esa/estec tec-qcs overview of a space qualification process - radiation characterization and beyond...

ESA/ESTECTEC-QCS

Overview of a Space Qualification Process -

Radiation characterization and beyond

L. BONORA, ESA/ESTEC-Component Division

Xanthi - Oct 2006

ESA/ESTECTEC-QCS

SUMMARY

Radiation: effects on EEE components Radiation: tests & requirements Beyond radiation, overview of the relevant

requirements for space components/flight models.

ESCC Evaluation/Qualification ApproachMinimum Quality Management Requirements

ESA/ESTECTEC-QCS

Radiation: effects on EEE components (1)

Total Ionizing Dose (TID)Degradation of μelectronics and optoelectronicsCumulative long term effectsParameter drifts, threshold shifts, timing changes, functional failures

Non Ionizing Effects – Displacements DamageDegradation of optoelectronics (GaAs …), CCDs, bipolar technologies in very harsh environmentsCumulative long term effects ( disruptions of crystal lattice)CMOS technologies less affected ( majority carriers)

ESA/ESTECTEC-QCS

Radiation: effects on EEE components (2)

Single Event Effects (SEE)Single charged particles (heavy Ions and protons) passing through a semiconductor materialSoft errors: data corruption (SEU), system shutdown (SEFI), transients (SET)…Hard errors ( sometimes destructive): Latch-up ( SEL), Stuck bits (SHE), Gate ruptures ( Power MOSFETs and thin capacitors in analog devices)…

New effect types or unknown manifestations of known effects always possible especially for new technologies

ESA/ESTECTEC-QCS

Radiation: Tests and requirements for TID

Usual particle type: γ rays (1.17 & 1.33 MeV) from Co60 sourcesEffects similar to/ representative of space radiationHigh penetration (parts irradiated “as is” on test boards)

European Specification: ESCC 22900Experimental Set-up

Sample size: (10 + 1) parts in gal, from a single lotStatic bias ( considered as a worst case) ON and OFFTotal dose ~100 krad(Si) max. in several steps (0/5/10/20/50/100)Dose rate < 360 rad(Si)/h

Actual space dose rate very low ( a few rad(Si)/h) High dose rate not relevant for bipolar/ BiCMOS technologies due to ELDRS

Facilities: one source at ESTEC, several in Europe (e.g., ONERA Toulouse)

ESA/ESTECTEC-QCS

Radiation: Tests and requirements for SEE (1)

General:Characterization: experimental curve σ vs. LET (HI) or energy (p+)

σ = ratio number of events / number of incident particlesKey parameters: σ sat, LETth and Weibull fit For LETth < 12 MeV.cm2/mg → proton sensitivity possibleBased on these parameters → event rate calculations

For SET, pulse energies are also important pulse amplitudes and durations have to be determined

For some events (e.g., SEGR), destruction of the test samples can’t be preventedResults may be strongly dependent from test patterns or application conditions

European Specification: ESCC 25100

LET

satcm2

LETth

LET (MeVcm2mg-1 )

ESA/ESTECTEC-QCS

Radiation: Tests and requirements for SEE (2)

Experimental method:Fluences > 106 HI/cm2 or > 1010 p+/cm2

Sample size: ( 3+1) min.Particle range > 30 μmBias: dynamic or staticThe range of LETs (HI)/Energies (p+) must be sufficient to determine threshold and saturation A min. of 5 LET/Energy steps is requiredDe-lidded parts for HI – Back side irrad. possible

Experimental Set-upESA supported facilities: HIF(B), PSI (CH), RADEF (F)Other facilities in Europe (IPN- Orsay) or in the USA (BNL …)

ESA/ESTECTEC-QCS

Radiation: Tests for Displacement Damage

Experimental method: Unit of interest: NIEL ( Non Ionizing Energy Loss)

Affected types: CCDs / Optocouplers / GaAs (and similar material) based components …

Ground test: protons ( pref. < 60 MeV), fluences > 1010 p+/cm2

neutrons ( ~ 1MeV), fluences > 1010 n/cm2

Some parts are also TID sensitive ( if a silicon chip is included)

Sensitivity to bias conditions

ESA/ESTECTEC-QCS

Radiation: points of contact at ESTEC & facilities availability

Who to contact ? Radiation Effects Section (TEC-QCA)TID, DD: Ali Mohammadzadeh - [email protected]

SEE: Reno Harboe - Sorensen - [email protected]

Availability of the facilities can be checked on line in ESA radiation section of ESCIES

https//escies.org

ESA/ESTECTEC-QCS

Radiation characterization of a component/technology is a mandatory step BUT

A lot more is required to get a Flight Model

At this stage, one has to distinguish between:– An approval on a case by case basis which is an

individual and limited authorisation for a specific project

– A full ESCC Qualification ( including an Evaluation phase in the ESCC system) which is a general and long term authorisation of use in space

