accuthermo aw 610 - allwin21 corp

AccuThermo AW 610

220 Cochrane Circle Morgan Hill, CA95037

U.S.A. Tel.:+1-408-778-7788

Fax.:+1-408-904-7168 www.allwin21.com

[email protected] © 2015 Allwin21 Corp. All Rights Reserved.

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http://www.allwin21.com/

mailto:[email protected]

Content

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1. Introduction 2. Applications 3. Schematic 4. Specification 5. Basic Configuration 6. Options 7. Equipment Features 8. Software Features 9. Safety Features 10. Partial Customer List 11. Allwin21 sales/service locations 12. Real RTP VS Concept RTP 13. RTP VS Furnace 14. Atmospheric RTP VS Vacuum RTP 15. Thermocouple VS Pyrometer 16. RTP Uniformity Measurement 17. DEMO is not correct for RTP evaluation 18. Allwin21 Unique Tech. for best performance 19. Conclusion

Derived from the AG Associates Heatpulse Special Aluminum Chamber with gold plating surface Special TOP AND BOTTOM Lamp Assembly Structure 0.02” Dia “K” Type Thermocouple. Bare, Beaded touch Patented ERP Pyrometer, Non-contact -Option Isolated quartz tube, thickness 0.125” only Different quartz tray for different substrate Quartz Liner Plate -Option Multiple gas lines with MFCs -Option Proven Carriers / Susceptor -Option Proven Slip Free Ring -Option Advanced AW Software with many functions Precise and Rapid Control Real Time Control Easy Allwin21 Pyrometer Calibration method Programmable RTAPRO software Calibration Advanced PID Control PowerSum function

AccuThermo AW 610 Introduction

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The AccuThermo AW610 Desktop Atmospheric RTP was derived from the most

popular AG Associates Heatpulse production-proven design. Allwin21 Corp. is

the exclusive manufacturer of the AG Associates Heatpulse 610 desktop

atmospheric RTP (Rapid Thermal Processing) system. The system uses high

intensity visible radiation to heat single wafer for short process periods of time

at precisely controlled temperatures. The process periods are typically 1-600

seconds in duration, although periods of up to 9999 seconds can be selected.

These capabilities, combined with the heating chamber's cold-wall design and

superior heating uniformity, provide significant advantages over conventional

furnace processing.

AccuThermo AW 610 Applications

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Ion Implant Activation

Polysilicon Annealing

Oxide Reflow

Silicide Formation

Contact Alloying

Oxidation and Nitridation

III-V (GaAs, GaN, SiC,InP, GaInP etc.) Processing

IC, LEDs, MEMS, Solar, Sensor, Nanotechnology, Biology etc.

Other Thermal Processes

AccuThermo AW 610 Schematic

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Extended Gas Box

PCB for 2-6 gas lines

AccuThermo AW 610 Main Specifications

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1. Wafer sizes: Small pieces, 2", 3", 4" , 5" , 6" wafer capability 2. Recommended ramp up rate: Programmable, 10°C to 120°C per second. Maximum

Rate: 200°C (NOT RECOMMENDED) 3. Recommended steady state duration: 0-300 seconds per step. 4. Ramp down rate: Non-programmable, 10°C to 200C per second. 5. Recommended steady state temperature range: 150°C - 1150°C. Maximum

1250°C (NOT RECOMMENDED) 6. ERP Pyrometer (Optional) 450-1250°C with ±1°C accuracy when calibrated against

an instrumented thermocouple wafer. 7. Thermocouple 100-800±0.5°C with ±0.5°C accuracy & rapid response. 8. Temperature repeatability: ±0.5°C or better at 1150°C wafer-to-wafer. (Repetition

specifications are based on a 100-wafer set.) 9. Temperature uniformity: ±5°C across a 6" (150 mm) wafer at 1150°C. (This is a

one sigma deviation 100 angstrom oxide.) For a titanium silicide process, no more than 4% increase in non-uniformity during the first anneal at 650°C to 700°C.

