inmold electronics - kimw

Title: InMold electronicsStart: November 2019Term: 2 yearsCosts: 5.900 € p.a.*

Invoices are issued in two instalments. The first instal-ment due on start of the project, the second one is payable after one year.

*Member companies of the supporting organisation ofthe Kunststoff-Institut Lüdenscheid will have to contri-bute ten percent less.

Lateral entry is possibleEven after project start a lateral entry is possible at anytime.

Project data

You have access to further information on the projectcontent and its course via our website or direct contact:

Laura Waltermann+49 (0) 23 51.10 [email protected]

Dipl.-Ing. Dominik Malecha+49 (0) 23 51.10 [email protected]

Information

Kunststoff-Institut für die mittelständische Wirtschaft NRW GmbH

(K.I.M.W.)Karolinenstraße 8 | 58507 Lüdenscheid

Tel.: +49 (0) 23 51.10 64-191Fax: +49 (0) 23 51.10 64-190

www.kunststoff -institut.de | mail@kunststoff -institut.de

InMold electronics

The aim of the project is that the participants can identify new processes for the production of InMold electronics (e.g. Printed Electronics, 3D MID, etc.)and also reliably evaluate and test them.

This is supported by a definition of standards in the area of testing, which are absolutely necessary for a safe evaluation and risk minimization during usage.

Aim of the project

Research on processes for InMold electronicsBenchmark of available technologies and update

on all innovations in the industrySummary of the results for the optimal process and

material for InMold electronics, incl. sample parts

Testing technologyDevelopment and compilation of a test overview

especially for InMold electronicsPerformance of tests according to the regulations

of automotive & non-automotive OEMs in the field of decorative and electronic components

Planned workshop with OEM participation and lea-ding testing institutes

General informationTwo project meetings per year for up to two people

per company Exchange of experience and networking with the

other project participantsPresentations by external speakers on special is-

suesAccess to results and presentations of previous

projects: Printed Electronics 1 and 2Documentation of the project results in english

Project services

New methods | Combined testing technology

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Privacy information:The responsibility for the consignation of this fl yer lies with the Kunststoff -Institut Lüdenscheid. The consignation was made because of your interest in news concerning our company. More information about data collection can be found on www.kunststoff -institut.de. You also have the right to object at any time to the processing of personal data for this purpose. Please send the objection to Kunststoff -Institut Lüdenscheid, Karolinenstraße 8, D-58507 Lüdenscheid, Phone +49 (0) 23 51.10 64-191 or mail@kunststoff -institut.de. For more information about data protec-tion please contact datenschutz@kunststoff -institut.de

Despite the status of a fast-growing technology field,printed electronics is not without challenges.

Choosing the optimal manufacturing process in com-bination with a suitable base material belong to the-se challenges. Always in the focus is saving resources, environmental compatibility as well as economic effi-ciency. Based on this fundament, the project InMold electronics is about the selection and characterization of suitable methods for the production of functionalized and simultaneously decorative plastic moldings. Latest test specifications are analyzed and combined. Further-more it is planned to develop new regulations.

Depending on the course of the project and the interest of the participants, it is planned to investigate new pos-sibilities for contacting and present demonstrators for selected processes.

Introduction

Content InMold electronics

Project focuses

Research of alternative methods for the produc-tion of InMold electronicsWithin the scope of the previous projects Printed Elec-tronics 1 and 2, the classic film back injection molding with printed conductor paths was examined in detail.In the newest project further processes for the pro-duction of InMold electronics should be identified, te-sted regarding to their applicability and subjected to a benchmark.

The following methods will be considered:Classic MID manufacturing processesMetal direct injectionAdaptation of manufacturing processes for conven-

tional printed circuit boardsA new patent pending process from the Kunststoff-

Institut…

Particular attention will also be given to process modi-fications and process combinations.

Demonstrator during climate constant storage

Combined tests/test specificationsFor classic components, the tests, that have to be performed, are clearly defined.