Let’s first briefly present the relevant requirements

ESA/ESTECTEC-QCS

RELEVANT REQUIREMENTS

• ECSS European Coop. for Space Standardisation

– Space Project Management; Space Product Assurance; Space Engineering

ECSS-Q60A: Requirements for supply and use of EEE components at equipment level

• ESCC European Space Components Coordination ( ESCC is the preferred option)

– The ESCC System is an international system for the specification / qualification / procurement of EEE components for use in Space programmes. It covers:

• the technical specification of EEE parts• methodologies for component evaluation and qualification• testing methods / quality assurance / operational provisions

ESA/ESTECTEC-QCS

RELEVANT REQUIREMENTS

ECSS- Q60A

Non-qualified components have to be evaluated ECSS defines what to do but not how to do The evaluation programme shall include:

A constructional analysis A manufacturer assessment An Evaluation testing

Electrical stress ( Life test, HTRB …) Mechanical stress ( shocks, vibrations …) Environmental stress ( temp. shock and cycling, seal tests …) Assembly capability Radiation testing ( TID and SEE)

ESA/ESTECTEC-QCS

ESCC Eval. / Qualif. Approach: The ESCC system in brief

For users, 3 levels of specifications:• Basic: test methods, qualification methodology and general requirements applicable

to all ESCC components

• Generic: requirements for screening, periodic or lot acceptance testing and qualification testing for individual families of components

• Detail: performance requirements for individual or ranges of particular components

ESCC 20000 – Using the ESCC Specification System

An international system for the specification / qualification / procurement of EEE components

for use in Space programmes

ESA/ESTECTEC-QCS

ESCC QUALIFICATION

• ESCC qualification approval is a status given to electronic components which are manufactured under controlled conditions and which have been shown to meet all the requirements of the relevant ESCC specifications.

• Unlike the US MIL System, ESCC is based on a 2 step qualification approach: Evaluation + Qualification

• During the Evaluation phase, components/technologies can be more extensively characterised and margins determined

• 3 main phases:– Manufacturer Evaluation ( ESCC 20200) -> AUDIT– Component Evaluation ( ESCC 22600 and ancillaries)

• Preparation and realization of an agreed Evaluation Test Program ( ETP) including:– Constructional analysis and technology evaluation – Step-Stress testing

• Preparation of a Process Identification Document (PID) & Detail Specification– Component Qualification testing

• On components produced strictly as defined in the final PID and from a given lot• According to ESCC Generic Spec. requirements

ESA/ESTECTEC-QCS

COMPONENT EVALUATION

• Constructional Analysis– On random samples taken from the current production – Performed by the Evaluation Authority (ESCC Executive)

• Evaluation Test Programme – Established in conjunction Manufacturer / ESCC Executive– On a sample ( ~ 100 parts) representative of the component family – In order to determine failure modes and margins, it includes:

• Endurance tests ( HTRB, Extended Burn-in, Life Test …)• Destructive tests ( Step-stress, radiation, Environmental/Mechanical/Assembly…)

– Includes a CA on representative components– Ancillary specifications 226xxxx* describe the procedure and requirements to

create and perform an ETP

ESCC QUALIFICATION ESCC 22600

Stand. Comp. Eval

*: xxxx = generic spec. number

ESA/ESTECTEC-QCS

COMPONENT EVALUATION

• Process Identification Document ( PID)

– Shall be prepared by the Manufacturer – Establishes a precise reference for an electronic component qualified in accordance with

the ESCC System • Component’s design configuration• Materials used in manufacture • Manufacturing processes and controls • Inspections and tests to be carried-out during and after manufacture

– PID shall be in accordance with the requirements of ESCC 22700

• Detail Specification – Necessary if not already described by an existing Detail Specification – Or if the existing specification requires updating

– Described in ESCC 20800.

ESCC QUALIFICATION ESCC 22600

Stand. Comp. Eval

ESA/ESTECTEC-QCS

QUALIFICATION TESTING PHASE

• Prerequisites:– Successful completion of the Evaluation Phase (EPPL listing)

– The PID reviewed and approved by ESCC Executive

– A production and test schedule for major processing operations

– A Production Flow Chart, Process Schedules and Inspection Procedures

ESCC QUALIFICATION

• Components required for qualification testing must be produced strictly in accordance with the PID • Qualification testing of the component must be in accordance with the requirements of the relevant

ESCC Generic Specification • On successful completion of the testing phase => ESCC QPL• A Qualification, once established, is valid for 2 years

ESA/ESTECTEC-QCS

ESCC Gen. Spec. 9000

Integrated Circuits, Monolithic, hermetically Sealed

CHART F1

ESCC 9000describes the general requirements for-Qualification-Qualification maintenance-Procurement-Deliveryof hermetically sealed, hermetic ICs.