10. Process/Purge gas inputs: Any inert and/or non-toxic gas regulated to 30 PSIG and pre-filtered to 1 micron. Typically, N2, O2, Ar, He, Forming gas, NH3, N2O2 are used.

AccuThermo AW 610 Basic Configuration

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1. AccuThermo AW 610 Main Frame with wires. 2. Power Type: Three Phase, worldwide power type(50/60 Hz) 3. CE Mark if Necessary 4. Pentium® class computer with a 17-inch LCD monitor and Allwin21 Corp proprietary

software package. 5. Mouse and standard keyboard . 6. Aluminum oven chamber with water cooling passages and gold plating plates.. 7. Door plate with one TC connection port. 8. Isolated Quartz Tube W/O Pyrometer window or with Pyrometer Window. 9. Oven control board and one main control board. 10. Bottom and top heating with 21 (1.2KW ea) Radiation heating lamp module with 4

bank zones (Top Front&Rear, Bottom Front&Rear). 11. Quartz Tray for 4 to 6 inch round wafer or customized. 12. Gas line with one Gas MFC without shut-off valve 13. T-Shaped Quartz with qualified K Type TC and one set holder for 100-800°C

temperature measurement. 14. Package of 5 pieces of thermocouple wires as spare TC 15. USB with original Software backup.

AccuThermo AW 610 Options

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1. Multiple Process Gases (Up to 6) and MFCs with Extended Gas Box and Gas Control Board. Typical gases are N2, O2,Ar, Forming Gas, NH3,N2O2, H2 etc.

2. Carrier or Susceptor for small sample, transparent substrate and substrate with metal thin film on top. Typical sizes are 2 inch, 3 inch, 4 inch, 6 inch. Typical material is Graphite with SiC coating.

3. Patented ERP Pyrometer (400-1250°C) as non-contact high temperature sensor for quick response and better repeatability.

4. Chiller for ERP Pyrometer 5. Single Point TC wafer for Pyrometer calibration. Typical sizes are 2-inch, 4-inch, 6

inch. 6. CL-23A Omega Meter for Pyrometer and Thermocouple calibration 7. Shut-off valve for Quartz Tube&Lamps cooling control 8. Spare Parts 9. Special quartz tray for sensitive processes 10. Slip free ring for sensitive processes 11. Liner plate for outgassing processes 12. GEM/SEC II network function

The simple, the better!

The suitable, the better!

AccuThermo AW 610 Features

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1. 35 years’ production-proven real RTP/RTA/RTO/RTN system. 2. Scattered IR light by special gold plated Al chamber surface. 3. Allwin21 advanced Software package with real time control technologies

and many useful functions. 4. Consistent wafer-to-wafer process cycle repeatability. 5. Top and bottom High-intensity visible radiation Tungsten halogen lamp

heating for fast heating rates with good repeatability performance and long lamp lifetime.

6. Cooling N2 (Or CDA) flows around the lamps and quartz isolation tube for fast cooling rates

7. Elimination of external contamination by Isolated Quartz Tube 8. Up to six gas lines with MFCs and shut-off valves 9. Energy efficient. 10. Small Footprint. 11. Made in U.S.A. 12. Special options for sensitive processes

Software Features

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1. Integrated process control system 2. Real time graphics display 3. Real time process data acquisition, display, and analysis 4. Programmed comprehensive calibration and diagnostic functions 5. Closed-loop temperature control with temperature sensing. 6. Precise time-temperature profiles tailored to suit specific process requirements. 7. Faster, easier Programmable comprehensive calibration of all subsystems, leading to

enhanced process results. 8. A recipe editor to create and edit recipes to fully automate the processing of wafers inside

the AccuThermo RTP 9. Validation of the recipe so improper control sequences will be revealed. 10. Storage of multiple recipes, process data and calibration files so that process and calibration

results can be maintained and compared over time. 11. Passwords provide security for the system, recipe editing, diagnostics, calibration and setup

functions. 12. Simple and easy to use menu screen which allow a process cycle to be easily defined and

executed. 13. Troubleshooting feature which allows engineers and service personnel to activate individual

subassemblies and functions. More I/O, AD/DA “exposure”. 14. Use PowerSum technology to detect the process and increase Yield. 15. Watchdog function: If this board looses communication with the control software, it will

shut down all processes and halt the system until communication is restored. 16. GEM/SECS II function (Optional).

