PIXI Series

Evaluation Kits

Production

PIXI delivers all your IoT multi-mode communication needs in one ultra-compact and secure module series. It is speci�cally designed to enable better transmission rates, lower latency, better range and higher resistance to interference when two or more communication protocols – for example, Wi-Fi, Bluetooth or Thread - are needed to run concurrently on one system on chip. Multiple communication protocols in one chip mean you can collect more data from disparate communication protocols, while also giving you the �exibility to use the right protocol to suit the type of data and distance from your hub.

Qualcomm QCA9377-3, Qualcomm QCA9377-5 and Qualcomm QCA6174A processors; connectivity via Wi-Fi, Bluetooth; and MHF4 connector, and PCIe, SDIO, UART, USB and I2S signaling.

Additionally, PIXI o�ers the latest and most stringent security, robust radio performance for noisy industrial environments, and a range of connector options to match your usage requirements.

It's never been easier to get started and implement PIXI modules into your next IoT project. Our IoT evaluation kits provide a cost-e�ective way for customers to learn about the capabilities of our modules. By choosing to work with TechNexion, developers can take advantage of a wide range of fully assembled and tested IoT development kits. We o�er a printed circuit board with an integrated circuit and support components to produce a working circuit for evaluation and develop-ment.

TechNexion has its own manufacturing facilities with factory and design teams working together, communicating and sharing expertise in a way not possible when they were in separate businesses with separate priorities. It means that each stage of the transition to manufacturing can go smoother and faster, the unique aspects of your design can be realized more cost-e�ectively, and production line capacity planned for with better timing. It also means you will not fall victim to the production scheduling priorities of contract manufactur-ers and the larger orders that might push you down the queue.

TechNexion PIXI IoT modules only incorporate components from suppliers who support our roadmaps. In addition, we support them with value added technical services such as life cycle management, revision control and end-of-life support.

Longevity

YEARS

12

RF designers often face countless complex challenges that can add time and cost to an already tight develop-ment schedule. RF designs can encounter several critical issues like reduced antenna e�ciency, high EMI, high power consumption or failed government certi�cations. When any of these problems occur, system’s development schedule will be at risk.  By choosing to work with TechNexion, developers can take advantage of a wide range of plug-in IoT wireless communication modules that come fully tested, comply with the essential requirements and are certi�ed by the most critical government agencies, including European Union (CE, ETSI), United States (FCC), Canada (IC), Australia/New Zealand (RCM) and Japan (TELEC).

Like all TechNexion products, our PIXI wireless communication modules are designed to be easily deployed in an open source environment and come with free-of-charge drivers for open source software including Android, Yocto and Ubuntu versions. The drivers are easily accessible, not hidden behind sign up pages or passwords. Our IoT wireless communication modules come standard with drivers for the following operating systems:

TechNexion Pre-Certified PIXI Modules

TechNexion Driver Support

PIXI-6174

Qualcomm QCA6174A-3

Dual-Band 2x2

802.11 a/b/g/n/ac

BT 4.1 (BR+EDR+BLE)

2x MHF4

16 x 12 mm

OVERVIEW

2018-11. All specifications are subject to change without notice.

SPI

I²C

PWM

GPIO

Dimensions

PIXI-9377-P

Chipset

TX/RX Streams

802.15.4 Radio

Bluetooth

Antenna Connector

Integrated Antenna

PCIe

I²S

Wi-Fi Standards

Wi-Fi Generation

System-in-Package

Connectivity

Antenna

Signaling

Others

Form Factor

Mechanical

Qualcomm QCA9377-5

BT 4.1 (BR+EDR+BLE)

16 x 12 mm

1x MHF4

802.11 a/b/g/n/ac

Wi-Fi 5 Wi-Fi 5

Dual-Band 1x1

Model Name

UART

USB

SDIO

-40° to +85° C

10 to 90 %

50 000 Hours

50G/25ms

CE/FCC/IC/RCM/TELEC

20G/0-600Hz

Temperature

Relative Humidity

MTBF

M.2 LGA Type 1216 M.2 LGA Type 1216

-40° to +85° C

10 to 90 %

50 000 Hours

Shock

Vibration

50G/25ms

Certification CE/FCC/IC/RCM/TELEC

20G/0-600Hz

PIXI-9377-S

Qualcomm QCA9377-3

BT 4.1 (BR+EDR+BLE)

16 x 12 mm

1x MHF4

802.11 a/b/g/n/ac

Wi-Fi 5

Dual-Band 1x1

M.2 LGA Type 1216

-40° to +85° C

10 to 90 %

50 000 Hours

50G/25ms

CE/FCC/IC/RCM/TELEC

20G/0-600Hz

SPI

I²C

PWM

GPIO

Dimensions

Chipset

802.15.4 Radio

Bluetooth

Antenna Connector

Integrated Antenna

PCIe

I²S

Wi-Fi Standards

Wi-Fi Generation

System-in-Package

Connectivity

Antenna

Signaling

Others

Mechanical

Qualcomm QCA9377-5

Dual-Band 1x1

802.11 a/b/g/n/ac

BT 4.1(BR+EDR+BLE)

1x MHF4

Model Name STIX-9377-M2-B STIX-9377-M2-E STIX-9377-MPCIE

TX/RX Streams

Form Factor

Wi-Fi 5 Wi-Fi 5 Wi-Fi 5

UART

SDIO

USB

Temperature

Relative Humidity

MTBF

-40° to +85° C

10 to 90 %

Shock

Vibration

Certification CE/FCC/IC/RCM/TELEC

22 x 42 mm

50 000 Hours

50G/25ms

20G/0-600Hz

M.2 KEY-B Type 2242

Qualcomm QCA9377-5

Dual-Band 1x1

802.11 a/b/g/n/ac

BT 4.1(BR+EDR+BLE)

1x MHF4

-40° to +85° C

10 to 90 %

CE/FCC/IC/RCM/TELEC

22 x 30 mm

50 000 Hours

50G/25ms

20G/0-600Hz

M.2 KEY-E Type 2230

Qualcomm QCA9377-5

Dual-Band 1x1

802.11 a/b/g/n/ac

BT 4.1(BR+EDR+BLE)

1x MHF4

-40° to +85° C

10 to 90 %

CE/FCC/IC/RCM/TELEC

30 x 26.8 mm

50 000 Hours

50G/25ms

20G/0-600Hz

mini-PCIe Half Size

TechNexion Ltd.16F-5, No. 736, Zhongzheng Rd.,Zhonghe Dist., New Taipei City,23511,Taiwan.Tel: +886-2-8227 3585 Fax: +886-2-8227 3590E-mail: sales@technexion.comhttps://www.technexion.com

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