picmg systems & technology spring 2015 resource guide

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Standards Update p.5 CompactPCI Serial ascends to Revision 2, AdvancedTCA primed for Ethernet and IPv6 enhancement

Advancing Networks p.6Proprietary implementations of open source in DSN

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2 | Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

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SPRING 2015 | VOLUME 19 NUMBER 1

® 2015 OpenSystems Media® CompactPCI, PICMG, PICMG, ATCA, AdvancedTCA, MicroTCA, AdvancedMC,

GEN4, and their logos are registered trademarks of PICMG.TM xTCA is a trademark of PICMG.© 2015 PICMG Systems & TechnologyAll registered brands and trademarks in AdvancedTCA & CompactPCI Systems are property of their respective owners. Member since 1998

On the cover

As the IEEE looks to advance Ethernet speeds from 40G to 400G for backplane-based systems such as AdvancedTCA, the PICMG Systems & Technology 2015 Resource Guide tracks the evolution of networking technologies in articles that range from 40 GbE MicroTCA and AMCs to 100G backplane design. The Resource Guide also includes myriad products for the designer of next-generation network infrastructure solutions, with products such as the Annapolis Micro Systems WILDSTAR 6/AMC featured beginning on page 19.

Standards Update | Joe Pavlat

5 CompactPCI Serial ascends to Revision 2, AdvancedTCA primed for Ethernet and IPv6 enhancement

Advancing Networks | Brandon Lewis

6 Proprietary implementations of open source in SDN

Technology Focus

8 Identifying challenges in 100G backplane design By Sergej Dizel, Pentair Technical Products GmbH

Application Feature

11 Upgrading MicroTCA.0 and AMC.2 to 40 GbE speed levels By Justin Moll,VadaTech, Inc.

Industry Outlook

14 Ethernet – 40G to 400G Interview with John D’Ambrosia, Chairman, Ethernet Alliance; Chair,

IEEE P802.3bs 400 GbE Task Force; and Chief Ethernet Evangelist, Dell

PICMG Resource Guide

19 Resource Guide Profiles AdvancedMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

AdvancedTCA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

COM Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

CompactPCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

DSP-FPGA Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Front Panel Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Mezzanines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

MicroTCA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39


Identifying challenges in 100G backplane design

By Sergej Dizel, Pentair Technical Products GmbH

Technology Focus 8

Upgrading MicroTCA.0 and AMC.2 to 40 GbE speed levels

By Justin Moll,VadaTech, Inc.

Application Feature 11

Ethernet – 40G to 400G Interview with John D’Ambrosia

Industry Outlook 14

Standards-based technology platforms for open innovation


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Open standards for embedded com-puting offer the customer a wide range of products, vendor independence, and a fairly predictable upgrade path to incorporate new semiconductor, storage, and software technologies. The standards themselves are generally developed and maintained by open organizations or consortia that work to be inclusive and not beholden to one or a few companies. There are many suc-cessful open standards organizations in operation, and the IEEE, PICMG, and VITA are among the best known.

One of PICMG’s early successful stan-dards is CompactPCI, which incorpo-rates the wealth of PCI silicon developed for the desktop PC world into a modular and rugged standard for embedded computing. First released in 1995, it continues to be the solution of choice for a very wide range of applications, including the Mars rover, Curiosity (I just never get tired of saying that).

Over the last ten years or so, the parallel PCI bus has given way to a serial ver-sion, PCI Express. Serial buses are faster and the chips cheaper, because they trade pin count (which is expensive) for a larger number of transistors (which are essentially free). Other buses, including USB and Serial ATA (SATA) have fol-lowed suit. The granddaddy of all serial communications interfaces, Ethernet, is still with us and just keeps getting faster.

CompactPCI Serial – Revision 2A few years ago, PICMG released a new version of CompactPCI known as CompactPCI Serial. It provides a tenfold or so increase in performance, more interconnectivity using fewer pins, and cost-effective features such as the inclu-sion of multi-channel Ethernet without the need for a switch. It is already pop-ular in Europe where it was developed, and its popularity is now moving around the globe. The vendor base continues

to grow, and now includes MEN Mikro Elektronik GmbH, Elma Electronic, Kontron, EKF Elektronik GmbH, ADLINK Technology, Hartmann Electronic, Schroff GmbH, Teledyne Lecroy, ADDI-DATA, and others.

A new revision of the standard in now being released, Revision 2. It adds incre-mental features and capabilities, which is typical of revisions to well-established standards. CompactPCI Serial Revision 2 now supports placement of the system slot on either the left or right side of the backplane. More importantly, Revision 2 supports additional rear I/O on the P6 connector and increased capability on rear transition modules (RTMs). Graphics, USB, SATA, and other system slot connections can now be routed out the rear, important for conduction cooling applications where the front module is fully encased. PCI Express can also be routed out the rear, making it possible to easily interconnect mul-tiple homogeneous or heterogeneous PCI Express systems.

AdvancedTCA 100G EthernetDriven by the need for higher bandwidth in mobility, video, and security, this effort will provide capacity improvement to the AdvancedTCA (ATCA) specification by incorporating 100 Gb backplane Ethernet while maintaining backward compatibility. Formally designated PICMG 3.1 R3.0, the 100G ATCA standard will update the PICMG 3.1 specification to incorpo-rate 100GBASE-KR4 (NRZ) Ethernet sig-naling. This effort began in early 2015, and work is expected to be completed by the end of the year. It is being headed by Doug Sandy, CTO of PICMG and Artesyn Embedded Technologies, who also lead the successful 40G ATCA effort a couple years back.

IPv6 for AdvancedTCAHardware platform management (HPM) has been an integral part of ATCA since

the beginning, and it was originally specified to use 32-bit IP addresses according to the IPv4 protocol. However, IPv4 supports 4 billion distinct IP addresses, and in the emerging world of Internet of Everything and billions of interconnected devices, this is not enough. IPv6 uses 128-bit addresses, so more than 3.4 x 1038 devices can be directly addressed. This new feature will be released as an Engineering Change Notice to the current revision of ATCA, Revision 3.0, helping get this much needed capability to the market quickly. The IPv6 feature is completely optional and does not affect backwards compat-ibility in any way, so all existing ATCA-compliant systems will remain so.

40G for MicroTCA and AMCThe 40G MicroTCA and AMC effort is well underway. The next issue will explore this in more detail.

Figure 1 | CompactPCI Serial supports both 3U and 6U configurations. Shown here is an example 9-slot, 3U CompactPCI Serial system (Figure courtesy MEN Mikro Elektronik GmbH).

›

Figure 2 | Depicted here is an example CompactPCI Serial backplane with the P6 connector configured for multiple rear Ethernet connections (Figure courtesy of MEN Mikro Elektronik GmbH).

›

Standards Update

By Joe Pavlat [email protected]

CompactPCI Serial ascends to Revision 2, AdvancedTCA primed for Ethernet and IPv6 enhancements

AdvancedMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

AdvancedTCA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

COM Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

CompactPCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

DSP-FPGA Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Front Panel Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Mezzanines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

MicroTCA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

www.picmg-systems.com PICMG Systems & Technology Resource Guide | Spring 2015 | 5



Earlier this year I had the opportunity to speak with Jeff Reed, VP of the Enterprise Infrastructure and Solutions Group at Cisco on the company’s software-defined networking (SDN) strategy and trends in SDN in general[1]. I went in armed with some questions about OpenFlow, expected to hear about the company’s involvement in the OpenDaylight initiative, and was primarily interested in the company’s take on how SDN archi-tectures are impacting vendors of hardware platforms such as AdvancedTCA (ATCA). But when I asked about Cisco’s SDN strategy, Reed was quick to point me to their Application Centric Infrastructure (ACI); when I said OpenFlow he responded with OpFlex. Do you see where I’m going with this?

Proprietary implementations of open sourceIn early 2013, Cisco teamed with IBM on the beginnings of OpenDaylight, an open-source project aimed at accelerating the development of SDN and network functions virtualization (NFV). Of course, the term “open source” is used loosely at best these days, and although OpenDaylight is now managed

by the Linux Foundation and had more than 250 contributors in 2014, the vast majority of the now more than 1 million lines of code are courtesy networking giants such as Juniper, Brocade, Microsoft, Intel, and, of course, Cisco[2]. So while OpenDaylight flies under the flag of open source, is it really?

Let me direct your attention back to OpFlex. OpFlex is a Cisco-envisioned protocol that orchestrates policy between the controller and network switch in ACI implementations (as mentioned, ACI is Cisco’s answer to SDN). Ironically, OpFlex is basically the equivalent of what the OpenFlow controller does for SDNs in OpenDaylight configurations, only faster and with more fine-grained control. Currently OpFlex is an open pro-tocol, and Cisco has committed to licensing it under Apache 2.0 in addition to proposing it as a standard to the IETF[3].

While an open-source variant of OpFlex would make the pro-tocol widely accessible to the vendor community at large, it’s also undoubtedly an endorsement of Cisco’s ACI. In addition to an application policy infrastructure controller (APIC), the ACI model relies on hardware such as Cisco’s Nexus 9000 and Nexus 9300 switches. Meanwhile, Reed also pointed out during our conversation that Cisco has been working on a line of net-work ASICs over the past couple years that include a flexible parser and flexible data pipeline so that the ICs “can support protocols that didn’t even exist when we shipped it.”