Safety Features

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1. There is a watchdog timer on the AccuThermo RTP system control board that will shut off the lamps if the software or computer freezes.

2. Chamber Door Interlock Switch: This interlock detects if the chamber door is closed. If the chamber door is not closed, then the heating source will not come on. This cannot be bypassed. The process gases will be turned off if the chamber door is open. This is hardware and software controlled. The hardware will close the pneumatic shutoff valves and set the MFC setpoint control to 0 volts (close). The software will logically reset the gas flow to 0 slpm and close the gas pneumatic valves.

3. Cabinet Cover Interlock Switch: This interlock detects if the cabinet cover has been removed. If the cabinet cover has been removed, then the heating source is turned off by disengaging the power contactor. This can be bypassed by a maintenance person by pulling up on the switch into the maintenance position. As soon as the cabinet cover is replaced, the cabinet cover interlock switch is automatically reset to detect the removal of the cabinet cover. If the cabinet cover is removed, the process gases will be turned off.

4. EMO (Emergency Off): When the EMO is depressed, the power to the entire machine is turned off. 5. Overheat Thermal Switch: If the oven overheats (>150°F), there is a thermal switch that opens and the

heating source is turned off by disengaging the power contactor. Once the chamber has cooled below 135°F, the thermal switch can be reset by pressing on the thermal switch reset button.

6. Water Flow Switch: The water needs to flow at the recommended rate that is specified in the Installation chapter of this manual. If the flow rate drops below this, the heating source is turned off by disabling the lamp control circuit. However, if the oven plates are below 95°F (35°C), the water may not need to flow. This is to prevent condensation on the oven in an un-air-conditioned facility. If the oven plates are less than 50°F (10°C), the water valve is closed, preventing the oven from being cooled more. If this happens, the chiller control temperature has been set too low.

7. Electrical: The main circuit breaker on the rear panel of the chassis removes all electrical power from the machine. There are no storage devices (e.g. capacitors) within the machine.

8. Pneumatic: The pneumatics is used to operate the Positive Shut-off valves. If there is no air pressure, these valves will close. If the power is removed from the AccuThermo RTP system, then the pneumatic gas valves close automatically.

Partial Customer List

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Sigen Fudan University Spectrolab/ A Boeing Company First Solar IBM Almaden Research Center Institute for Energy Technology (IFE) Tsinghua Tongfang California Institute of Technology Translucent Inc IMEC NB Technologies GmbH UC Riverside / Atomate Corporation FKF Max BP Solar Twin Creek Egtran Tonghui Bid-Service ClassOne Equipment Inc Sierra solar power Proteus Biomedical Inc AG 610 University of Wisconsin NEC UC Berkeley Mellanox Technology AET Co.,LTD Sunpower Twin Creek Santa Clarita Community College IBM Almaden Research Center

University of California Lawrence Berkeley NeoPhotonics Simon Fraser University Semiconductor Energy Laboratory Co., Applied Material GE Energy AW 610 Nanjing University DAY4ENERGY K&US Equipment ROHM Intermolecular, Inc Multiplex Inc Keio University TriQuint Semiconductor Standford University UBC Senergen Devices UC Berkeley Cranfield University Tianjing University National Research Council Canada Advanced Engineering Research Organization Hitachi Global Storage Technologies, Inc. Pennsylvania State University Diviner Cree Intermolecular Advanced Packing Technology GTRAN

