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Guidelines for the Installation and Alignment of 300 mm Overhead Transport Systems (OTS) and Load Port Interfaces

International SEMATECH Technology Transfer #02064276A-ENG

© 2002 International SEMATECH, Inc.

International SEMATECH and the International SEMATECH logo are registered service marks of International

SEMATECH, Inc., a wholly-owned subsidiary of SEMATECH, Inc.

Product names and company names used in this publication are for identification purposes only and may be trademarks or service marks of their respective companies.

Guidelines for the Installation and Alignment of 300 mm Overhead Transport Systems (OTS) and Load Port Interfaces

Technology Transfer #02064276A-ENG International SEMATECH

June 19, 2002

Abstract: This document from the MFGM009 project provides high-level guidelines for installing and aligning overhead transport systems (OTS) and 300 mm process equipment. Two specific scenarios are addressed: the installation and alignment of process tools after an OTS is in place and the installation and alignment of an OTS after process tools are in place Three maintenance operations for process tools and the OTS are also included: periodic checks, preventive maintenance (PM) checks, and re-checks after a catastrophic event. In addition, the installation of monuments and reticle-handling systems is discussed.

Keywords: 300 mm Wafers, Automated Materials Handling, Procedures, Overhead Transport, Equipment Installation, Standards

Authors: Giovanni Ghezzi, Lorn Christal

Approvals: Giovanni Ghezzi, Author Lorn Christal, Author Terry Komer, Project Manager Marlin Shopbell, Program Manager Scott Kramer, Director Laurie Modrey, Technical Information Transfer Team Leader

iii


Table of Contents

1 EXECUTIVE SUMMARY..................................................................................................... 1

2 PURPOSE AND SCOPE........................................................................................................ 1

3 REFERENCE DOCUMENTS................................................................................................ 1

4 REQUIREMENTS.................................................................................................................. 2

5 OTS/LOAD PORT INSTALLATION AND ALIGNMENT GUIDELINES.......................... 2 5.1 Process Tool Installation and Alignment After OTS Installation ................................. 4

5.1.1 X-Y Coordinate Establishment .......................................................................... 4 5.1.2 Process Tool Alignment to X-Y Coordinate System ......................................... 4 5.1.3 300 mm Load Port Alignment............................................................................ 5 5.1.4 OTS Vehicle Teaching ....................................................................................... 5 5.1.5 Alignment Verification....................................................................................... 6 5.1.6 Installation and Alignment Procedures Completed............................................ 6

5.2 Overhead Transport System: Installation and Alignment After Process Tool Install ............................................................................................................................. 8 5.2.1 X-Y Coordinate Establishment .......................................................................... 9 5.2.2 OTS Alignment to X-Y Coordinate System....................................................... 9 5.2.3 300 mm Load Port Kinematic Verification ........................................................ 9 5.2.4 OTS Vehicle Teaching ....................................................................................... 9 5.2.5 Alignment Verification..................................................................................... 10 5.2.6 OTS Installation and Alignment Completed .................................................... 10

6 OTS/LOAD PORT MAINTENANCE CHECKLIST .......................................................... 13 6.1 Process Tool and Overhead Transport System Periodic Checks ................................ 13

6.1.1 Periodic Checks May Include the Following ................................................... 13 6.2 Process Tool and Overhead Transport System PM Checks........................................ 13

6.2.1 Preventive Maintenance (PM) Checks May Include........................................ 13 6.3 Process Tool and Overhead Transport System Re-Checks After a Catastrophic

Event............................................................................................................................ 13 6.3.1 Re-Checks After a Catastrophic Event (i.e., Earthquake) May Include

the Following................................................................................................... 13

7 MONUMENT CONSIDERATIONS.................................................................................... 14 7.1 Monument Installation Before Process Tool and OTS Installation and

Alignment in a “Greenfield Fab” ................................................................................ 14 7.1.1 Monument Installation Procedures................................................................... 14

8 RETICLE-HANDLING SYSTEM CONSIDERATIONS.................................................... 14 8.1 Reticle-Handling Track Installations .......................................................................... 14