“That’s such a terrific toolset to have with SDN and ACI because if a customer deploys one of those boxes and a great new pro-tocol comes along a year from now, they can support it without having to go buy a new piece of hardware,” Reed said. “So there’s a lot of opportunity for ACI to continue to drive the rele-vance of capabilities on the network infrastructure itself. Almost every new product or development activity we’re working on ties into ACI and how we enable it via the controllers. That’s part and parcel to how you’ll see Cisco build its products over the next few years.”

In all, these ASICs will provide a migration path from SDN/OpenFlow to Cisco’s ACI/OpFlex architecture, or other future SDN infrastructure combinations. If you’re interested in keeping abreast of the evolution of SDN, I’d suggest you pay attention to contributions in open-source projects such as OpenDaylight; if for no other reason than to make sure there are no surprises.

References:1. “Software-defined networking – A view from the top.”

http:// opsy.st/CiscoSDN2. “A survey of open networking standards, part 1: OpenDaylight.”

http://opsy.st/QualiSystemsOpenDaylight3. “OpFlex: Another example of Cisco being Cisco.”

http://opsy.st/CiscoBeingCisco.Ph: 603.821.9921 • [email protected] • www.verotec.us

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Proprietary implementations of open source in SDN



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Since the introduction of AdvancedTCA (ATCA) in 2002, the race for more data transfer speed on the backplane has been on. The telecom and datacom markets have a hunger for processing power that is never satisfied. Today’s processor technologies such as multicore, GPGPUs, and powerful co-processors can satisfy the demands of full HD video on demand, increasing the number of data-hungry services available for smartphones and other applications. In addition to providing the processing power for these applications, infrastructure must be able to support the huge amount of data traffic they generate. From packet switching backplanes with 1 Gbps of data transfer in the beginning of the millennium, today’s ATCA backplanes support 40 Gbps data transfer. This is achieved by four ports, each with two differential pairs transferring 10 Gbps each, which together are capable of transferring 40 Gbps. Even this is not sufficient to feed today’s most demanding processor blades. Today, dual-dual star backplanes are often used where two switches work in parallel to increase the data traffic between transmitter and receiver to 80 Gbps, though this is certainly not the end point of demand for data speed. The IEEE specification for 100 Gigabit Ethernet (GbE) over copper was released at the end of 2014, and a PICMG working group is defining 100G Ethernet for ATCA based on the IEEE spec.

100 Gbps data rates create many new challenges for backplane design. Figure 1A and 1B show the thresholds for insertion and return loss of the IEEE802.3ap spec-ification (which defined 40G Ethernet), and the new standard IEEE802.3bj that defines 100G. At 100G, the IEEE defined two coding methods, 100GBASE-KR4 and 100GBASE-KP4. As shown in the figures, the thresholds for both new methods of 100G are defined for much higher frequencies. For the backplane this means that all components, such as

connectors, the bare board, and the copper trace structures have to be de signed for those higher frequencies.

The current ZD+ connector as defined in the ATCA specification is not rated for those high frequencies. At the moment, no such ATCA connector is defined or freely available on the market, although connector vendors are working on a solution. The main challenge for the new ATCA connector is to achieve a much more homogeneous impedance

transition between board and back-plane. One way of possibly achieving this is to decrease the size of the through holes in the backplane. This method cre-ates another advantage for backplane routing as the smaller hole sizes create a larger routing channel in between the connector pins. This leads to a more homogeneous impedance of the traces and a lower cross talk. The down side of smaller hole sizes is that the press-fit connector pins must be smaller and less robust and may have lower cohesion.

Identifying challenges in 100G backplane design By Sergej Dizel, Pentair Technical Products GmbH

Technology Focus



Figure 2 shows the simulation of insertion loss (Sdd21) of a 30 mm-long differential pair in an ATCA backplane without the connectors assembled. The difference between the current configuration with a 0.6 mm through hole and a reduced through hole size of 0.36 mm is obvious. A reduction of the distance of the press-fit pins within the differential pair from 1.5 mm to 1 mm is able to further reduce the losses of the transmission line.

The near future will show what the new ATCA connector design for 100G will be, including the footprint for mounting to the backplane. At the same time the PICMG 100G ATCA working group is striving to define the new connector in a way that allows several connector manufacturers to create the 100G ATCA backplane and board connector.

Tackling cross talkThe next important part of the backplane that must be addressed in 100G ATCA designs is the trace structures, especially their dimensioning with regards to losses and cross talk. Not every differential pair has similar properties. For example, when com-paring two differential stripline pairs each with a 100 Ohm impedance but different trace widths (and thus a different layer stackup), they will have different behavior with

Figures 1A and 1B | These graphs compare the thresholds for insertion loss (1A) and return loss (1B) at 40G and both methods of 100G.›

Figure 1A

Figure 1B


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regards to transmission line losses and cross talk (emission and immission). At 40G backplane data transfer this issue is solved, but there are new challenges with 100G that became visible when conducting the first simulations for 100G data transfer, as the impedance discon-tinuities between the connector and the differential pair need to be evaluated very carefully. This part of the transmis-sion line already plays a significant role in a 40G backplane, but at 100G it will be much more critical. The impedance discontinuities between the connector and the backplane have a significant influence on the properties of the whole transmission channel (losses and cross talk). If the discontinuities are too large, the signal fed into the transmission line is more sensitive to cross talk from adja-cent differential signal traces. When the losses and/or influence from cross talk are to great, the receiver cannot cor-rectly read the signal; with that, the bit error rate gets increased.

To achieve the desired trace structure in a bare board, new requirements for the quality of the bare board are needed (Figure 3). Bare board material, prepreg and core types, backdrilling, drilling offset, etching, and many other factors will play an enormous role in 100G back-plane design.

Spec’ing and certifying ATCA at 100GIn addition to correctly defining those parameters, the quality and the toler-ances of the bare board manufacturing process is essential to guarantee repro-ducible 100G data transfer results. Even the smallest process deviation during manufacturing will influence the signal properties, and, in the worst case, not

allow a 100G data transfer. This means it is essential to very carefully choose a PCB manufacturing partner who understands these needs and has their processes carefully controlled. A close partnership is needed to qualify those suppliers and qualify the production technology and processes.

As the PICMG 100G ATCA specification is not yet complete, only prework on qualifying a 100G ATCA backplane design can be done at the moment. Verification of a 100G backplane is not possible until the PICMG specification is defined because the param-eter limits for the backplane have not been selected yet.

The IEEE802.3bj 100G specification defines the parameter for the whole Ethernet channel, which is located between both transceiver chips. The transmission line of an ATCA backplane is just a part of the whole transmission channel; as ATCA boards are located before and after the backplane within the transmission channel. For that reason the IEEE802.3bj parameter can’t be used one-to-one for backplane validation. The IEEE802.3bj parameter limits must be separated between these three parts of the channel for both ATCA boards and the backplane. The PICMG 100G working group is currently addressing these issues, and companies like Pentair are playing an active role defining this new important standard.

Sergej Dizel is an electrical and backplane design engineer at Pentair Technical Products GmbH.

Figure 3 | An example of vias and traces in a backplane.›

-12 dB

-10 dB

-8 dB

-6 dB

-4 dB

-2 dB

0 dBzHG 52zHG 02zHG 51zHG 01zHG 5zHG 0

Insertion loss with 6mm vias, 30mm trace length Insertion loss with 3,6mm vias, 30mm trace length

Figure 2 | Comparison of insertion loss of a 30 mm differential pair with 6 mm and 3.6 mm vias.›

Technology Focus

Pentair Technical Products [email protected]

1.800.525.468


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The largest aspect of the 40G over MicroTCA (mTCA) activity is ensuring the archi-tecture will perform well at these speeds. In doing so, the committee will provide an eye mask and design parameters for third-party users to adhere to when they develop their own boards. The goal is to provide enough guidelines and rules so that the mTCA vendor’s 40G products are fully interoperable at 40 GbE speeds, and third-party developments will also have enough guidance from the specification to work effectively at the increased rates.

40G over MicroTCA will be leveraging practices used in the sister specification for PICMG 3.1 (40GbE over AdvancedTCA). Listed below are a few of the guidelines:

› Ecosystem Interoperability – Components will be tested from active mTCA developers to ensure the various connectors, backplanes, AMCs, and MicroTCA Carrier Hubs (MCHs) work together

› Confidence Level – Establish that any party testing to the guidelines provided has a reasonably high level of confidence that their solution will perform to the metrics

› Independent Development – Allow that backplanes, modules, and AMCs can be developed separately

› Minimize Cost Impact – Design options will be kept open to allow cost optimization innovation by vendors/suppliers

The Higher Speed Ethernet Fabrics for MicroTCA.0 and AMC.2 committee is working to bring 40 GbE to these specifications. The specification currently runs at up to 10 GbE levels per 10GBASE-KX and 10GBASE-KR. There are several pieces involved in this effort, and careful attention has been made to its effect on related specifications.

Upgrading MicroTCA.0 and AMC.2 to 40 GbE speed levelsBy Justin Moll,VadaTech, Inc.

› Simplicity – Keep the testing as simple as possible and limit the amount of expensive test equipment required

One of the key steps the committee took was to leverage core parts of the eco-system to create a model for the full inter-connect path. Using multiple vendors’ AMCs, MCHs, and backplanes/chassis, the Higher Speed Ethernet Fabrics for MicroTCA.0 and AMC.2 working group looked at several parameters for 10GBASE-KR compliance testing. This included the differential insertion loss, skew, differential return loss, crosstalk ratio to insertion loss, and jitter tolerance. Overall, the results were very good and provided a solid baseline for 40G signal integrity efforts.