Draper Laboratory Jilin Province New Century Optic-Electric Co.,

Hisol /National Institute for Materials Science

Hisense Broadband/ PROSRUN INTERNATIONAL EAST CHINA NORMAL UNIVERSITY/C&D Walsin Technology Fujitsu Laboratories Ltd./Hisol Palo Alto Research Center CAEP/Sichuan Zhonghe Trading Meiji University Reel Solar Power Inc Austrlian National University Masimo Corportation Hamamatsu Photonics KK SolAero Technologies Corp. Marktech AdvanceTEC/ City College of NY Advanced Semiconductor Manufacturing HP First Solar University of California, Davis Silevo Inc. University of Utah QMAT, Inc. Panasonic Eco Solutions Solar America,LLC Infinera Corporation Excelitas Evlove Ltd.

List is not complete. Customers are from 40 countries all over the world !

Allwin21 Sales/Service Locations

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Allwin21 Corp USA

Japan

Korea

Headquarters Distributors

Allwin21 Corp Nanjing, China

Taiwan

Britain France Germany

Israel India Vietnam

Poland

Brazil Singapore

East USA

Russia

http://www.hisol.jp/

Real RTP VS Concept RTP

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In reality, RTP is one of the most complex segments of semiconductor manufacturing

involving the quantum and solid state physics, optics, and engineering. In the last 35 years,

the semiconductor industry has helped the dominated RTP vendors [Allwin21 (AG

Associates), AMAT, etc.] develop their qualified systems for better repeatability. These

tools are considered real RTP.

Due to the trend towards single wafer processing, RTP systems have being playing a more

important role in thermal processing of semiconductors. However, the basic principle is

very simple. This simple basic principle of RTP leads many people to believe that any

“garage operation” can build an RTP system -which is called a concept RTP. In

semiconductor industry, many people call this concept RTP system without repeatability a

Rapid Trash Process (RTP).

RTP VS Furnace

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Rapid Thermal Process Furnace

Single Wafer Process Batch Wafer Process

Small Footprint Big Footprint

Energy consumption lower Energy consumption higher

Quick Ramp up and cooling down (Second) Low Ramp up and cooling down (Hour)

Wafer never in thermal equilibrium Wafers in thermal equilibrium

Short thermal process (Annealing, Alloy) Long thermal process (thick oxidation)

Cold wall Hot wall

Uniformity better Large wafer uniformity not good

Repeatability better Large wafer repeatability not good

No wafer Bow Wafer easily to Bow

Thermal budget low Thermal budget high

Atmospheric RTP VS Vacuum RTP

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Items Atmospheric RTP Vacuum RTP

Popularity Popular Not Popular

Production-proven Yes (>30 years) No

Process repeatability Better Not good

Process uniformity Better Not good

Process stability Better Not good

Contamination No (Isolated quartz tube) Yes (Metal chamber)

Chamber Volume Compact, small Big due to vacuum

Lamp heat Top and bottom Only top*

Anti-Oxidation Use Forming Gas to purge Have to use Turbo

For compound materials Good with susceptor Not Good

Ownership and usage cost Lower Higher

Recommend First choice Second choice

* Allwin21 developed AccuThermo AW 810V/820V vacuum RTP with top and bottom heating function which results better performance than traditional vacuum RTP.

ThermoCouple VS Pyrometers

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Standard TC Special TC ERP Pyrometer

Cost Low Low High

Precision High High High

Repeatability Dependent** Dependent** High

Contact Contact** Contact** Non-contact

Evaporate Yes Yes No

Lifetime Short Short Long

Calibration Easy Easy Easy (AW)

Temp. Range 100-800°C 300-1100°C 400-1250°C

Contamination Maybe Maybe No

Wafer Bottom Requirement

No No Uniform, Repeat

Wafer Material All All NonTransparent

Convenient OK OK Best

* Quartz Tube temperature will change a lot which will influence the repeatability. ** Contact status will influence the repeatability.