8.1.1 Track Type Determination ............................................................................... 14 8.1.2 Wafer/Reticle Track Height ............................................................................. 14

iv


List of Figures

Figure 1 A Side View of the OTS Chimney............................................................................. 3

Figure 2 The Tri-Lateral Datum Point ..................................................................................... 4

Figure 3 Flowchart Depicting Process Tool Installation/Alignment After OTS Installation ................................................................................................................. 7

Figure 4 Flowchart Depicting OTS Installation/Alignment After Process Tool Installation ............................................................................................................... 11

v


Acknowledgments

Carl Johnson, Brooks-PRI

Ashwin Ghatalia, Philips Assignee to International SEMATECH

Paul Cherry, Intel

Ed Sherwood, IBM

Jim Ammenheuser, International SEMATECH

Paul Fowler, International SEMATECH

Kendel Saunders, Eskay

Ray Reyes, IBM

Vittorio Scaravaggi, ST Microelectronics

vi


GLOSSARY AND ACRONYMS

The keywords and acronyms below have the following specific meanings in this document: Term or Acronym Definition

AGV Automatic guided vehicle: a floor-based vehicle with robot arm that operates without the need for operator assistance.

BDP Bilateral datum plane: a vertical plane that bisects the wafers and that is perpendicular to both the horizontal and facial datum planes.

Equipment boundary The front of any equipment protrusion into the OTS chimney, which is behind the load port and above the interface to the carrier. This equipment boundary is parallel to the load face plane.

FOUP Front opening unified pod: a pod used for holding 300 mm wafers.

Greenfield fab A semiconductor fabrication facility built on new ground where no structure previously existed.

Grid Spatial partition (x-y) of the surface of the facility. The geometrical partition of the ceiling and of the floor.

Guidelines Statements that define device companies’ intended and/or projected configurations and modes of operations for factories and equipment.

Kinematic coupling A registering mechanism commonly used in 300 mm equipment, consisting of three pins and corresponding mating surfaces that provide an order of magnitude improvement in wafer registration and placement accuracy compared to the traditional H-bar in 200 mm equipment.

Load port The transfer location or physical interface between any carrier transport system and the wafer handling system controlled locally by the process or metrology equipment.

Monument Permanently installed device inscribed with physical markings representing control lines (x axis and y axis) used for the placement of equipment. It may also be installed to represent a specific elevation (z axis) if necessary. Monuments are located and inscribed by surveying equipment and thereafter serve as references to align equipment with or without the surveying equipment. Typically, multiple monuments are necessary to represent orthogonal control lines to successfully locate equipment or features within an environment.

OTS Overhead transport system.

Pedestals Structural assemblies to transfer the load imposed by the weight of the tool to the concrete foundation.

PGV Person guided vehicle: a ground-based vehicle, without electrical assist, directed and moved by fab facility personnel.

PM Preventive maintenance.

Recommendations Preferred approaches for design considerations, but the supplier may propose equivalent or a better design or approach.

References Other readily available documents and statements containing additional information on the subject. Does not necessarily imply authority of these documents and statements.

Requirements Business drivers that determine what the device manufacturing companies must accomplish in their operations to meet cost and technology goals.

RGV Rail guided vehicle: a floor-mounted vehicle guided with rails by a robot.

Standards Voluntary technical agreements between suppliers and customers to ensure compatibility and interoperability of goods and services to reduce overall cost.

1


1 EXECUTIVE SUMMARY

The goal of this document is to provide high-level guidelines for installing and aligning overhead transport systems (OTS) and 300 mm process equipment to ensure successful automated material delivery operations for integrated circuit production. Rail guided vehicle (RGV) and automated guided vehicle (AGV) systems are not addressed, but some references are made to person-guided vehicles (PGVs).

Until now, International SEMTECH (ISMT) factory guidelines have not completely addressed the installation and alignment of separate systems for automated manufacturing. Although suppliers of overhead delivery systems have extensive experience with factory automation, the complexities of semiconductor manufacturing and automation introduce new challenges.

