l.royer – twepp 2012 @ oxford – sept. 2012 the chip signal processing for high granularity...

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L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer , J.Bonnard, S.Manen, X.Soumpholphakdy Microelectronics Rhône-Auvergne Group – IN2P3

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Page 1: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012

The chip

Signal processing for High Granularity Calorimeter

(Si-W Ecal @ ILC)

L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

Microelectronics Rhône-Auvergne Group – IN2P3

Page 2: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 20122

The International Linear Collider

(Credit: Greg Stewart, SLAC)

Time structure of the ILC: Bunchtrains of 2820 bunches spaced 337 ns Each bunch train is about 1 ms long No beam during about 199 ms

Activity of the Very Front End Electronics: During the beam activity:

analog signal processing (1ms) A the end of the beam activity:

A-to-D signal conversion (.5ms max) data transfer (.5ms max)

Idle mode during 198ms

about 99% of the time with no activity for electronics on detectors

ILC BEAM STRUCTURE

ILC “could be the next big adventure in particle physics”“It would complement the LHC at CERN and shed more light on the discoveries scientists are likely to make there in the coming years.”

[http://www.linearcollider.org/]

Analog electronics busy

1ms (.5%)

A/D conv..5ms (.25%)

DAQ.5ms (.25%)

IDLE MODE198ms (99%)

Page 3: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 20123

Challenges for the Si-W Ecal

Sandwich structure of thin wafers of silicon diodes & tungsten layers Embedded Very Front End (VFE) electronics

Deeply integrated electronics Minimal cooling available

High granularity : diode pad size of 5x5 mm2

High segmentation : ≈ 30 layers

≈ 100.106 channels

Large dynamic range of the input signal (≈ 15 bits)

« Tracker electronics withcalorimetric performance »

ILC

Cal

orim

eter

s

Page 4: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012

Readout Electronics for the Si-W Ecal

4

Specifications of the readout electronics of Ecal:

Dynamic range of the signal delivered by a Si-diode : from MIP (4 fC) to 2500 MIPs (10 pC)

Level of noise limited to 1/10 MIP SNR ≈ 10

Error of Linearity:

< 0.1 % up to 10 % of the dynamic range (1 pC)

< 1% from 10 % and 100 % of the dynamic range (10 pC)

Power budget limited to 25µW per channel

Power Pulsing must be implemented

Page 5: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012

First prototype readout channel

5

Some results:

Global Linearity better than 0.1 % (10 bits) up to 9.5 pC

(2375 MIP).

ENC = 1.8 fC (0.5 MIP) with a single gain stage

Power consumption with power pulsing estimated to 25µW

Results published in IEEE TNS (ISSN :  0018-9499)

CSA

Axes of development @ MicRhAu:

Synchronous/clocked (with beam) analog signal processing: reseted-CSA, shaping with Gated

Integrators including the analog memory, latched comparators

Fully differential architecture, except for the Charge Sensitive Amplifier (CSA)

One low-power ADC attached to each channel (12-bit cyclic ADC)

Use of a pure CMOS technology, no bipolar transistors (low cost AMS CMOS 0.35 techno.)

Cyclic ADC

Page 6: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012

The CALOrimetry Readout Integrated Circuit (1/4)

6

Low noise CSA Low-gain shaper 12-bits cyclic ADC

ADC4

Based on the previous validated prototype, a new chip designed

Technology AMS CMOS 0.35 µm

Architecture of CALORIC based on the previous channel tested, with some improvements:

Reduction of the power consumption of the CSA

Reduction of the noise of the amplifier of the Gated Integrator

Increase of the analog memory depth to 16

Chip fully power pulsed

Page 7: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 20127

A High-Gain (about x 20) channel added to improve the SNR at low energy

A discriminator indicates the dynamic range of the signal select the signal to be converted

Low noise CSA Low-gain shaper 12-bits cyclic ADC

ADC4

x16

The CALOrimetry Readout Integrated Circuit (2/4)

High-gain shaper

Gain discri.x16

Threshold

Page 8: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 20128

Low noise CSA Low-gain shaper 12-bits cyclic ADC

ADC

High-gain shaper

4

Gain discri.

Analog part

High-gain shaperAmplifier

x5

Trigger discri.

x16

x16

A Trigger channel added to auto-select events over the MIP

The trigger signal determinates if the active memory cell is reset or the signal kept into memory

The CALOrimetry Readout Integrated Circuit (3/4)

Threshold

Page 9: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 20129

Digital Block(State Machine)

12

Outputdata

Control of the channel

Low noise CSA Low-gain shaper 12-bits cyclic ADC

ADC

High-gain shaper

4

High-gain shaperAmplifier

x5

Gain discri.

Trigger discri.