F2

F3

F4-SG2 (ESCC Qual)- optionalF4 (Not ESCC Qual)- mandatory

F4

GENERAL FLOW FOR PROCUREMENT (ESCC GS 9000)

DELIVERY

PERIODIC TESTING

Special In-Process Controls

PRODUCTION CONTROL

RELEASE

LOT VALIDATION TESTING

SCREENING TESTS

Wafer Lot Acceptance

ESA/ESTECTEC-QCS

(previous SCC Chart II and III)

all lots for qualification, maintenance, lot validation and delivery

shall be submitted to inspections and tests

24h, max. store temp. rating

devices with cavities

(PDV) values recorded agaisnt SN

(HTRB) duration and conditions in ESCC DS

values recorded agaisnt SN, drifts calculated lot failure criteria

240h, alternative allowed (detailed in 1015)

values recorded agaisnt SN, drifts calculated lot failure criteria

3 θ values recorded agaisnt SN lot failure criteria

3 θ values recorded agaisnt SN lot failure criteria

sampling ( no failure allowed) lot failure criteria

Max failure rate: 5%

during 100% testing

ESCC DS

883-TM1014A/B/C

ESCC BS 20500

F4 if applicable

883-TM1008

883-TM1010C

883-TM2020A

883-TM1015A

883-TM1015 B/D/or E

ESCC DS

Check for LOT FAILURE

Seal (Fine and Gross Leak)

External Visual Inspection

Solderability

Power BI

Final PDV

High and Low Temp. Elec Measurements

Room Temp. Elec Measurements

PIND

Param. Drift Values (Initial Measurement )

High Temp., Reverse Bias, BI

PDV post HTRB and before Power BI

SCREENING TESTS / COMPONENTS FROM PRODUCTION CONTROL (F3)

All components shall be SERIALISED prior screening tests

High Temp. Stabilisation Bake

Temp. Cycling

ESCC 9000 – CHART F3

ESA/ESTECTEC-QCS

(previous SCC Chart IV and V)

SG1 SG2 SG3

Mecha. Shock Therm. Shock883-2002B 883-1011C

Vibration Moisture883-2007A 883-1004

Constant Acc.883-2001E

Seal Seal883-1014A/B/C 883-1014A/B/C

values recorded

agaisnt SN

Electrical Measurements


Ext.Visual Insp. Ext.Visual Insp.ESCC 20500 ESCC 20500

QUALIFICATION AND PERIODIC TESTS (F4)

50 (1 type) /36 (per type if 2 types) /26 (per type if 3 types) Components

ENV./MECHA. Subgroup ENDURANCE SG ASSEMBLY SG

24 months period 12 months period 24 months period

15/11/8 components 15/11/8 components 5/3/2 components

883-1005


883-2019

(values recorded agaisnt SN)

Seal883-1014A/B/C

Ext.Visual Insp.ESCC 20500

Permanence of MarkingESCC 24800

Terminal Strengh883-2004

Internal Visual InspectionESCC 20400

Bond Strengh883-2011

Die Shear

Operating Life Test 2000h

ESCC 9000 – CHART F4

ESA/ESTECTEC-QCS

QUALITY CONFORMANCE DOCUMENTATION AND REQUIREMENTS

• As a minimum, the Manufacturer quality management plan must address the ESCC 24600 requirements ( prescriptions to ISO 9001).

• The resulting Manufacturer quality management system has to include and demonstrate the application of all the applicable ESCC 24600 requirements.

QUALITY MANAGEMENT

As a minimum, the QM plan shall address the requirements of ESCC 24600

ESA/ESTECTEC-QCS


• An appointed CHIEF INSPECTOR with clearly defined authority and responsibility ( including CoC)

• CONTROL of NON-CONFORMING PRODUCTS invoking the requirements of ESCC 22800

• QUALITY and CONTROL DOCUMENTATION including:– Quality manual ( indicating as a objective the conformance to ESCC 24600)

– Document control procedures for all documents related to the ESCC components manufacture ( incl. subs./suppliers management)

– A maintained PID

– Change Control Programme establishing the requirement for documentation of ALL changes, their reasons and the associated data including reliability and re-qualification results

QUALITY MANAGEMENT


ESA/ESTECTEC-QCS


• TRACEABILITY has to be maintained at all stages of production and tests for all lots – Quality records have to be maintained for 5 years ( possibly 10 in a near future)

– Record of all components found to be defective

• A Conversion of CUSTOMER REQUIREMENTS (specific tests or test vehicles, marking, rework, screening )

• A CONTROL/INSPECTION prog. Including:– On-receipt / incoming tests / inspections

– Applicable ESCC in-process monitoring/control and back-end tests

– Procedures shall detail the frequency, methods and criteria for evaluating test results

– Data shall be maintained

QUALITY MANAGEMENT


ESA/ESTECTEC-QCS


• A training and certification programme with periodic recertification ( for operators involved in ESCC components manufacture)

• An appropriate failure analysis capability has to be established with documented procedures for the application of the techniques and the generation of reports. This capability may include the use of appropriate external facilities.

• A Calibration programme to meet ESCC 21500

QUALITY MANAGEMENT


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