Application Focus



As visible in Figure 1, all of the results for the insertion loss of a short channel path fell well above the fail line. As the S-parameters were based in FR4 PCB material, there is confidence that plenty of margin exists for higher speeds; in the worst case, materials with a low dielectric constant could be used.

As shown in Figure 2, the differential return loss passes as well, but comes a bit close in the low frequencies. It is not expected for there to be a problem at 40G levels, but all of the areas will have to be watched closely. Again, as base FR4 materials were the basis of analysis, there is room for recommending other materials in the specification if needed.

The 40 GbE over mTCA efforts are continuing. Once simulation models are fully instituted, characterization of 40 GbE modules and backplanes with specially made paddle/test cards will begin. This will provide confirmation of the parameters we set

during the simulation studies. The goal is to have all simulations complete in Q1 of 2015, with characterization commencing in Q2 or Q3.

Other activitiesAnother part of the Higher Speed Ether - net over MicroTCA.0 and AMC.2 speci-fication the committee is addressing are Correction Requests (CRs). These most often occur when a related specification addresses an issue and a request is made to have the adjustments incorporated in all corresponding specifications. When changes are made special care is given to not materially harm or affect the compatibility and function of related specs, but sometimes small adjustments and clarifications are required for consis-tency and accuracy.

MicroTCA and its related specifications have been very active in recent years, including the ratification of MicroTCA.2 and several notes/changes to MicroTCA.1. The task of aligning all of these specs can be time-consuming, but it is important to ensuring an effective family of speci-fications. Furthermore, there has been a wealth of activity in MicroTCA.4 led by the high-energy physics (HEP) commu-nity, and the original authors’ allowance for the use of rear transition modules (RTMs) in the MicroTCA.0 has become a key attribute of MicroTCA.4. Addressing CRs in this instance made life easier when trying to keep the specifications aligned and up to date.

The 40G over MTCA group has provided recommended resolutions for the open CRs in MicroTCA.0, and they will be sub-mitted to PICMG membership for a vote.

Join the committeesMicroTCA is gaining traction in physics, mil/aero, and many other applications. Texas Instruments has based some of

Application Feature

• Beam forming and test

• Scientific Data Acquisition & Diagnostics

• Energy Research Equipment

• Control Systems for Particle Accelerators & Colliders

The mTCA architecture is well suited for use in applications such as particle accelerator labs, smart grid, wireless infrastructure and gateway systems. Elma has the expertise and resources to help you design and build your system.

Intelligent Embedded Computing MicroTCA.4 System Platforms

OSM_PICMG_ad_mTCA_Fall.indd 1 2/27/2015 12:52:35 PM

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their new evaluation modules on the AMC form factor, and it is also common to find a new specialty AMC board vendor crop up in unexpected places. If you are an active user or developer of AMC/MicroTCA systems and are interested in joining the group, contact [email protected] or [email protected] for details.

Justin Moll is Director of Marketing for VadaTech, Inc. Justin is active in the embedded industry and is currently the Chair of the 40 GbE over MicroTCA committee within PICMG.

Figure 1 | Insertion loss testing of 10GBASE-KR4 Ethernet for use in 40G MicroTCA.0 and AMC.2 systems has yielded encouraging results.›

Figure 2 | Differential return loss testing of 10GBASE-KR4 Ethernet in 40G MicroTCA.0 and AMC.2 systems was also successful, however the smaller margin for error may at some point necessitate a base material other than FR4.

›

VadaTech, Inc. www.vadatech.com

[email protected]


www.interfaceconcept.com+33 (0)2 98 57 30 30

INTERFACE CONCEPT product range of Sin-gle Board Computers, FPGA boards, ADC/DAC FMC and Graphic boards are ideal to devise a complete VPX system for compute intensive and image processing applica-tions (radar, electronic warfare, electro optical and IR, visualization systems)

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With Ethernet speeds advancing past 40G to 100G and higher, designers of systems such as AdvancedTCA (ATCA) meticulously follow activities in the IEEE 802.3 Ethernet subcommittee for any indicators on the future of backplane-based systems. In this interview with John D’Ambrosia, IEEE P802.3bs Chair, Chairman of the Ethernet Alliance, and Dell’s Chief Ethernet Evangelist, he discusses the development and deployment of the recently released 100GBASE-KR4 and -KP4 specifications, as well as the beginnings of IEEE work on 400G Ethernet and beyond.

Ethernet – 40G to 400GInterview with John D’Ambrosia, Chairman, Ethernet Alliance; Chair, IEEE P802.3bs 400 GbE Task Force; and Chief Ethernet Evangelist, Dell

Give a little background on the 100GBASE-KR4 spec, it’s development, and finalization.

D’AMBROSIA: The 100GBASE-KR4 spec was developed as part of what was referred to as the IEEE 802.3 100 GbE Backplane and Copper Cable project. That project was being considered as the development of 40 GbE and 100 GbE was coming to a close. In that case, the 40 GbE and 100 GbE project hadn’t developed any new electrical sig-naling on a per lane basis, meaning that all of the electrical interfaces developed as part of that project were based on 10 GbE signaling.

100 GbE optics actually was developed with a 4-lambda approach based on 25 GbE per lambda. When you look at the optical specs you see 100GBASE-LR4 and 100GBASE-ER4; that was really the initial 100 GbE project. So right off the bat there was this understanding that we were going to go to 25 GbE technology just because we had looked at it from an optics perspective, which really became a systems perspective.

As I said, the electrical interfaces that were developed for the 100 GbE project, which did not include a backplane solu-tion by the way, were based on 10 lanes of 10 GbE. As an old backplane designer I can tell you that there’s no way in hell I want to have to deal with 10 lanes of

10 GbE across the backplane. So as the group was winding down on 100G develop-ment, which was really an optics focus, we realized that we needed to start introducing the next members of the 100G family. And following those discussions we had around developing the optics, we started looking at developing 4 x 25 Gbps Ethernet. That’s why it was called “Backplane and Copper Cable.”

As that project emerged, it became 100GBASE-KR4 (which is a backplane solution based on NRZ signaling), there’s 100GBASE-KP4 (which is based on PAM4 sig-naling), and then there’s 100GBASE-CR4 (which is across a twinaxial cable for 5 m based on four differential pairs of 25 Gbps Ethernet in each direction). The actual project started with a call for interest (CFI) that happened in November of 2010, and that spec was ratified in the middle of last year. That’s been finalized, so that spec is out there now.

What were some of the challenges with 100G spec development, and how do the KR4 and KP4 specs differ?

D’AMBROSIA: In hindsight, some of the FEC encoding became more involved, and the bigger point in terms of AdvancedTCA (ATCA) is you had new channel specs. This is where -KR4 and -KP4 came from.

As a kind of rule of thumb, you’re probably looking at a 25 dB to 35 dB solution at the Nyquist rate. So, if I’m running at 10 Gbps, Nyquist is roughly half of that – 5 Gbps – for NRZ signaling. That’s kind of constant, so when we jumped to 25 Gbps the channel was in the 25 dB to 35 dB range, but now at 12.5 Gbps. So as you move to higher speeds, the channel itself becomes an issue. That’s always one of the challenges you’ll face, and you can see the same kind of thing with the 10 GbE and 40 GbE specs.

NRZ signaling stands for non-return-to-zero, and it’s a form of pulse-amplitude modu-lation (PAM). So it’s your classic zeros and ones. In the case of PAM4, the way that I like to describe it is if you sit in a room and you ask people to raise their hands, those are ones; if they don’t put their hands up, those are zeros. So it’s usually very easy to tell the difference between zeros and ones. Normally it doesn’t really matter how quickly they put their hands up, but as you start moving faster and faster, you start to run into some issues. One of those is the challenges of the channel, and one of those challenges is cost.

Industry Outlook



that rule of thumb about 25 dB to 35 dB at Nyquist, but in the case of PAM4 it’s not really 25 dB to 35 dB at 12.5 Gbps, it’s really 25 dB to 35 dB 6.25 Gbps to 7 Gbps because of some overspeed. That becomes a way to deal with channels that may involve lower cost materials. That’s really the benefit here – being able to send more information over a lower cost channel is essentially the benefit of PAM4 over NRZ.

What kind of adoption are you seeing for each specification, and what type of interoperability challenges, if any, do the two types of signaling pose for backplane designers?

D’AMBROSIA: One of the things that we are seeing is a lot more work being devoted to 100GBASE-KR4, the NRZ specification. You see more products being introduced supporting 100GBASE-KR4 than 100GBASE-KP4 today. You have to realize that there’s an ecosystem out there that supports NRZ signaling. It goes from the test equipment to just the basic engineering understanding.

If you were to look at PAM4, going back on my analogy, there would be more places for people to raise their hands. So zero would be their hands down, the next level might be at their waist, the next level would be at their head, and the last level would be above their head. Pulse amplitude modulation at four levels, or PAM4. Inherently, that reduces your signal-to-noise ratio right off the bat.

In the case of NRZ, you send a symbol that represents a 0 or a 1. In the case of PAM4, you send a symbol (the baud rate), but in this case it is enabled by two bits. So when you’re at level 0 it represents something, when you’re at level 1 it represents two 2 bits, when you’re at level 2 it represents two bits, when you’re at the highest level it rep-resents two bits – also, depending on the different transitions, you get into representing what those two bits are. So you’re sending more information in a single symbol than you do with NRZ, so your baud rate is half now. I gave you

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“YOU SEE MORE PRODUCTS BEING INTRODUCED

SUPPORTING 100GBASE-KR4 THAN 100GBASE-KP4 TODAY.