This document presents guidelines for installing and aligning OTS and 300 mm process equipment. Two specific scenarios are addressed:

1. The installation and alignment of process tools after an OTS is in place

2. The installation and alignment of an OTS after process tools are in place

Three maintenance operations for process tools and the OTS are also included: periodic checks, preventive maintenance (PM) checks, and re-checks after a catastrophic event. In addition, the installation of monuments and reticle-handling systems is discussed. Any other new or expanded guidelines will be included in future editions of this document.

2 PURPOSE AND SCOPE

This document addresses aligning OTS’ to 300 mm processing equipment using SEMI E15.1 load ports. Some references are made to PGV and reticle-handling systems; however, the focus here is on the alignment of OTS’ to the delivery interfaces of the process equipment. SEMI E15.1 load port alignment to material handling end-effectors is not addressed in this document.

3 REFERENCE DOCUMENTS

• I300I Factory Guidelines: Version 5.0, Technology Transfer # 97063311G-ENG, International SEMATECH, April 28, 2000

• 300 mm Best Known Practices (300 BKP) for 300 mm Factory Integration, Technology Transfer # 00124063B-ENG, International SEMATECH, November 30, 2001

• SEMI E15.1-0600, Specification for 300 mm Tool Load Port

• SEMI E-72-0600: Specification and Guide for 300 mm Equipment Footprint, Height and Weight

• SEMI E-70-0698: Guide for Tool Accommodation Process

• SEMI E-57-0600: Mechanical Specification for Kinematic Coupling Used to Align and Support 300 mm Wafer Carriers

2


4 REQUIREMENTS

The installation and alignment guidelines in this document were derived from the following:

• I300I Factory Guidelines: Ver. 5.0, §2.10 – Straight-Line Alignment of Load Ports—Equipment must be designed for straight-line mounting (i.e., alignment of carrier load ports from equipment to equipment) and enabling of automated intrabay delivery system functionality (i.e., delivery from straight line overhead track system).

• SEMI E15.1-0600, Specification for 300 mm Tool Load Port, §7.3—The wafers are to be oriented horizontally face up with zero nominal tilt at the time they are placed onto the load port. The tolerance in the horizontal plane is to be determined by the registration and alignment feature between the carrier and the load port, as specified in SEMI E57.

• SEMI E15.1-0600, Specification for 300 mm Tool Load Port, §7.4—Dimension H is nominally 900 mm, fully adjustable upon installation over the range of 890–910 mm. The precision with which the load port height must be maintained is dictated by the needs of the carrier delivery system.

• SEMI E15.1-0600, Specification for 300 mm Tool Load Port, §7.10—If the tool occupies a space behind the load port and above any interface to the carrier, then the front of that upper part of the tool must be at a distance D1 (200 mm +10/-4) from the facial datum plane. This equipment boundary is parallel to the load face plane, and carriers may be moved or rotated below this surface after loading.

5 OTS/LOAD PORT INSTALLATION AND ALIGNMENT GUIDELINES

This section addresses two specific scenarios:

1. The installation and alignment of process tools after an OTS is in place 2. The installation and alignment of an OTS after process tools are in place

The installation procedure for each is different based upon the situation.

3


To present a clear understanding of the guidelines presented in this document, two figures are provided. Figure 1 shows a side view of the OTS chimney, which must be kept unobstructed to ensure successful automatic delivery of wafer pods from overhead delivery systems.

Figure 1 A Side View of the OTS Chimney

4


Figure 2 presents a view of the tri-lateral datum point. This point does not exist in reality; however, it is created by the intersection of the horizontal, facial, and bilateral datum planes described in several SEMI physical interface and carrier standards.

Figure 2 The Tri-Lateral Datum Point

5.1 Process Tool Installation and Alignment After OTS Installation These guidelines address the installation and alignment of process tools after an OTS is in place.