Thresholds

Analog part

x16

x16

A digital block controls the chip

The CALOrimetry Readout Integrated Circuit (4/4)

Page 10: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012

Global State Machine

10

IDLE

Analog signalprocessing

WAIT for 198 msNo power

1 ms max.Up to 16 events stored

Time conversion < 1 msA/D conversion

x events stored

End of the bunch trains

DAQ(not implemented)

All events converted

Bunch Crossing

Wake Up

Master clock of 20 MHz (period of 50 ns)

At the end of idle time, digital state machine wakes up and is ready to manage new events.

Analog electronics busy

1ms (.5%)

A/D conv..5ms (.25%)

DAQ.5ms (.25%)

IDLE MODE198ms (99%)

Page 11: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012+ 350 ns: ready to process next event11

Timing of the analog processing

t = 0 ns: bunch crossing (event synchronous w/ beam)

+ 200 ns: activation of the trigger comparator

+ 250 ns: activation of the gain comparator

+ 300 ns: end of integration: reset or memorization

Output signal of the CSA

Output signal of the trigger channel

Output signal of high-gain channel

Output signal of the low-gain channel

Signal delivered by the Si-diodeBunch period = 350 ns

Page 12: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012

Layout of CALORIC_1ch

12

Gated Integrator and the 2x16 memory

cells

CSA, trigger channel and comparators

The cyclic ADCThe digital block

Channel area in AMS 350nm : 1.2 mm²

Page 13: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 201213

Main Performance of Caloric_1ch

Most functionalities are validated: charge is

collected, converted to voltage, amplified,

filtered, memorized and digitally converted; the

digital block manages well the sequencing of the

signal processing

Trigger channel non-functional signal

dominated by noise (digital signals) and too large

offset

Bug on the routing of power pulsing signal

ENC (rms value) with CD=30 pF: 0.6 fC (3750 e-)

MIP-to-noise ratio 6

Integral Non-Linearity:

< 0.2% up to 0.4 pC

< 1% from 1 pC to 6 pC

Gain dispersion for 16 memory cells :

1.5% (rms value) the low-gain

2.5% for the high-gain

Results published in IEEE TNS (ISSN :  0018-

9499)

ENC= 0.6 fC

Page 14: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012

Power consumption of Caloric_1ch

14

CSA

Trigger channel

Low Gain channel

High Gain channel

Evaluation using power pulsing with the ILC duty cycle: 43 µW/channel

Page 15: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 201215

4-channel chip designed Power pulsing bug corrected New amplifier for the trigger channel less sensitive to process& mismatch

fluctuations Gated integrator: Time-variant system Noise simulations performs both with

transient noise and periodic noise tools from Cadence Results in accordance (difference < 10%)

MIP/noise=10 for trigger channel

Caloric_4ch (1/3)

Threshold voltage

Simulated noise: MIP/10Output signal of the trigger channel on MIP event vs process/mismatch fluctuation

Spectral density of the noise for the trigger channel

Page 16: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 201216

Shapers & ADC fully differential to reduce sensitivity to common-mode noise

Few “common sense rules” implemented for the layout to minimize noise coupling:

Analog and digital blocks isolated from one another with free-space and p+ guard rings

Analog and digital blocks with own independent power supply

Complementary signals for clock to minimize injection to analog signals

Several Pads per each power supply to reduce the inductance of bounding wiring

On-chip decoupling capacitors

Sensitive analog signal lines far away from perturbing lines

Digital pads with high toggle rate placed far from analog domain

Package have to be carefully chosen

Minimizing noise coupling from the digital part to the analog part

MIP/10 = 0.4fC equivalent to a voltage step of 3.3V on a 0.12 fF capacitor !!

Caloric_4ch (2/3)

Page 17: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 201217

(2.7 x 2.7) mm2

Submission to the next AMS run in November

Channel 1

Channel 4

Channel 2

Channel 3

Decoupling capacitors

Caloric_4ch (3/3)

Page 18: L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy

L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012

Conclusion

We have designed a pure CMOS–differential-synchronous readout electronics dedicated to the Si-W

Ecal of ILC.

All the functionalities have been tested and most are validated: amplification, filtering, memorizing, A-to-D

conversion, global state machine for sequencing.

But two main functionalities are missing: the auto-triggering and the power pulsing. They will be tested

with Caloric-4ch.

This work shows the difficulties to detect and process very small charge (<1fC) inside a mixed

analog/digital chip. A technology with higher resistivity substrate (BFMOAT with 130nm IBM RF

technology) should be better suited for mixed-signal design.

Power consumption must be divided by a factor 2 to reach requirements of ILC. It is not a trivial issue but

improvements must be focused on the amplifiers.

This development provides us successful experiences in the design of low noise CSA, time-variant

filtering, A-to-D converters, mixed chip, ….

This experience will be useful for the present and future projects @ MicRhAu.

18THANK YOU !