InMold electronics is such a young technology that there are no test specifications or they are still unknown to the plastic manufacturer. Two technolo-gies are combined, the decorative and the electrical component. Regarding to us, a simple addition of the existing test specifications is no useful solution.Aim of this part of the project:

Compilation of valid OEM test specifications for decorated and electronic components

Modification and combination of reasonable test specifications

Redefinition of necessary tests

In this context, an active dialogue with leading OEMs and TIERs is planned, including joint workshops.

Practical investigationsBased on the results of the research and the elabora-tion of the test specifications, practical investigations ensue. Suitable tests (climate change test, sun expo-sure, surface tests, etc.) are performed on selected InMold electronics components. Project participants have the possibility to provide their own components for the tests. If required, the results will be presen-ted in anonymous form.

What is a joint project?In a joint project, the institute does comprehensive researchfor participating companies within innovative fields of in-terest. This is close to practice, with a high amount of techni-cal know-how and is funded by the participants` contributiononly.

Advantages of a joint study Cost sharing = low contributions per participant Participating companies save personnel and costs Technological market leadership Networking Interdisciplinary exchange of experience Employee training and qualification

Time and cost intensive investigations as well as the orga-nisation are carried out exclusively by the institute. The in-volvement of company employees is, at minimum, reduced to the participation at the project meetings.

SecrecyAll results are treated confidentially during the project term. Results from company-specific investigations are treated confidentially.

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Joint project "InMold electronics" 1© Kunststoff-Institut Lüdenscheid

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Joint project InMold electronics

New methods & combined testing technology

© Kunststoff-Institut Lüdenscheid

InMold electronics

11/2019Joint project "InMold Electronics" 2

► The term "InMold Electronics" refers to a large field of innovative

technologies that allow to manufacture electronic components cost-

effectively and flexibly.

BMW 730d xDrive

source: IAA 2015 + IFA 2017 & 2018, Kunststoff-Institut Lüdenscheid

Toshiba pressure cooker

Siemens automatic coffee machineEQ.9 connect

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Motivation for participation


19

17

8

2

1,6

6

0,4

2,75

Expected market share of printed electronics components in billion $ in 2020

OLED Displays & Lighting

Photovoltaic

Transistors

Inks

sensors

E-paper displays

inorganic electroluminescence

Batteries, other displays, etc.based on data from IDTechEx

Total:56,75 billion $ in 2020


Motivation for participation


► A new technology:

innovations and updates in the field of InMold electronics will be presented

these new processes should then be able to be safely evaluated and tested

little knowledge in the industry in the field of testing technology stands against a growing demand for the integration of InMold electronic components.

a concrete customer requirement (!)

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Aim of the project


► update and benchmark on various manufacturing processes in the field of InMold electronics

► it is planned to present demonstrators for selected processes

► the focus is always on the careful use of resources and environmental compatibility, as well as economic efficiency

► a test overview especially for InMold electronic components will be created

► various tests according to OEM standards are performed on selected IME components in order to systematically identify possible weak points

► redefinition of necessary tests in a planned workshop with participation of OEMs and leading testing institutes


Structured approach : Work Packages


1. Research of alternative processes for the production of InMoldelectronics

updates on the latest innovations and existing processes

2. Combined tests and test specifications

basic test specifications of decor and electronics are compiled on the basis

of valid OEM regulations

modifications or combinations of suitable test specifications may be

redefined

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Structured approach : Work Packages


3. Practical investigations

InMold electronic components undergo relevant OEM tests


Special competences of the KIMW


► execution of two projects in the field of Printed electronics

► information from previous projects are part of the project services!

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Project Contents


Work package 1 - research, update, benchmark

Some processes have been available on the market for some time. In this project the existing processes will be analyzed and updates on the latest innovations will be provided. All processes will be benchmarked.