5.1.1 X-Y Coordinate Establishment

5.1.1.1 Reference existing monuments to establish an X-Y coordinate system in the facility.

5.1.1.2 Create the x-y grid on the floor or ceiling that will be used as the basis for equipment alignment.

5.1.1.3 Create a control line on the floor or ceiling using the x-y grid.

5.1.2 Process Tool Alignment to X-Y Coordinate System

5.1.2.1 Define the equipment boundary surface on the process tool according to SEMI E15.1.

Note: The dimension (D1) from the equipment boundary to the facial datum plane must be at a distance of 200 mm +10/-4 according to the load port standard.

5.1.2.2 Determine if the size and weight of this tool will require a special installation process.

5.1.2.3 If the size and weight require a special installation process, install the tool according to its specific size or weight requirements.

5


Note: As an example, a linked lithography tool requires a special order (criticality) of installation as follows:

a. Light source

b. Facilities and front opening unified pod (FOUP) load ports

c. Reticle load ports

Another example is equipment that must be installed upon “pedestals” because of its weight.

5.1.2.4 If the tool requires no special installation process, continue installation using normal procedures defined by the equipment supplier in conjunction with facility requirements of the end user.

Note: It is suggested that the line of sight between monuments not be compromised by the installation of tools in the facility.

5.1.2.5 Determine if the process tool is level.

If the tool is not level, adjust it until it is (zero nominal tilt).

5.1.3 300 mm Load Port Alignment Note: The following steps may be aided by using procedures in ISMT Technology Transfer # 00124063B-ENG, 300 mm Best-Known Practices (300 BKP) for 300 mm Factory Integration, § 3.1.2.1 through 3.1.2.5, and 3.1.2.11.

5.1.3.1 Ensure zero nominal tilt of the kinematic coupling.

Note: It is important to understand the impact of this step upon the alignment of wafer handling end-effectors for transferring wafers to the process portion of the tool. The zero nominal tilt of the kinematic coupling must be maintained at all delivery locations.

5.1.3.2 Measure the SEMI E15.1 H dimension to determine if it is within specification (H = 900 mm with ± 10 mm adjustment range).

5.1.3.3 If the E15.1 H dimension is not within specification, make adjustments until it meets the E15.1 specification.

5.1.3.4 Using the equipment boundary previously established in this procedure, measure the SEMI E15.1 D1 dimension to determine if it is within specification. (D1 = 200 mm + 10/-4 mm).

Note: The OTS system may present a specification tighter than that of E15.1 D1 = 200 +10/-4.

5.1.3.5 If the E15.1 D1 dimension is not within specification, make adjustments until it meets the E15.1 specification.

5.1.4 OTS Vehicle Teaching

5.1.4.1 For facilities using OTS systems, ensure a nominal “dead-on” stop (x direction of travel) at the bilateral datum plane (BDP).

5.1.4.2 If PGVs are used, the order of adjustment is as follows:

1. Z (vertical)

2. Y (along the bilateral datum plane)

3. ��

6


4. X (along the facial datum plane)

Note: In this case, “Z” is a critical coordinate for PGV delivery.

5.1.4.3 If PGVs are not used, the order of adjustment is as follows:

1. Y

2.

3. X

Note: In both cases, FOUP flange gripper adjustments affect cycle time, which may result in a time penalty to factory throughput.

5.1.4.4 Teach the OTS-to-tool hoist dimension from each OTS vehicle to the kinematic coupling.

5.1.4.5 Teach each OTS vehicle its proper X- and Y-��

5.1.5 Alignment Verification

5.1.5.1 Measure critical dimensions (H, D, D1) to verify sound installation and alignment. If necessary, perform adjustments until they are within specification.

Note: In severe out-of-alignment situations, equipment utilities may require rerouting. The rerouting must facilitate movement of the equipment. In this case, proceed as follows:

1. Reroute utilities

2. Move the equipment

3. Reconnect utilities

4. Realign the equipment

5.1.6 Installation and Alignment Procedures Completed

5.1.6.1 Repeat the above steps as appropriate for each load port and/or material transfer station.

7


Create the x-y grid on the floor orceiling for use going forward

Define the equipment boundary surface onthe process tool per SEMI E15.1

Whichequipment is

being installed, OTSor a Process

Tool?Reference existing monuments to establishan x-y coordinate system in the fab