RTP Uniformity Measurement

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Do not measure temp. uniformity directly Wafer never in thermal equilibrium

TC response time influence

All ∆T will be high at higher than 500°C

Uniformity of TDisplay is not same with TReal

Less than 500°C, uniformity of TDisplay might be

same with TReal

Multiple TC wafer and meters are expensive

Customer substrate is not same with TC wafer

TRecipe = TDisplay = TReal + ∆Tmaterial + ∆Tcontrol Point + ∆TContact + ∆TSystem + ∆TOthers

Measure “Third Parameters” for RTP Uniformity Run a test wafer and measure the third parameter to check the

uniformity of the system.

Compare the values with customer specification requirements or

obtained on the wafer measured when the unit was first installed.

With the process conditions, ramp rate, steady step time and other

parameters held fixed, the correct process temperature can be adjusted to

give the desired uniformity specification.

To determine the correct process temperature, several runs with slightly

different temperatures will need to be done. If the parameter increases as

the temperature decreases, then the correct temperature needs to be

increased. However, if the parameter decreases as the temperature

decreases, then the correct temperature needs to be decreased.

Third

Par

amet

ers

Temperature

Industry IC LEDs Solar MEMS …

“Third Parameters”: Resistivity mV mw Color …

Demo is not correct for RTP evaluation

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RTP System

Substrate Input

Substrate Output Recipes

Facility

Resultsubstrate output =ƒ (Substrate Input, RTP System, Recipes, Facility, Process Engineer etc.)

It is not correct to evaluate the

RTP performance according to a

few demo runs result.

Optimizing recipes (“U”method)

and proper Design of Experiment

(DOE) cannot be achieved by Demo.

Process Engineer

Unique Tech. for Best Performance

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No. Unique Technology Benefits

1 Derived from the AG Associates 610 production-proven design.

Rapid Start up, Low risk, Not be a “Guinea Pig”.

AG Associates was the founder of RTP. It was founded in 1981 and produced the first

single wafer RTP system in 1982, the Heatpulse 210. In 1987, it produced the Heatpulse 610.

In the last 35 years, the semiconductor industry has helped Allwin21 (AG Associates)

develop the qualified systems for better repeatability. Our RTPs are considered real RTP.

AG Associates was the dominant manufacturer of RTP systems in 1990’s (20 Years) .

Many Heatpulse RTP systems are still being used around the world in manufacturing, R&D

and Universities. These RTP systems have a proven track record for reliability and simplicity.

Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610


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2 Special Aluminum Chamber with gold plating surface for scattered IR light and water cooling passages

Proven chamber design to get best repeatability, uniformity and stability


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3 Special TOP AND BOTTOM Lamp Assembly Structure (Space, Distance and quantity etc.)

Proven Lamp Heating design to get best repeatability, uniformity and stability

Long lamp lifetime (2400 Hours Power On) !! 4 Zones Lamp Control !!


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4 0.010” Dia “K” Type Thermocouple. Bare, Beaded touch on the bottom of sample. Response time: 0.25 second.

Meet RTP quick control and response requirements to get best repeatability, uniformity and stability


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5 Patented ERP Pyrometer, Non-contact temperature measurement for 400-1250 C (Optional)

Quick response, no contact influence to get best repeatability, uniformity and stability

Chiller SC100-A10 for ERP Pyrometer


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6 Isolated quartz tube, thickness 0.125” only for low thermal budget

Elimination of external contamination ; Easy to get rid of contamination after many processes; Lower tube influence on process repeatability.

Tube for w/o Pyrometer Tube for with Pyrometer


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7 Different quartz tray for different shape substrate

Elimination quartz tray influence on process repeatability, uniformity for sensitive processes.