YOU HAVE TO REALIZE THAT THERE’S AN ECOSYSTEM

OUT THERE THAT SUPPORTS NRZ SIGNALING. IT GOES

FROM THE TEST EQUIPMENT TO JUST THE BASIC

ENGINEERING UNDERSTANDING.”



http://www.nateurope.com

But the debate between NRZ and PAM4 has been going on for a long time, and there are more and more people inter-ested in PAM4. Going back 13 years, I helped form a group called the High Speed Backplane Initiative, and we were looking at using PAM4 for backplanes back then. At that time there were a few parties interested in it, but ultimately the industry decided to not specify PAM4 and specify NRZ for 10 GbE signaling. When it came time to do 4 x 25 GbE signaling, more companies stepped up saying that they think we should do PAM4. Now as we look to going to 400 GbE and trying to go faster, more and more people are looking at using PAM4 signaling to support 50 Gbps electrical, especially over the longer channels just because of the inherent channel challenges.

It’s an interesting question as we go for-ward because a lot of the 25 GbE NRZ that has been developed and is now out in the market provides similar circuitry to what would be needed to support

50 GbE PAM4. There are some people who are pointing to that saying it’s a good thing because we could support backwards compatibility, and as we look at having to go backwards it would be to our benefit to consider doing 50 GbE PAM4 because of the popularity of 25 GbE NRZ, as opposed to having to go to newer processes to support 50 GbE NRZ. Those arguments are already happening now as we look at sup-porting 50 Gbps electrical signaling as part of the 400 GbE project.

The IEEE hasn’t announced any intentions of taking copper backplanes further than 100 GbE. From your perspective, what are the most viable options moving forward?

D’AMBROSIA: We’re developing 400G now. The 802.3bs Ethernet Task Force has decided that it will develop electrical interfaces for chip-to-chip (by chip-to-chip I mean on a card, not across cards) and chip-to-module. We will develop 25 GbE and 50 GbE electrical interfaces – 25 GbE will leverage NRZ signaling, 50 Gbps is still a topic of debate over whether it will be NRZ or whether it will be PAM4.

The interesting thing here is that, when I said from a backplane designer’s perspec-tive that doing 10 x 10 GbE interfaces across a backplane didn’t sound appealing, for 400G it would be 16 x 25 GbE and 8 x 50 GbE. Even at 50 GbE that sounds really ugly to me, but it is pretty much recognized that 50 Gbps signaling is going to be the next development point.

The introduction of 50 Gbps though, if you look at what’s going on inside the IEEE right now, could raise some interesting questions. When you look at what’s happening with how we’re developing 25 Gbps signaling technology as part of 4 x 25 GbE for 100G, and then you look at 40G, which is leveraging 4 x 10 GbE today, what you see

Industry Outlook

BEYOND THE STANDARDATCA 3.0-3.7, mTCA, VPX & custom platforms FTB – Cooling Horizontal Blades FTB – Cooling Vertical Blades STS – Cooling Horizontal Blades

COOLINGPER SLOT

(W)

BP SPEEDGb/S

1

10

400

40

100

0

100

200

400600 700

800

900

1000

10

SLOTCOUNT

1

2

34 6

14

32

28

8

POWER INPUT

AC N+N AC N+I DCDS DDS FM

BP TOPOLOGY

www.asis-pro.com | [email protected] | Tel. (408)215.1510



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Figure 1 | The 2015 Ethernet Roadmap outlines the ongoing development of Ethernet through 2020, and and includes projections for electrical/optical speeds possibly as high as 10 Tbps.›

LCR Embedded System’s complete line of integrated rugged industrial and military systems, from off-the-shelf to fully customized, are ideal for all aspects of mission-critical computing. To learn more about what we can do for you and your application, contact us today.

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there haven’t been any votes yet taken on any of these discussions. These are really industry debates around 50 GbE and 200 GbE.

So, will we see 50 GbE and 200 GbE emerge? That is the question. I don’t have the answer for you today, but I get the logic. The role of the IEEE 802 specs is to produce high-quality, market-rele-vant standards. The IEEE 802 does not decree, “Thou shalt develop.” That’s not the way the process works. By market-relevant standards, what we’re saying is that the market decides what it wants to develop a standard for next. So the market market comes forward and says, “We want to do this.”

Editor’s Note: The Ethernet Alliance recently announced its 2015 Ethernet Roadmap at the Optical Fiber Communication Conference and Exposition (OFC 2015) in Los Angeles. The Roadmap outlines the ongoing development of Ethernet through 2020, and includes projections for electrical/optical speeds possibly as high as 10 Tbps. A portion of the roadmap is located on page 17, with the entire Roadmap available for download at in its entirety at http://bit.ly/EthernetRoadmap-EA.

Ethernet Alliance www.ethernetalliance.org

[email protected]

IEEE P802.3bs 400 Gb/s Ethernet Task Force

www.ieee802.org/3/bs [email protected]

Dell Networking Solutions www.dell.com/networking

is that you can’t get the same port density into an ASIC at 40G as you can at 25G because the basic building blocks don’t line up. In the case of 25 GbE, they do – 25 GbE I/O on the chip to 25 GbE I/O on the boxes. So you can get to the maximum density this way and the maximum throughput on the chips, which helps to optimize your switches, which helps to optimize and reduce cabling costs, power costs, and so on. So there is this inherent niceness to 1x or 4x architectures.

Now we’re getting to the question, and this is still a question, “Will we see 50 GbE and 200 GbE emerge as speeds for backplanes?”

There’s been a lot of discussion and debate, and the logic of this is very relevant. But we’re still in the early stages of developing 50 GbE electrical signaling. I can tell you as Task Force Chair that this comes up and I have to keep people within the scope of our project par. It’s not a foregone conclusion yet by any means in IEEE 802 because

Industry Outlook

“The Game-Changer”“A 40GbE MCH is here!”

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Introducing

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A star is born! VadaTech’s new UTC004 Gen 3 MCH is not just faster, it changes the equation for MicroTCA systems. The MCH has GPS timing to any programmable frequency. The unit also provides SyncE and IEEE1588 to align the frequency and get the exact time of the system – even acting as a Grand Master Clock. With ultra-clean signals and low jitter, the MCH offers 40GbE, PCIe Gen 3, SRIO Gen 2 and a Crossbar Switch so any fabric can be utilized!


“... WILL WE SEE 50 GBE

AND 200 GBE EMERGE? ...

I DON’T HAVE AN ANSWER

FOR YOU TODAY,

BUT I GET THE LOGIC.”

http://bit.ly/EthernetRoadmap-EA

http://www.ethernetalliance.org


http://www.ieee802.org/3/bs


http://www.dell.com/networking


http://www.vadatech.com



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ĄĄ Two Intel® Xeon® processors, E5-2600 v3 familyĄĄ Scalable performance range with up to 14 cores per processorĄĄ Up to 512GB main memory, DDR4, configurable for highest capacity

or cost effective memory configurationsĄĄ QuadStar™ 40G fabric interfaces enabling multiple bandwidth and

redundancy optionsĄĄ Hardware off-loading functions for en/decryption and compression

(optional)ĄĄ Virtualization support including Linux KVM and VMwareĄĄ Intel DPDK ready

The Artesyn ATCA-7480 blade uses two Intel® Xeon® E5-2600 v3 family processors (up to 28 cores per blade), optimized data paths and Artesyn’s QuadStar™ interface to deliver the highest performance pro-cessing. Optional hardware accelerators can improve the performance of security applications.

Scalable memory capacity (up to 512GB) enables faster database access, accelerated pattern matching and helps optimize routing decisions in virtualized network environments. Sixteen memory sockets means cost sensitive applications can still achieve their required capacities using cheaper modules.

Artesyn's enabling software for SDN/NFV supports Intel DPDK- accelerated OpenVSwitch, OpenFlow and OpenStack plug-ins, and Wind River's Titanium Server.

ATCA-7480

AdvancedTCA

picmg.opensystemsmedia.co/p372402

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FEATURES

ĄĄ Full-size or Mid-size, AdvancedMC™ processor moduleĄĄ 4th generation Intel® Core™ processorĄĄ Up to 16 Gbytes of DDR3L-1600 DRAM with ECCĄĄ Up to two x4 Serial RapidIO fabric portsĄĄ AMC.2 Type E2 (2 x Gigabit Ethernet ports)ĄĄ 2 x 10GBase-T interfaces via front panelĄĄ Up to 3 x external USB 2.0 portsĄĄ Support for onboard SATA Flash Disk ModuleĄĄ Up to 4 x Serial ATA interfaces on rear I/O

The AM C1x/msd is a high performance Single Module, Full-size or Mid-size, AdvancedMC™ processor module supporting a 4th genera-tion Intel® Core™ processor (2-core or 4-core) with up to 16 Gbytes of DDR3L-1600 ECC DRAM. The AM C1x/msd is designed in compliance to AMC.0, AMC.4 Type 5 and Type 10 (single or dual x4 Serial RapidIO®), AMC.2 Type E2 (2 x Gigabit Ethernet) and AMC.3 Type S2 (2 x SATA ports). The module also features USB 2.0, RS232, SATA, a x2 PCIe Gen 2 port and introduces two 10 Gigabit Ethernet interfaces on the front panel. Supporting full hot swap and IPMI capabilities with a range of industry standard operating systems, the AM C1x/msd is designed for use in AdvancedTCA® or MicroTCA™ applications in the telecommunications, scientific, and industrial markets. Application examples include high performance embedded clusters and wireless test controllers.