Process Tool

Create a control line on the floor or ceiling,based on the chosen plane

Measurethe SEMI E15.1 D1

dimension

PerformAdjustments

Is theprocess tool

level?No

PerformAdjustments

Out of Spec

Measurethe SEMI E15.1 H

dimension

PerformAdjustments

Yes

2

OTS

Start

Ensure zero nominal tilt ofthe kinematic coupling

Using the control line as areference, install the tool

per its specific size orweight requirements

Does thetool require a special

installation?Yes

No

Within spec

For example, on a linked lithography tool, the orderof criticality would be:

1. Light source2. Facilities & FOUP Load Ports3. Reticle Load Ports

Another example would be equipment that must beinstalled upon pads due the extreme weight involved.

Note: Theimpact of thisstep to the waferhandling end-effector must becomprehendend.

Note: Nominal installation of the equipment’s trilateral datum point (the intersection betweenthe bilateral, facial, and horizontal datum planes) will ensure alignment integrity.

It is also suggested that the line of sight between monuments not be compromised by theinstallation of tools in the facility.

Note: The E15.1 equipmentboundary is defined as any equipmentprotrusion from a point above theFIMS door into the hoist chimney.

Move theprocess tool

into the facilityand install perthe control line

See OTSSection

Out of Spec

Figure 3 Flowchart Depicting Process Tool Installation/Alignment After OTS Installation

8


2

Teach tool-to-tool hoistdimension from the vehicle to

the kinematic coupling

Ensure nominal "dead-on" stop of OTSvehicles at the Bilateral Datum Plane (BDP)

Teach X and Y axis dimension,along with θ rotation

Are PGV’sto be used in the

facility?

No

The order of adustmentcriticality is:

1. Y2. θ3. X

Yes

Perform multiple measurements toverify sound installation and alignment


1. Z2. Y3. θ4. X

Withinspecification?

Yes

PM checks:1. Load ports alignment2. Kinematic couple tilt3. OTS hoist dimension (Z)4. OTS alignment (X and Y)5. Facility floor level6. Ceiling structure level

End of Installation andAlignment

PerformAdjustments

Re-checks procedure after acatastrophic event (i.e., earthquake):

1. Monuments position2. Ceiling grid and/or floor grid3. Load port alignment4. Kinematic coupling tilt5. OTS hoist dimension (Z)6. OTS alignment (X and Y)7. Facility floor level8. Ceiling structure level

Note: Gripperadjustments affect

cycle time resultingin a time penalty tofactory throughput

Perform periodic checks:1. Load ports alignment2. Kinematic couple tilt3. OTS hoist dimension (Z)4. OTS alignment (X and Y)5. Facility floor level6. Ceiling structure level

No

Note for the case of processtool installation only: Insevere out-of-alignmentsituations the equipmentutilities may require rerouting.In such a case, the reroutingmust occur to facilitatemovement of the equipment.At that point, the equipmentmust be realigned followingthe procedure listed on pageone of this flow chart.

Note: The impact ofthis step to the waferhandling end-effectormust becomprehendend.

Repeat as appropriate for each loadport and/or material transfer station.

Figure 3 Continued

5.2 Overhead Transport System: Installation and Alignment After Process Tool Install

These guidelines address the installation and alignment of an OTS after process tools are in place. IMPORTANT: The following steps assume that installed process tools are in place and nominally aligned using steps similar to those present in the “Process Tool Installation and Alignment After OTS Installation” section of this document.

9


5.2.1 X-Y Coordinate Establishment

5.2.1.1 Reference existing monuments to establish an x-y coordinate system in the facility.

5.2.1.2 Create the x-y grid on the floor or ceiling that will be used as the basis for the equipment.

Note: Create a control line on the floor or ceiling using the x-y grid.

5.2.2 OTS Alignment to X-Y Coordinate System

5.2.2.1 Move the OTS components into the facility and install them according to the control line.

5.2.2.2 Determine if the OTS track is level.

5.2.2.3 If the OTS track is not level, adjust it until it is (zero nominal tilt).

5.2.2.4 If the OTS is level, measure any required or critical dimensions to determine if they are within specification.

5.2.2.5 If the required or critical dimensions are not within specification, adjust them until they meet the specification.

