

    4

    5

    1

    2 3

    6

    8

    11

    FUNCTION TABLE

    HC125AInputs Output

    A OE Y

    H L HL L LX H Z

    HC126AInputs Output

    A OE Y

    H H HL H LX L Z

    Device Package Shipping

    ORDERING INFORMATION

    MC74HC12xAN PDIP14 2000 / Box

    MC74HC12xAD SOIC14

    http://onsemi.com

    55 / Rail

    MC74HC12xADR2 SOIC14 2500 / Reel

    MARKINGDIAGRAMS

    A = Assembly LocationWL or L = Wafer LotYY or Y = YearWW or W = Work Week

    MC74HC12xADT TSSOP14 96 / Rail

    MC74HC12xADTR2 TSSOP14 2500 / Reel

    TSSOP14DT SUFFIXCASE 948G

    HC12xAALYW

    1

    14

    1

    14PDIP14

    N SUFFIXCASE 646

    MC74HC12xANAWLYYWW

    SOIC14D SUFFIX

    CASE 751A

    1

    14

    HC12xA

    AWLYWW

    PIN ASSIGNMENT

    11

    12

    13

    14

    8

    9

    105

    4

    3

    2

    1

    7

    6

    OE3

    Y4

    A4

    OE4

    VCC

    Y3

    A3

    OE2

    Y1

    A1

    OE1

    GND

    Y2

    A2

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    MAXIMUM RATINGS*

    Symbol

    Parameter

    Value

    Unit

    VCC

    DC Supply Voltage (Referenced to GND)

    0.5 to + 7.0

    V

    Vin

    DC Input Voltage (Referenced to GND)

    0.5 to V CC + 0.5

    V

    Vout

    DC Output Voltage (Referenced to GND)

    0.5 to V CC + 0.5

    V

    Iin

    DC Input Current, per Pin

    20

    mA

    Iout

    DC Output Current, per Pin

    35

    mA

    ICC

    DC Supply Current, V CC and GND Pins

    75

    mA

    P D

    Power Dissipation in Still Air Plastic DIPSOIC Package

    TSSOP Package

    750500450

    mW

    Tstg

    Storage Temperature

    65 to + 150

    C

    TL

    Lead Temperature, 1 mm from Case for 10 Seconds(Plastic DIP, SOIC or TSSOP Package)

    260

    C

    *Maximum Ratings are those values beyond which damage to the device may occur.Functional operation should be restricted to the Recommended Operating Conditions.

    Derating Plastic DIP: 10 mW/ C from 65 to 125 CSOIC Package: 7 mW/ C from 65 to 125 CTSSOP Package: 6.1 mW/ C from 65 to 125 C

    For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).

    RECOMMENDED OPERATING CONDITIONS

    Symbol

    Parameter

    Min

    Max

    Unit

    VCC

    DC Supply Voltage (Referenced to GND)

    2.0

    6.0

    V

    Vin, Vout

    DC Input Voltage, Output Voltage(Referenced to GND)

    0

    VCC

    V

    TA

    Operating Temperature, All Package Types

    55

    + 125

    C

    tr, tf

    Input Rise and Fall Time V CC = 2.0 V(Figure 1) V CC = 4.5 V

    VCC = 6.0 V

    000

    1000500400

    ns

    DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

    Guaranteed Limit

    Symbol

    Parameter

    Test Conditions

    VCCV

    55 to25 C

    v 85 C

    v 125 C

    Unit

    VIH

    Minimum HighLevel InputVoltage

    Vout = VCC 0.1 V|Iout | v 20 A

    2.03.04.56.0

    1.52.1

    3.154.2

    1.52.1

    3.154.2

    1.52.1

    3.154.2

    V

    VIL

    Maximum LowLevel InputVoltage

    Vout = 0.1 V|Iout | v 20 A

    2.03.04.56.0

    0.50.9

    1.351.8

    0.50.9

    1.351.8

    0.50.9

    1.351.8

    V

    VOH

    Minimum HighLevel OutputVoltage

    Vin = VIH|Iout | v 20 A

    2.04.56.0

    1.94.45.9

    1.94.45.9

    1.94.45.9

    V

    Vin = VIH |Iout | v 3.6 mA

    |Iout | v 6.0 mA|Iout | v 7.8 mA

    3.0

    4.56.0

    2.48

    3.985.48

    2.34

    3.845.34

    2.2

    3.75.2

    VOL

    Maximum LowLevel OutputVoltage

    Vin = VIL|Iout | v 20 A

    2.04.56.0

    0.10.10.1

    0.10.10.1

    0.10.10.1

    V

    Vin = VIL |Iout | v 3.6 mA|Iout | v 6.0 mA|Iout | v 7.8 mA

    3.04.56.0

    0.260.260.26

    0.330.330.33

    0.40.40.4

    This device contains protectioncircuitry to guard against damagedue to high static voltages or electricfields. However, precautions mustbe taken to avoid applications of anyvoltage higher than maximum ratedvoltages to this highimpedance cir-cuit. For proper operation, V in andVout should be constrained to therange GND v (Vin or Vout ) v VCC .

    Unused inputs must always betied to an appropriate logic voltagelevel (e.g., either GND or V CC ).Unused outputs must be left open.

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    MC74HC125A, MC74HC126A

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    50

    SWITCHING WAVEFORMS

    Figure 1.

    Figure 2.

    OUTPUT Y

    50%

    50%

    50%

    50%90%

    10%

    VCC

    VCC

    GND

    GND

    HIGHIMPEDANCE

    VOL

    VOH

    OUTPUT Y

    OUTPUT Y