AM C1x/msd

AdvancedMC

picmg.opensystemsmedia.com/p372303

Concurrent Technologieswww.cct.co.uk/sheets/AM/amc1xmsd.htm

[email protected] +44 (0)1206 752626 or +1 781-933-5900

PICMG System

s & Technology Resource Guide




mailto:[email protected]%EF%82%98

http://www.cct.co.uk/sheets/AM/amc1xmsd.htm

http://www.artesyn.com/computing

https://www.linkedin.com/company/artesyn

https://twitter.com/artesynembedded

http://picmg.opensystemsmedia.com/p372303


FEATURES

ĄĄ Netarium-14 • 14-Slot, 14U fully integrated AdvancedTCA system • 12 Dual Intel® Xeon® blades + 2 hub blades (dual star) or

10 Dual Intel® Xeon® blades + 4 hub blades (dual-dual star) • 40GbE/100GbE Switches • AC or DC power; 300W+ per slot • Advanced Shelf Management with Intel® Atom™ C2000 • OVS with DPDK offload; QuickAssist ready

ĄĄ MIC-5342 Telecom Blade • Two Intel® Xeon® E5-2600 v3 Processors and Intel® DH8955 • Up to 256GB ECC Memory • Up to 4x 40GBaseKR4 on FI (dual-dual star); 2x 1000BASE-T ports on BI

ĄĄ MIC-5345 Server Blade • Optimized for virtualized environments • Two Intel® Xeon® E5-2600 v3 Processors with Intel® C610 • Up to 256GB ECC memory • Up to 2x 40GBaseKR4 ports on FI ( dual star); 2x 1000BASE-T ports on BI • Single CPU version adds two 2.5" SSDs and two MO-297 SSDs (or two

2.5" SSDs and two CFast Cards)

ĄĄ DSP-8901 DSP Blade • 20 Texas Instruments C6678 DSPs • 512MB/1GB DDR3 memory per DSP • BCM56321 10GbE switch for both FI and BI • Freescale QorIQ™ P2020 for Local Management Processor (LMP) • IDT Tsi577 Serial RapidIO switches

ĄĄ ATCA-7310 Network Processor Blade • Dual Cavium Octeon II CN6880 1.0 GHz • Up to 64GB DDR3 1066 MHz DIMMs; 32GB per NPU • 40 GbE (KR4) & 4x 10 GbE (KR) FI with Dual Star support • 8x 10GbE SFP+ and 4x 1GbE SFP to Rear I/O

ĄĄ ATCA-9223 100GbE Hub Blade • 100GbE switch blade provides switching between two 100GbE uplinks,

up to eighteen 10GbE uplinks and twelve 40GbE node slots • Fabric interface bandwidth up to 960Gpbs • Broadcom BCM56150 base fabric switch with 70Gbps switching capacity • Intel® Atom Processor C2000 for flexible control plane processing • Two Virtex 7-690 • FPGAs connect 2x 100G and 8x 10G for inline processing • Switch management

Advantech’s ATCA solutions are more than just hardware designs as we go much further than an ordinary ODM. We ensure that our systems not only have outstanding stability secured by a world-class design quality assurance process, but are enhanced by building in features which improve availability, serviceability and usability. Features which have a moderate impact on cost as they have been carefully designed by Advantech’s in-house engineering teams and are kept consistent across the product line.BladesThe cornerstones of our ATCA product line are the blades designed in our own labs and manufactured on our own production lines. We manage the entire lifecycle and control all our costs to give customers the best service at the right price. Our x86, NPU, DSP and switch blades are designed in unison with the leading silicon suppliers to give you early access to the very latest tech-nology to accelerate your next generation product design and give you first-mover advantage.SystemsAdvantech’s Netarium™ series of ATCA systems are specifically targeted to help network equipment providers reach superior levels of performance over traditional rackmount servers or appliances and extend their product range at the high end. The series represents a new generation of systems which offer superior performance, scalability and flexibility with the latest 40/100GbE switches and application blades. We optimize the systems to achieve the highest possible density at the rack level, with a maximum number of payload blades, network ports and switching capacity.eATCA – For More High-End Real-EstateThe new Extended ATCA (eATCA) system architecture from Advantech responds to next generation networking needs for more high performance I/O connectivity and increased flexibility to add application-specific optimization hardware in high-end systems.eATCA is a system architecture based on ATCA that delivers increased I/O and packet processing performance for networking platforms facilitating border-less enterprise, secure datacenter, and cloud computing applications. eATCA systems integrate standard ATCA blades with extended Rear Transition Mod-ules (eRTMs), providing almost four times more real estate for PCIe-based I/O connectivity and enabling new capacity for acceleration and offload.eATCA & ATCA Platform Management ... Appliance StyleThe SMM-5060, at the core of our ATCA platform management approach makes ATCA look like a big appliance and is able to support a consistent management view across our customers’ full product line. This means OEMs utilizing appliances for their entry and mid-range networking gear will find it surprisingly easy to add an ATCA based system as an extension of their product line at the high end.Advantech’s SMM-5060 ATCA Shelf Manager features an Intel® Atom™ pro-cessor C2000 which brings added value system control and service process-ing to ATCA and eATCA systems, and can be used as a centralized service access point or blade boot server. The SoC’s features enable encryption and decryption of external management traffic in business and mission critical systems. The SMM-5060 has been designed to maximize management flex-ibility in multi-blade systems.

Netarium ATCA Series

Advantech Co Ltdwww2.advantech.com.tw/nc/newsletter/NCG/ATCA/

[email protected] twitter.com/AdvantechNCG

AdvancedTCA


PICM

G Sy

stem

s &

Tec

hnol

ogy

Res

ourc

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ide



mailto:[email protected]%EF%8C%89

http://www2.advantech.com.tw/nc/newsletter/NCG/ATCA/

https://twitter.com/advantechncg


FEATURES

ĄĄ <<Feature 1>>ĄĄ <<Feature 2>>ĄĄ <<Feature 3>>ĄĄ <<Feature 4>>ĄĄ <<Feature 5>>ĄĄ <<Feature 6>>

<<Description>>

<<Title>>

<<Category>>

<<magazine_url>>/<<product_id_number>>

Company name<<website_url>>

<<contact email>> <<phone>> <<linkedin>> @<<twitter_name>>

FEATURES

ĄĄ <<Feature 1>>ĄĄ <<Feature 2>>ĄĄ <<Feature 3>>ĄĄ <<Feature 4>>ĄĄ <<Feature 5>>ĄĄ <<Feature 6>>

<<Description>>

<<Title>>

<<Category>>

<<magazine_url>>/<<product_id_number>>

Company name<<website_url>>

<<contact email>> <<phone>> <<linkedin>> @<<twitter_name>>

FEATURES

ĄĄ Application virtualization software framework based on industry standard SDN & NFV software stacks

ĄĄ Optimized performance utilizing the Intel® Accelerated DPDK

ĄĄ Widely deployed and multi-vendor bladed hardware architecture for scalability and maintainability

ĄĄ Carrier grade platform with NEBS certification services available

ĄĄ Up to 12 dual-processor server blades based on Intel® Xeon® E5-2600 V3

Artesyn's Centellis® Virtualization Platform (Centellis VP) is an applica-tion virtualization hardware/software platform architected for next gen-eration networks based on OpenFlow for SDN and OpenStack for NFV and a multi-vendor ecosystem of Virtual Network Functions (VNFs). The platform enables service providers to run multiple virtualized applications such as firewall, DPI, security, or session border controller on a single hardware platform saving both capital expense and operating expense by eliminating the need for multiple application-specific hardware platforms.

Implementation of the Intel® Accelerated DPDK ensures performance is optimized for the hardware and virtualized environment. Open ATCA hardware architecture ensures a multi-vendor payload ecosystem com-bined with the scalability and maintainability of a bladed architecture. Load-balanced switching provides additional efficiencies to virtual appli-cation deployment. Artesyn's Centellis VP is based on open hardware and software architectures and is carrier-grade and NEBS certifiable.

Centellis VP

AdvancedTCA




FEATURES

ĄĄ High performance Intel® Xeon® server combined with up to 40 power-efficient DSPs for accelerated media processingĄĄ Single slot AdvancedTCA form factor media processing engineĄĄ Similar architecture to server-based element eases porting and

maintenanceĄĄ Comprehensive voice and video processing firmware and programmers

interface includedĄĄ Hardware and software platform to support VoLTE and Media Resource

FunctionĄĄ Designed for NEBS Level 3 and ETSI telecom standards compliance

Combining a powerful Intel® Xeon® processor with up to 40 Octasic OCT2224M multi-core DSPs, the Artesyn ATCA-8330 blade is the industry’s highest density media processing blade. This enables network equipment providers to implement complete solutions such as session border controllers, VoLTE, video optimization or video conferencing with less blades and therefore less cost.

An innovative modular design, using DSPs mounted on DIMM-type modules, allows the blade to scale four DSPs at a time up to 40 DSPs, to meet application requirements. The blade can be configured as either a ‘gateway-on-a-blade’ or as a resource blade in a larger system.

The Artesyn ATCA-8330 includes award-winning software that makes it easier for developers to create and use arrays of media processing resources in highly complex voice- and video-enabled applications.

ATCA-8330

AdvancedTCA




PICMG System














FEATURES

ĄĄ High-Power – cooling power of up to 550 watts per slot.ĄĄ Field scalability – unique field-replaceable fan-tray configurations,

offers the ability to seamlessly scale from 450W/slot to a high-power configuration of up to 550W/slot.ĄĄ Field-replaceable AC/DC – integrated AC support can be easily added

in the field, providing outstanding flexibility and time-to-market.ĄĄ Outstanding resiliency – unique external fan tray controllers

eliminate fan tray failures.ĄĄ Power-efficient – 7 slots are cooled by only 6 fans while reaching up

to 550W per slot.ĄĄ Intera™ integrated switch slot – frees up to two additional payload

slots, for significantly greater processing power.