5.2.3 300 mm Load Port Kinematic Verification Note: This step may be aided by the use of procedures in ISMT Technology Transfer # 00124063B-ENG, 300 mm Best-Known Practices (300 BKP) for 300 mm Factory Integration, § 3.1.2.1 through 3.1.2.5, and 3.1.2.11.

5.2.3.1 Align the tri-lateral datum point of load port to the OTS using procedures defined by the process tool supplier.

5.2.3.2 Ensure zero nominal tilt of each kinematic coupling to which an OTS delivery must be made.

Note: It is important to understand the impact of this step upon the alignment of wafer handling end-effectors for transferring wafers to the process portion of the tool. The zero nominal tilt of the kinematic coupling must be maintained at all delivery locations.

5.2.4 OTS Vehicle Teaching

5.2.4.1 Ensure a nominal “dead-on” stop (x direction of travel) of OTS vehicles at the BDP.

5.2.4.2 If PGVs are used, the order of adjustment is as follows:

1. Z

2. Y

3.

4. X

Note: In this case, “Z” is a critical coordinate for PGV delivery.

5.2.4.3 If PGVs are not used in the facility, the order is as follows:

1. Y

2.

3. X

10


Note: In both cases, FOUP flange gripper adjustments affect cycle time, which may result in a time penalty to factory throughput.

5.2.4.4 Teach the OTS-to-tool hoist dimension from each OTS vehicle to the kinematic coupling.

5.2.4.5 Teach each OTS vehicle its proper X- and Y-axis dimension, along with rotation.

5.2.5 Alignment Verification

5.2.5.1 Measure critical dimensions (H, D, D1) to verify sound installation and alignment. If necessary, perform adjustments until they are within specification.

5.2.6 OTS Installation and Alignment Completed

5.2.6.1 Repeat the above steps as appropriate for each load port and/or material transfer station.

11


Is theO TS level?

PerformAdjustm ents

M easurethe SEM I

dim ensions

Yes

Create the X-Y grid on the flooror ceiling for use going forward

Reference existing m onum entsto establish an X-Y coordinate

system in the fab

Create a contro l line on the floor orceiling, based on the chosen p lane

M ove the O TS into the facilityand ins ta ll per the control line

N ote: It is suggestedthat the line of s ightbetween m onum ents notbe com prom ised by theins ta lla tion of O TS in thefacility

N o

PerformAdjustm ents

N o

Yes

W hichequipm ent is

being insta lled, O TSor a Process

Tool?

Create the X-Y grid on the flooror ceiling for use going forward

Reference existing m onum entsto establish an X-Y coordinate

system in the fab

Create a contro l line on the floor orceiling, based on the chosen p lane

Start

Process Tool

See ProcessTool Section

2

O TS

Note: This flow assumesthat installed process toolsare in place and nominallyaligned using proceduressimilar to those present inthe "process tool" version ofthis chart.

Figure 4 Flowchart Depicting OTS Installation/Alignment After Process Tool Installation

12


2

Teach tool-to-tool hoistdimension from the vehicle to

the kinematic coupling

Ensure nominal "dead-on" stop of OTSvehicles at the Bilateral Datum Plane (BDP)

Teach X and Y axis dimension,along with θ rotation

Are PGV’sto be used in the

facility?

No


1. Y2. θ3. X

Yes

Perform multiple measurements toverify sound installation and alignment


1. Z2. Y3. θ4. X

Withinspecification?

