design ash finished electric hybrid tracing to connector fields –changes to allow for hcc-less and...
TRANSCRIPT
ATLASATLASATLASATLAS Design• Ash finished electric hybrid tracing to
connector fields– Changes to allow for HCC-less and HCC running
on one hybrid awaiting final confirmation of HCC footprint• Should come next week
• Power board work by Sam continuing– Toroidal DC-DC and pararrel power boards
ready for submission– Flat coil next on list – SP board (with SPP) needs details from Mitch
ATLASATLASATLASATLAS Assembly Results So Far• Very positive results in gluing
ASIC to hybrids and hybrids-to-sensor– One solid row of epoxy under
ABC130, one dotted row under thermistor, HCC and hybrid-to-tape bonds
• ~50% epoxy coverage with 100-120 mm thickness
• Performed pickup trials with ABC130.– No visible marking under microscope
Slide 2
ATLASATLASATLASATLAS Minor Jig Issues• All worked as well as expected
but:– ASIC glue stencil tended to rock
on single ASIC column, pumping too much glue onto ASIC
– Epolite (sensor-to-hybrid) epoxy tended to push AWAY the hybrid from the sensors• Previously we were worried that the
glue would pull the hybrid TOWARDS the sensors
• Expect that skimming glue onto back of hybrid with stencil would also bend hybrid and pump extra glue between stencil and hybrid
Chip Pickup Tool
Glue Stencil
ABC130
Chip Pickup Tool
Hybrid
Sensor
Epolite
Slide 3
ATLASATLASATLASATLAS Chip Stencil Fix• Glue a plastic bar onto chip
stencil which will touch the chip pickup tool– This has been trialled
successfully with 3 pickup tools and two stencils
Chip Pickup Tool
Glue Stencil
ABC130Plastic Bar
Slide 4
ATLASATLASATLASATLAS Chip Pickup Tool Fix• We want to put a
removable bars on chip pickup tool to push on outside of hybrid– Under design and
prototyping now– Will add a groove into
chip pickup tool to locate and hold bar• Needs to avoid HCC
region for both types of hybrids
Slide 5
Chip Pickup Tool
Hybrid
Sensor
Epolite
PlasticBar
Bar would locate in the two dowel holes and the additional slot
ATLASATLASATLASATLAS Assembly Future Plans (I)
• Once pickup tool bar shown to stabilize unsupported hybrid will make metal stencil to screen Epolite onto back of hybrid– Without bar, epoxy will
pump between stencil and hybrid, binding hybrid to it.
Stencil would be for one hybrid (this shows paper stencil onto sensor for two hybrids
Slide 6
ATLASATLASATLASATLAS Assembly Future Plans (II)
• One of the reasons to change the hybrid pickup tool face to anodized AL is improve the uniformity and stability– Ideally, all tools will be “identical” and therefore interchangeable
• In current ABC250 tooling, the same tool has to be used for gluing ASICs-to-hybrids and hybrids-to-sensors
• We plan to test this in the next set of hybrid and module assemblies– Will exchange the tooling between ASIC and hybrid gluing
• As first test of this, we can exchange jigs after ASIC gluing and curing and the vacuum does not leak and the tool legs all touch
Slide 7
ATLASATLASATLASATLAS Bonding Experience• So far, so good
– Not complaints from anyone• Every attempt successful
– ~>6 chip cards, 5 hybrids, 1 modules
– Much easier than 250 nm (both hybrid and module)
• Biggest unexplored issue is the best bonding parameters for the ABC130 metal– Much softer/thicker than
ABC25 (more like FEI4)
• First chip on boards bonded ok and systematic studies started at Liverpool
Slide 8
ATLASATLASATLASATLAS Jigs Distribution Plans• A set of jigs to do one hybrid sent to Birmingham
already to continue accelerated silver epoxy curing studies
• Hope to have a jig sets for Cambridge, Glasgow, UCSC, and LBL for hybrids for end of February or beginning of March– ASIC glue stencil, ASIC trays, pickup tools, 8 way jig
and module assembly tools from Liverpool• Only one pickup tool per site until bar for pickup tool
understood
– Module testing plates from LBL– Other 2-3 pickup tools per site and module glue
stencil will follow with successful module trialling
Slide 9
ATLASATLASATLASATLASComponent Distribution/Status
• Orders of 10 panels (2 per site) due back this week (will be before end of February
• Plenty (~150) glass and (~100) mechanical sensors
• More plain glass ASICs need to be diced (~500-1000); starting at Glasgow
• Only component we could be short of is patterned AL glass ABC130s from CNM– Needed for both hybrid and module bonding
trials
Slide 10
Is there an interest in the community for another AL glass ABC130 submission? Glass ASICs from CNM
TM hybrids from Stevenage
Mechanical Sensor from HPK
ATLASATLASATLASATLAS Wish list• We would want a spectrum analyser for
power board work (£3.5k)– Might be able to borrow the B180 unit
• For submissions, we will need:– £5k for electrical hybrids (40)– £~1k for power board submissions, frames,
aux. boards, etc.– £~2k for AL patterned ASICs
• We assume next mech and elecrical hybrid submission would get billed after Q1 2014