The Genesis 40G ATCA series is a high-powered, yet cost-effective ATCA chassis. With side-to-side cooling of up to 550W per slot, using only 6 fans to cool up to 7 blades, Genesis redefines power and cost efficiency. Its unique field-replaceable fan-tray configurations, offers the ability to seamlessly scale from 450W/slot to a high-power configuration of up to 550W/slot, allowing customers to future-proof their investments.

• Form factor – 5U; 7 slots; 19"

• Slot configurations – 7 payload blades (no switches); 2 switches + 6 payload blades (Intera™); 2 switches + 5 payload blades

• Power & cooling – 450W/slot (standard); 550W/slot (high-power)

• Field-replaceable AC/DC

Genesis700 AC/DC 7 Slots 40G/100G ATCA

AdvancedTCA


Asis Ltd.www.asis-pro.com

[email protected] 408-215-1510

FEATURES

ĄĄ High bandwidth traffic flow separator and load balancer ĄĄ Balance traffic to multiple AdvancedTCA® blades for packet

monitoring and processing ĄĄ Maintain flow context and packet sequence ĄĄ Fully transparent for external network elements ĄĄ Separate traffic into application groups ĄĄ Redundant 160G external Ethernet connectivity ĄĄ 480Gbit/s internal bandwidth for packet processing

Artesyn’s range of add-on software can save time-to-market and enable you to focus your resources on value added development for competitive advantage:

System Services Framework (SSF) provides ATCA system management and a framework for out-of-the-box system management functions and can yield up to 40% reduction in time-to-market for network elements.

ViewCheck™ is online in-service and out-of-service diagnostics & fault detection software.

FlowPilot™ provides high bandwidth traffic flow separation and load balancing to enhance packet flow efficiency without a separate appliance.

SRstackware™ supports a wide range of Layer 2 and Layer 3 standards and protocols, simplifying integration with customer applications.

ATCA System Software

AdvancedTCA


Artesyn Embedded Technologieswww.artesyn.com/computing/products/category/atca/atca-system-software

[email protected] +1 (888) 412-7832 linkedin.com/company/artesyn> twitter.com/artesynembedded

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FEATURES

ĄĄ 515W per slot engineered CoolingĄĄ Options for 675W per slot CoolingĄĄ Ultra high performance Air-/-Plane™ backplane supporting

40 Gbps and now 100 Gbps!

ĄĄ Dual Star, Dual-Dual Star, Full Mesh topologiesĄĄ 19", 14U Rackmount chassisĄĄ Accommodates 14, ATCA boards and RTMsĄĄ Redundant Pigeon Point Based Shelf ManagerĄĄ 4 redundant Power Entry Modules (A1+ A2 and B1 + B2) to

accommodate up to 800W per slotĄĄ Pull cooling with 4 hot-swappable redundant fan trays with

excellent airflow distributionĄĄ The new cooling system pumps 1250cfm of air through the

chassisĄĄ High Reliability Bussed or Radial IPMBĄĄ EMI containment for front and rear card cage

ĄĄ Compliancy: • RoHS • Designed to meet NEBS • UL/cUL/CE pending

The new flagship 14-slot chassis is Comtel’s “4th Generation” and the latest in high performance platforms for ATCA!

Appropriately named, CO14-G4, this Chassis is a 14U height 14 slot AdvancedTCA® chassis supports full mesh, dual star and dual-dual star topologies backplanes it is DC powered and has front-to-back cooling!

About COMTEL Electronics

Comtel has acquired a leadership position in the business of electrical interconnection components and systems. The activities of the com-pany include high-speed electrical simulation, design, prototypes and mass production for Backplanes and system solutions.

Since 1993, Comtel Electronics GmbH has been offering Backplanes and integrated systems based on a wide range of VME, VME64x, VXI, VXS, VPX, Gigabit VME64x, PXI, CompactPCI, AdvancedTCA, uTCA and custom proprietary solutions.

Comtel has expertise in a wide range of engineering disciplines includ-ing concept design, board assembly and testing, mechanical design and production, wiring and functional test, system engineering and software design.

Comtel products are implemented in solutions for telecommunica-tions, test and measurement, instrumentation, medical, military and other applications.

Comtel is a privately owned company with its headquarters in Munich, Germany. The Comtel Group incorporates production facilities in Germany, Israel and China. Furthermore the enterprise offers sales support worldwide.

Comtel is an active member of PICMG consortium, contribut-ing in development of advanced telecommunication standards as AdvancedTCA and MicroTCA.

CO14-G4

COMTEL Electronicswww.comtel-online.com

[email protected] +1-619-573-9770

AdvancedTCA


PICMG System





http://www.comtel-online.com


Need systems, subracks, cases or front panels quickly for proto- typing or small projects? Express service provides rapid delivery turn-arounds for solutions engineered to meet your design requirements – in a matter of days.Systems Express• ATCA, MicroTCA, CompactPCI, and CompactPCI Serial models available• Shipped in as few as 15 days

Subrack & Cases Express• EuropacPRO subrack kits, parts and accessories• RatiopacPRO case kits, parts and accessories• Delivered in as few as 15 days

Front Panel Express• 5 to 50 front panels • Custom cut-outs, handles and silk screen• Delivered in as few as 5 days

Express Programs: When product is needed fast

AdvancedTCA


PentairProtect.com [email protected] 1-800-525-4682

FEATURES

ĄĄ Conform to PICMG specificationsĄĄ ATCA, uTCA, CompactPCI standardsĄĄ Standard and customized solutions availableĄĄ Local and global design and product supportĄĄ Drawings and models availableĄĄ Part and quantity restrictions may apply

FEATURES

PXS1340 13U ATCA ShelfĄĄ 40GBASE-KR4 Dual-Star or Full-Mesh 14-Slot BackplaneĄĄ Front-to-Rear airflow supporting over 270W/Slot cooling performance

(@ 55°C)ĄĄ Full redundancy with dual ShMCs, quad CUs, dual Hubs and dual PEMsĄĄ 15,000+ installed base worldwide

PXS0640 SlotSaver 6U ATCA ShelfĄĄ 40GBASE-KR4 Dual-Star, Full-Mesh or Replicated Mesh 6-Slot

BackplaneĄĄ Integration of Hubs with ShMCs adds 2 node slotsĄĄ AC and DC power options

PXS0309 3U ATCA Hybrid Chassis with 8 AMCsĄĄ 19" rack mount 3U ATCA Hybrid AMC ChassisĄĄ 1 ATCA slot and 8 mid-size AMC slots

Pixus Technologies’ ATCA® shelves and backplanes support a wide range of applications in telecom, LTE, enterprise, military/aerospace, and HPC environments. All shelves are designed to meet NEBS.AdvancedTCA® shelves from Pixus are equipped with the hot-swap high-performance RiCool III fans. These fans offer added output coupled with a reduced noise level. Pixus 40GBASE-40KR4 backplanes are monolithic with a high level of signal integrity in dual star, full mesh, or replicated mesh.Pixus provides 3U, 5U, 6U, 8U, and 13U ATCA shelves with AC and DC power options. Full redundancy is provided with dual shelf managers, dual or quad cooling units, dual Hubs, and dual power modules.ATCA systems from Pixus leverage over 20 years of superior cooling, back-plane, and packaging innovation with proven Pixus and Rittal technologies. ATCA Shelves and backplanes can be modified to meet customer require-ments without NRE.

ATCA® Shelves and Backplanes

AdvancedTCA


Pixus Technologieswww.pixustechnologies.com


Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components

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450/40 and 300/40 ATCA chassis are designed to support the next generation of ATCA board requirements, minimizing the time to market for critical, high-availability applications where high perfor-mance is crucial. With superior physical construction, optimal cooling, reliable power supplies, efficient data distribution and secure system management, Pentair’s Schroff ATCA solutions are your choice for a dependable solution.The 450/40 series ATCA systems offer generous head room for power and cooling capabilities. Both product families feature Pentair’s leading edge 40 Gbps backplane design, shelf management and proven hardware quality. Deploying these chassis – ensure your integrated solutions will continue to perform at the highest level as network requirements grow and higher performing ATCA boards become available.

450/40 and 300/40 Series ATCA Systems

AdvancedTCA


PentairProtect.com [email protected] 1-800-525-4682

FEATURES

ĄĄ 2, 6 and 14 slot backplanesĄĄ 40 Gbps (10GBASE-KR) transmission rateĄĄ Up to 450 watts/slot coolingĄĄ AC & DC power entry modulesĄĄ Various cooling configurations availableĄĄ Designed to meet NEBS, PICMG 3.0ĄĄ Proven performance, test reports available

FEATURES

ĄĄ COM Express Mezzanine standardĄĄ Custom carrier card to suit the applicationĄĄ Camera Link, CoaXPress and 3G-SDIĄĄ USB3, HDMI, GigE, eSATAĄĄ PCIe expansion capabilityĄĄ Stable product supplyĄĄ Rugged and highly reliableĄĄ Extended temperature environment supportedĄĄ Ideal for long life products

Active Silicon’s COM Express embedded vision solutions are driven by a customer request for a long product life embedded PC. Active Silicon can help specify, design and manufacture an embedded system that will remain fit, form and function identical for many years. We can integrate any type of video acquisition along with all the standard interfaces such as USB3, HDMI, GigE, eSATA etc. plus expansion options using PCI Express.The COM Express architecture is ideally suited to rugged applications and is designed with reliability and long product life in mind. The mezzanine standard allows a wide variety of third party processor modules to be fitted to the custom carrier card and the processor module can be replaced, while keeping key function-ality identical. Supported operating systems include Windows Embedded, Linux, and also QNX.Areas where COM Express products are widely used include markets with regu-latory control and the requirement for high reliability as is the case for complex medical machines for X-ray, CT, and cancer treatment or machine vision in indus-tries like pharmaceutical packaging, quality control and food processing. Custom embedded systems are also commonly found in extremely rugged military appli-cations including UAV and in traffic markets such as speed cameras and vehicle identification.