Yes

PM checks:1. Load ports alignment2. Kinematic couple tilt3. OTS hoist dimension (Z)4. OTS alignment (X and Y)5. Facility floor level6. Ceiling structure level

End of Installation andAlignment

PerformAdjustments

Re-checks procedure after acatastrophic event (i.e., earthquake):

1. Monuments position2. Ceiling grid and/or floor grid3. Load port alignment4. Kinematic coupling tilt5. OTS hoist dimension (Z)6. OTS alignment (X and Y)7. Facility floor level8. Ceiling structure level

Note: Gripperadjustments affect

cycle time resultingin a time penalty tofactory throughput

Perform periodic checks:1. Load ports alignment2. Kinematic couple tilt3. OTS hoist dimension (Z)4. OTS alignment (X and Y)5. Facility floor level6. Ceiling structure level

No

Note for the case of processtool installation only: Insevere out-of-alignmentsituations the equipmentutilities may require rerouting.In such a case, the reroutingmust occur to facilitatemovement of the equipment.At that point, the equipmentmust be realigned followingthe procedure listed on pageone of this flow chart.

Note: The impact ofthis step to the waferhandling end-effectormust becomprehendend.

Repeat as appropriate for each loadport and/or material transfer station.

Figure 4 Continued

13


6 OTS/LOAD PORT MAINTENANCE CHECKLIST

Periodic maintenance checks may be required of the aligned systems. Therefore this section addresses three maintenance operations for process tools and the OTS: periodic checks, preventive maintenance (PM) checks, and re-checks after a catastrophic event.

6.1 Process Tool and Overhead Transport System Periodic Checks

6.1.1 Periodic Checks May Include the Following

• Load port alignment

• Kinematic couple tilt

• OTS hoist dimension (Z)

• OTS alignment (X and Y)

• Levelness of the floor

• Levelness of the ceiling

6.2 Process Tool and Overhead Transport System PM Checks

6.2.1 Preventive Maintenance (PM) Checks May Include







6.3 Process Tool and Overhead Transport System Re-Checks After a Catastrophic Event

6.3.1 Re-Checks After a Catastrophic Event (i.e., Earthquake) May Include the Following

• Monument position

• Ceiling grid and/or floor grid







14


7 MONUMENT CONSIDERATIONS

This section addresses monument and reticle-handling system installations.

7.1 Monument Installation Before Process Tool and OTS Installation and Alignment in a “Greenfield Fab”

7.1.1 Monument Installation Procedures

7.1.1.1 Install external monuments first.

Note: This should be the first step of the monument installation process. External monuments provide a universal reference system for the internal monuments (i.e., internal monuments require a coordinate).

7.1.1.2 Determine the highest point of the facility at which to place the first monument.

7.1.1.3 Set the first internal monument using the triangulation method and placing the monument at the highest point of the facility.

7.1.1.4 Determine the other internal monument locations using the first monument already set in the facility and a laser.

8 RETICLE-HANDLING SYSTEM CONSIDERATIONS

8.1 Reticle-Handling Track Installations

This section addresses installing a reticle track in the litho area of the facility. Two scenarios are described:

1. Determination of track types

2. Concerns relating to wafer/reticle track height

The ideas in both sections are similar with some minor exceptions. If a design supports both reticle and wafer transport, certain aspects of the system’s design must be considered.

8.1.1 Track Type Determination

8.1.1.1 Determine if the wafer and reticle track use the same track and transport vehicles (the latter with minor modifications).

Note: If the tracks are the same, they may or may not use different vehicles for material transport.

8.1.1.2 If the wafer and reticle tracks use the same track and transport vehicles, install the track using the procedures in section 5.1.

8.1.2 Wafer/Reticle Track Height

8.1.2.1 If the wafer and reticle tracks do not use the same track and transport vehicles, determine whether they are at the same level with respect to the floor.

8.1.2.2 If the wafer and reticle tracks are at the same height, no special installation procedure is recommended other than those presented earlier in this document.

15


8.1.2.3 If the wafer and reticle tracks are not at the same level, the following installation order is recommended:

1. Install critical items, such as wafer-handling load ports and delivery stations, first.

2. Connect the track hangers to facilities.

3. Install the reticle track.

4. Install the OTS vehicles.

Note: Some tools have reticle load ports that are higher than the wafer load ports. If so, install the reticle track at a higher level than the wafer track.

International SEMATECH Technology Transfer 2706 Montopolis Drive

Austin, TX 78741

http://www.sematech.org e-mail: [email protected]

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