Roun

d Tr

ay

Squa

re T

ray

Universal Tray 100mm -156mm,Suqare 4 to 6 inch round substrate

Special Trays

100mm X 100mm 2 inch round, 2 inch Round,Susceptor 156mm X 156mm 3 inch round, 3 inch Round,Susceptor

4 inch round, 4 inch Round,Susceptor 5 inch round, 5 inch Round,Susceptor 6 inch round, 6 inch Round,Susceptor


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8 Quartz Liner Plate for Outgassing Substrates

Decrease the clean times of Isolated quartz tube for outgassing substrate processes.

Isolated Quartz Tube

Quartz Liner Plate


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9 Multiple gas lines with MFCs-Optional

Capability for special applications. Cost-effective, versatile

MFC Type Range

N2 10 SLM

O2 10 SLM

Ar 10 SLM

Forming Gas 10 SLM

NH3 5 SLM

N2O2 5 SLM

H2 10 SLM

Customized Customized

MFC Type and Range Large MFC Range only increase the cooling rate a little. Large MFC range may break the quartz tube. Use three switch valve to save MFC quantity if budget issue. Customer should provide the pure H2 sensor if necessary. No Air MFC, Use N2&O2 MFC instead. Shut-off valve increase safety Use forming gas to anti-oxidation and quick thermal driven reaction.


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10 Proven Carriers / Susceptor

Capability for special applications, such as transparent substrate, metal thin film substrate, small sample

Carrier/susceptor will decrease the ramp rate and cooling rate depending on its size and material. Recommended ramp rate is 5-30C/sec. Please contact Allwin21 sales Rep. for special material and size susceptor.

Typical Susceptor :

Material: Graphite with SiC Coating

Size: 2 inch,3 inch,4 inch,6 inch,4X2 inch


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11 Proven Slip Free Ring if necessary.

Elimination of edge influence on process repeatability, uniformity for sensitive processes.

Slip Free Ring* Quartz Tray

2 inch 2 inch, Slip Free Ring





Options:

* Standard material is single crystal silicon. Please contact Allwin21 sales Rep. for special materials.


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12 Advanced Allwin21 AW Software with many functions

Consistent wafer-to-wafer process cycle repeatability, easy set up, use and maintenance

Recipe Editor I/O AD/DA Explosion GEM/SEC II

Files Management Password Setup System Diagnostic


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13 Precise and Rapid Control technology. 0.1millisecond Control


Percentage of Intensity


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14 Real Time Control , NOT INTERRUPT CONTROL !


Allwin21 Proven Technologies:

Thin TC

ERP Pyrometer

Advanced SW

Chamber Data

Fuzzy Logic Learn

Real Time: Graphics Display

Process Data Acquisition

Process Data Analysis

Process Parameters control



15 Easy Allwin21 Pyrometer Calibration method

Quick and precise calibration to get best repeatability, uniformity and stability

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16 Programmable comprehensive faster, easier calibration of all subsystems from within the RTAPRO software

Quick and precise calibration to get best repeatability, uniformity and stability

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Pyrometer

Chamber

TC

Gas



17 Advanced PID Control Technology with Fuzzy Logic Learn capability and Chamber Thermal Data.

Quick and precise control to get best repeatability, uniformity and stability

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18 PowerSum function

Monitor process performance; Increase yield; Save valuable wafers before thermal reaction.

① Good ohmic contact for linear and symmetric current-voltage (I-V) curve of the device.

② The metal has to flow into the substrate evenly and to a proper depth.

③ The temperature range to flow the metal is very narrow (+/- 8°C or less) and low (400°C to 450°C).

④ The temperature needs to be controlled precisely .

⑤ Factors affecting repeatability can be a dirty quartz isolation tube, a lamp failure, or an improperly functioning temperature sensor.

PowerSum 1

PowerSum 2

Alloy Time

Conclusion

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AccuThermo AW 610 is the most popular , cost-effective, versatile, production

proven, easy to use desktop manual Rapid Thermal Processing Equipment on

the market.

AccuThermo AW 610 comes with unique hardware and software technologies

to achieve the best performance (Repeatability, Uniformity and Stability) for

many thermal applications.

accuthermo aw 610 - allwin21 corp

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