COM Express Vision PC

COM Express


Active Siliconwww.activesilicon.com

[email protected] +44 (0) 1753 650 600 https://uk.linkedin.com/company/active-silicon twitter.com/activesilicon

PICMG System






https://uk.linkedin.com/company/active-silicon

http://www.Pentairprotect.com

http://www.activesilicon.com

https://twitter.com/activesilicon



FEATURES

ĄĄ Customizable Payload 2 mini-PCIe expansion slots, Space for 2 additional add-in cards 6.9" x 6.9" 7" x 6.83"

ĄĄ Power 9-36VDC Input, Optional dual Mil-2590 BatteriesĄĄ Physical

4.6"(H) x 9.5" (W) x 12.25" (L) Weight: <20 lbs Watertight to IP67 Operational: -40C to 70C Shock: 30g/11ms per Mil-810F Method 516.5

The LSF-02 is a rugged environmentally sealed tactical computing and communications platform, ideal for vehicle and man-pack applications. The LSF-02 was designed to be easily customizable. The COM-Express based architecture provides flexibility to meet different performance and power envelopes. Support for 2 Mini-PCIe slots provides options for Mil-Std-1553, ARINC 429/575/717, CAN bus, WiFi or Cellular modems. The platform also has room for 2 additional add in cards. Two optional Mil-Std 2590 batteries allows the platform to be unmounted and be used in man-pack applications.

• Computing: 4th Generation Intel Core i7-4700E 2.4GHz, QM87 Express Chipset,

2 x 8GB DDR3L-1600 SO-DIMM dual channel

• Storage: Removable 2.5" SSD, Optional mSATA

• I/O: 2 GbE, 4 USB 2.0, VGA Display port, RS-232 or RS-422/485 (no handshaking signal)

LSF-02

COM Express


LCR Embedded Systemswww.lcrembeddedsystems.com

[email protected] 1-800-747-5972

FEATURES

ĄĄ 5th generation Intel® Core™ i7/i5/i3 and Celeron™ processor System-on-ChipĄĄ Up to 16 GB dual channel DDR3L at 1600/1333 MHzĄĄ Two DDI channels, one LVDS supporting 3 independent displaysĄĄ Dual channel 18/24-bit LVDS (or optional eDP)ĄĄ Four PCIe x1 or 1 PCIe x4, Gigabit EthernetĄĄ Four SATA 6 Gb/s, two USB 3.0, six USB 2.0ĄĄ Supports Smart Embedded Management Agent (SEMA) functionsĄĄ Extreme Rugged™ operating temperature: -40 °C to +85 °C (optional)

The ADLINK cExpress-BL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applica-tions. The cExpress-BL features a 5th Generation Intel® Core™ i7/i5/i3 processor and is suitable for fanless, edge device solutions that demand intense graphics performance and multi-tasking capabilities in a space- constrained environment, such as digital signage for medical, transport and retail, or machine vision applications in factory automation.

ADLINK's cExpress-BL is also equipped with our Smart Embedded Management Agent (SEMA) to allow access to detailed system activities at the device level, including temperature, voltage and power consump-tion. Information can be analyzed using our SEMA Cloud portal, which also provides users the ability to set alerts and connect and configure one-to-many remote devices.

cExpress-BL COM Express® Type 6 Compact Module

Com Express


ADLINKwww.adlinktech.com/PD/web/PD_detail.php?cKind=&pid=1495


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http://www.lcrembeddedsystems.com



Below are some of the latest products from Advantech’s CompactPCI portfolio:

3U CompactPCI and PlusIO ProductsĄĄ MIC-3022/3023 –

• 4U/3U CompactPCI® Enclosures for 3U BladesĄĄ MIC-3328 –

• 3U CompactPCI PlusIO Intel® Core™ i7 Processor BladeĄĄ MIC-3325/3326 –

• Intel® Atom™ N455/D525 Low Power Processor BladeĄĄ MIC-3954 –

• 3U CompactPCI PlusIO Serial Peripheral CarrierĄĄ MIC-3955 –

• 4-port RS-232/422/485 Communication CardĄĄ MIC-3756/3758 –

• 64-ch/128-ch Digital I/O Cards 6U CompactPCI ProductsĄĄ MIC-3042/3043 –

• 4U CompactPCI® Enclosures for 6U BladesĄĄ MIC-3398 –

• 6U SBC with Intel® Atom™ E3845/Celeron® J1900ĄĄ MIC-3397 –

• 6U SBC with Intel® Xeon® E3/Pentium® ProcessorĄĄ MIC-3396 –

• 6U SBC with 4th generation Intel® Core™ processorĄĄ MIC-3395 MIL –

• Intel® Core™ i7 Rugged Processor Blade with ECCĄĄ CPCI-8220 –

• Freescale QorIQ P2040 Dual PMC Processor Board

Since its inception back in the mid 1990's CompactPCI has worked its way into some of the most mission critical applications on this planet. It can be found at the nerve-centre of the world's most hi-tech trains, at the core of the telecommunication network, switching calls and providing critical signalling information in essential core network elements.

In both its commercial and ruggedized form, CompactPCI controls industrial and chemical plants, while in the military arena it is employed for battle coor-dination managing vital communications and command functionality. Many top tier equipment providers have been deploying Advantech CompactPCI platforms within systems like these; systems upon which the world’s net-working infrastructure still relies, and upon which chemical plants and power stations depend for the safe and secure continuation of their processes. Advantech has been a key player in CompactPCI development for well over a decade now, assisting rugged and industrial OEMs as well as telecom equip-ment manufacturers to design and integrate CompactPCI in their business and mission critical systems. We understand the impact which the discon-tinuation of a component can have on a customer’s product portfolio and we have solid lifecycle management processes in place to handle it. We’ve also learnt how to step in when a key supplier announces the end of a product line and a second source blade is urgently needed which meets the same form, fit and function.

Customized COTS –Just What You Need When You Have a Unique Problem to SolveCustomization at Advantech doesn’t just stop at branding. We realise that no two suppliers’ seemingly identical CompactPCI blades are exactly the same and that features may differ in various ways like a missing I/O port or connec-tor or often custom IPMI features which aren’t implemented. That’s where our Customized COTS (C2OTS) program comes into play. Because we design our standard products with later customization in mind our processes are tailored to support the customized COTS business model. We offer significant flexibil-ity over a “standard-product-only” roadmap by supporting changes ranging from branding, cost optimization, mechanical and schematic changes as well as the integration of a customer’s proprietary IP. We believe that this modus operandi is critical to the long term success of CompactPCI and have adapted our development and manufacturing strategies to encourage customization innovation, delivering complex CompactPCI products uniquely tailored to meet customer’s needs without sacrificing the economy of scale offered by standard off the shelf products.

Your OEM BladeThere’s almost always a special feature that your customer needs you to integrate to meet a specific requirement. Its been that way since CompactPCI started and spans back even further to the early days of VMEbus. Mezzanine card technology has evolved in various form factors and with different inter-connects help address the problems caused by over-customization. But when the rubber meets the road and you can’t find that feature on COTS products, you need a partner who is ready to go the extra mile and is geared to help-ing you re-engineer a product to meet your needs. Advantech’s CompactPCI customization team is here to identify and scope your special requests.

CompactPCI Solutions

Advantech Co Ltdwww.advantech.com/compactpci

[email protected] twitter.com/AdvantechNCG

CompactPCI


PICMG System





https://twitter.com/advantechncg

http://www.advantech.com/compactpci


FEATURES

ĄĄ InterRail® products meet tough physical demands and vibration proofs used for railway engineering, traffic engineering, and power station engineering.

ĄĄ 19" subracks and housings with flexible internal layout.

ĄĄ EMI- and RFI-shielded protection using stable stainless steel contact springs ensuring permanent and reliable bonding.

ĄĄ Connectors and wiring accessories.

ĄĄ Customization available.

Intermas develops electronic enclosure systems:Cabinets, housings, subracks, and an extensive range of accessories for the 19" rack systems used in the fields of PCI, VME/VME64x, cPCI, IEEE, and communication applications with state-of-the-art EMI- and RFI-shielded protection.

Intermas has an extensive product range of more than 10,000 separate components and more than 30 years’ experience.

Go towww.Intermas-US.com

for our new catalog.

Intermas – InterRail

CompactPCI


Intermas US LLCwww.Intermas-US.com


EKF offers a wide range of the latest CompactPI Serial shelf boards

and systems, as well as custom solution services.