► overview of classic MID processes

two-component injection moulding

hot stamping

mask exposure method

laser structuring

within the scope of the previous projects Printed Electronics I & II, the classic film back injection moulding was examined in detail


Project Contents


► other procedures to be considered:

metal direct injection

adaptation of manufacturing methods for conventional printed circuit boards

a new own, patent applied process

further processes

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Project Contents


► depending on the course of the project and the interest of the participants, contact possibilities should be considered


Project Contents


Work package 2 - Test specifications

In some cases, there are currently no test specifications available or the plastic manufacturer gets to a point where such test specifications are still unknown to him.

Two technologies are combined with each other

► decorative component

► electrical component

A simple addition of the existing test specifications is not considered to be appropriate

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Project Contents


► actual recording of the test specifications to illustrate to which criteria Inmold electronics components are currently tested before series release

► modifications or combinations of appropriate test specifications may need to be redefined

► active dialogue with leading OEMs, including a joint workshop (planned)

► in conclusion a guideline is given to the project participants, on which their components can be qualified in the future


Project Contents


Work package 3 - Practical investigations

The following technologies are available at the Kunststoff-Institut within the scope of the project

layer and surface analysis

weathering tests and stress testing to simulate for the automotive environment

functional tests

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Project Contents


The results of the research and the development of the test specifications are used for selected practical investigations

Tests Content

weathering tests among other things:- climate change test- constant climatic storage- light simulation

functional testing e.g.- ball-drop test- abrasion test- media resistance

ageing of conductor paths detailed evaluation of ageing by conductivity measurements during constant climatic storage


Conclusion


The advantages of participating in a project:

► updates to new processes in the field of InMold electronics to stay up to date with the latest technology and to ensure an advantage over competitora

► demonstrators for selected processes will be presented

► transparency in the test scenarios through the development and compilation of a test overview, especially for InMold electronic components

Bonus:

► project participants have the opportunity to provide their own components for the tests. Otherwise this procedure is very expensive because of the various individual tests (can also take place in anonymous form).

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General information

► two project meetings per year for up to two persons per company (change of participants possible)

► exchange of experience and networking with other project participants

► presentations by external speakers on specific topics

► access to studies and presentations from the previous projects Printed Electronics 1 & 2



Project information


► Project information

Start: November 2019

Duration: 2 years

Costs: 5.900 € /p. a.

► Other valid documents

Project flyer

GENERAL TERMS AND CONDITIONS

Contact:

► Laura WaltermannPhone: +49 [email protected]

► Dipl.-Ing. Dominik MalechaPhone: +49 [email protected]

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Reference list JP InMold Electronics


1. ELANTAS Europe GmbH

2. Grammer Interior Components GmbH

3. H&B Electronic GmbH & Co. KG

4. Junghans Microtec GmbH

5. KH Foliotec GmbH

6. Metak GmbH & Co. KG

7. NBHX Trim Management Services GmbH

8. Osram Continental GmbH

9. REBO Lighting & Electronics GmbH

10. Röhm GmbH

11. Schaeffler Technologies AG & Co. KG

12. SMP Deutschland GmbH

If you have any further questions, please do not hesitate to contact us!

Kunststoff-Institut Lüdenscheid Laura WaltermannKarolinenstr. 8 +49 (0) 23 51.10 64-13858507 Lüdenscheid [email protected]

http://www.kunststoff-institut.de/

Kunststoff-Institut für die mittelständische Wirtschaft NRW GmbH (K.I.M.W.) | Karolinenstraße 8 | 58507 Lüdenscheid | www.kunststoff-institut.de

Kunststoff-Institut Lüdenscheid Herr Stefan Euler Karolinenstr. 8 58507 Lüdenscheid

Telefax: +49 (0) 23 51.10 64-190 E-Mail: [email protected]

Registration for joint project: InMold Electronics

Herewith we confirm our binding participation in the joint project above. Project manager: Laura Waltermann Dipl.-Ing. Dominik Malecha Project costs: 5.900 € / year* Run-time: 2 years Project start: November 2019 Documents: AGB and Project flyer *Member companys of our „Trägergesellschaft des Kunststoff-Instituts Lüdenscheid“ pay a 10 % reduced contribution.

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