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Pressure Cure Oven (PCO)

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Introduction

Pressure Cure Oven (PCO) or Autoclave is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications

PCO pressurizes air into a rigid vessel and heats & cools with forced convection¬Heaters, heat exchangers and blowers are internal to

the pressure vessel When the curing process is complete, the pressure oven

automatically relieves its pressure to 1atm and cools

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PCO[Autoclave]

Semi.

Glass

DisplayFood & etc

Medi-cal

Test/Lab.

Composite forming (for pri-mary in-dustry)

Viable applications for PCO

PCO Introduction

Wafer laminating

Die attach curing

Thermal compress bonding

Via filling

Underfill curing

Film & Tape bonding

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PCO is applied for curing die attach adhesive and removing voids in adhesive or already soldered products

Air bubbles

Solder ball Substrate

Introduction

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Process Specification• Process time: Generally 120 min or

User’s spec

• Operating temp: 60oC ~ 200oC

• Maximum temp: 220oC

• Operating pressure: 1 bar – 10 bar

• Capacity: 24 Magazines (typical)

• Cooling method: PCW (17oC - 23oC)

• Cooling water pressure: 25 – 40 psi

200℃

60℃

0

Temp.

30min 90min 120min Time

10 bar

020min 90min 110min Time

Cooling process

Curing process

Rising process

Pressure.

Representative Pressure/Temp Profiles (User Configurable)

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System Dimensions

※ Wight: About 2.7 Ton1,700㎜

2,200㎜

1,700㎜

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Chamber Dimensions

7

440mm

189mm

199.5mm

608mm

716.5mm

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Chamber with Shelves Extended

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System Air Flow

9

Door inside cover

Return air assistance damper

Heater module

radiator

Fan motor & mechanical seal

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Vacuum Module Option• Vacuum Module (Optional)

Vacuum pump

GaugeVacuum in/out line