Founded in 1972, EKF Elektronik has a long history in the embed-ded computing business. With a background of more than 30 years in modular eurocard system design, EKF is a leading vendor of CompactPCI technology, and offers continued lifecycle support for a wide range of ”classic“ CompactPCI products, in addition to the latest CPU boards, peripheral cards, and systems defined under the PICMG CompactPCI Plus I/O and CompactPCI Serial standards. EKF offers boards and systems for standard and extended temperature ranges, as well as sealing and coating on request. PMC and XMC mezzanine modules expand the product portfolio. The EKF lifetime policy guarantees long-term availability for all EKF products, while a three-year standard warranty protects your investment.

CompactPCI Serial Shelf Boards and Systems

CompactPCI


EKF Elektronikwww.ekf.com

[email protected] 0049-2381-6890-0

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http://www.intermas-us.com

http://intermas-us.com



I/O Interface with optional ARM1 ProcessorConfigure to CustomizeThe NIU1A is a small, rugged, low-power system. It consists of an integrated power supply, one function slot that can be configured with a field-proven NAI intelligent I/O and communications function module and an optional ARM Cortex-A9 processor. Ideally suited for rugged Mil-Aero applications, the NIU1A delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.Architected for VersatilityNAI’s Custom-On-Standard Architecture™ (COSA™) offers a choice of over 40 intelligent I/O and communications options. Pre-existing, fully-tested functions can be selected to quickly and easily meet system requirements. Individually dedicated I/O and communications processors allow mission computers to manage, monitor and control via single or dual Ethernet.All products are designed to operate under extreme temperature, shock, vibration and EMI environments. EMI filters and gaskets meet or exceed MIL-STD-461F and MIL-STD-810G requirements.

NIU1A – Embedded I/O System – Nano Interface Unit

CompactPCI


North Atlantic Industries, Inc.www.naii.com

www.naii.com 631-567-1100

Made in the USACertified Small Business

FEATURES

ĄĄ Supports 1 Intelligent I/O function moduleĄĄ 2x 10/100/1000 Base-T EthernetĄĄ 1.5"H x 1.7"D x 6.8"L @ 16 oz. (454 g) with 3 mounting optionsĄĄ 128 MB DDR3 SDRAMĄĄ Optional ARM Cortex™-A9 Dual Core 800MHz ProcessorĄĄ 4 GB SATA II NAND Flash (up to 32 GB option)ĄĄ < 15 W power dissipationĄĄ Wind River® Linux, VxWorks®, Altera Linux OS SupportĄĄ 1x RS232ĄĄ Continuous Background BITĄĄ Operating temp: -40°C to +71°C

conduction cooledĄĄ 28 VDC input

FEATURES

ĄĄ Managed 3U rugged Gigabit Ethernet switchĄĄ CompactPCI Serial designĄĄ 29 Gbit/s carrier grade switch matrixĄĄ Up to 25 Gigabit Ethernet ports; all on rear I/O or 3 on front and

22 on rearĄĄ Wide -40°C to +85°C operating temperatureĄĄ EN 50155 compliant; rugged construction for reliable operation

in harsh environments

MEN Micro Inc. recently released the new G101, a managed 3U flex-ible multiport Gigabit Ethernet switch, with a 29 GBit/s switch matrix, implemented as a CompactPCI Serial board. Specifically designed for rugged mobile communication in harsh envi-ronments, the new Ethernet switch conforms to the EN 50155 railway standard. The high bandwidth of the 29 GBit Switch matrix, robust design and wide operating temperature of -40°C to +85°C make MEN Micro’s new G101 ideally suited for railway applications. The G101 features a total of up to 25 Gigabit Ethernet ports. They can all be connected to the rear or three can be used on the front, either as three robust M12 connectors or as two RJ45 connectors with a 2.5 Gb SFP interface. This interface can be used as a high speed uplink via fiber technology.The 29 GBit switch matrix incorporates different software protocols to ensure high speed and high efficiency and the large software pool enables various protocols like security, synchronous Ethernet and stability as well as for temperature needs. The G101 supports IEEE1588v2 on ports 1 to 12 and EEE (Energy Efficient Ethernet) as a standard on all ports.

G101, 3U flexible multiport Gigabit Ethernet switch

CompactPCI


MEN Micro Inc.www.menmicro.com

[email protected] facebook.com/MENMicro www.linkedin.com/company/men-micro-inc- twitter.com/MENMicro

PICMG System




http://www.naii.com


http://www.linkedin.com/company/men-micro-inc-

https://twitter.com/menmicro

http://www.menmicro.com

http://www.naii.com

https://www.facebook.com/MENMicro



FEATURES

ĄĄ Made in the USA

ĄĄ Most rack accessories ship from stock

ĄĄ Modified ‘standards’ and customization are our specialty

ĄĄ Card sizes from 3U x 160mm to 9U x 400mm

ĄĄ System monitoring option (CMM)

ĄĄ AC or DC power input

ĄĄ Power options up to 1,200 watts

VME and VME64x, CompactPCI, or PXI chassis are available in many configurations from 1U to 12U, 2 to 21 slots, with many power options up to 1,200 watts. Dual hot-swap is available in AC or DC versions. We have in-house design, manufacturing capabilities, and in-process controls. All Vector chassis and backplanes are manufactured in the USA and are available with custom modifications and the shortest lead times in the industry.

Series 2370 chassis offer the lowest profile per slot. Cards are inserted horizontally from the front, and 80mm rear I/O backplane slot configuration is also available. Chassis are available from 1U, 2 slots up to 7U, 12 slots for VME, CompactPCI, or PXI. All chassis are IEEE 1101.10/11 compliant with hot-swap, plug-in AC or DC power options.

Our Series 400 enclosures feature side-filtered air intake and rear exhaust for up to 21 vertical cards. Options include hot-swap, plug-in AC or DC power, and system voltage/temperature monitor. Embedded power supplies are available up to 1,200 watts.

Series 790 is MIL-STD-461D/E compliant and certified, economi-cal, and lighter weight than most enclosures available today. It is available in 3U, 4U, and 5U models up to 7 horizontal slots.

All Vector chassis are available for custom modification in the shortest time frame. Many factory paint colors are available and can be specified with Federal Standard or RAL numbers.

For more detailed product information,

please visit www.vectorelect.com

or call

1-800-423-5659 and discuss your application

with a Vector representative.

cPCI, PXI, VME, Custom Packaging Solutions

Vector Electronics & Technology, Inc.www.vectorelect.com


CompactPCI


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FEATURES

ĄĄ Push-to-close handles actuate microswitches, while spring-loaded secondary catches lock boards in positionĄĄ Narrow handle design takes minimal space, yet provides ample

ergonomic grip for easy board removalĄĄ Handles fit faceplates from 0.8 mm to 2.5 mm thick and

accommodate lever-, plunger-, or custom-microswitchesĄĄ Captive screws are available in multiple styles for easy manual

tightening, including color-coated knobsĄĄ Alignment/grounding pins in multiple lengths feature smooth bullet

nose design for easy alignment/insertionĄĄ Alignment and keying modules in multiple pin/receptacle

configurations are economical and extremely durable

Southco AdvancedTCA access and alignment hardware provides the total solution of all faceplate hardware needed for complete PICMG 3.0 compliance.

These ergonomic Southco handles secure AdvancedTCA faceplates. The handles also ensure proper interface with microswitches to signal a graceful power-down sequence during hot-swap operation. All Southco AdvancedTCA compliant hardware can be tailored to user-specified configurations.

Optional custom-color powder-coated handles are available to enhance aesthetics or color-code components.

All of these Southco solutions provide finishes that are RoHS-compliant and other attributes gained from years of Southco access hardware experience – such as robust diecast construction, ergonomic molded handle grips, and precision machining to ensure precise fit.

Faceplate Hardware

Front Panel Hardware


Southcowww.southco.com/ATCAresource


Pixus Technologies provides Eurocard packaging solutions for CompactPCI, VPX, and VME architectures. Pixus supports a wide range of telecom, industrial, military, aerospace, scientific, medical, and transportation applications.

Pixus CompactPCI, VPX, and VME packaging solutions include subracks, enclosures, backplanes, chassis, and integrated system platforms. In addition, Pixus provides components and accessories such as fans, power supplies, card guides, guide rails, front panels, filler panels, and handles.

MicroTCA systems from Pixus leverage over 20 years of superior cooling, backplane, and packaging innovation with proven Pixus and Rittal tech-nologies. MicroTCA chassis and systems can be modified to meet customer requirements without NRE.

cPCI-VPX-VME Packaging Solutions

CompactPCI




FEATURES

CompactPCIĄĄ 1U – 13U rackmount and desktop units supporting 2 to 21 slot cPCI

backplanesĄĄ Conform to CompactPCI PICMG 2.0 specification

VPX & OpenVPXĄĄ 1U – 9U rackmount and desktop units supporting 2 to 21 slot VPX and

OpenVPX backplanesĄĄ Complies with VITA 46, VITA 48, VITA 65 VITA 1, VITA 1.1, IEC 60

297-3 and IEEE 1101.1/1101.10/1101.11 VME & VME64xĄĄ 1U – 9U rackmount and desktop units supporting 2 to 21 slot VME

and VME64x backplanesĄĄ Complies with VITA 1, VITA 1.1, IEC 60 297-3 and IEEE

1101.1/1101.10/1101.11


PICMG System







http://www.southco.com/atcaresource



FEATURES

ĄĄ 6U High with Front Mounted OpenVPX Card Cage

ĄĄ 7 Slot OpenVPX 40Gb+ Mesh Backplane with RTM Support

ĄĄ 1534 Watt Power Supply

ĄĄ Radial clocking for AUXCLK and REFCLK with chassis input SMAs

ĄĄ Payload Profile: SLT3-PAY-2F1F2U-14.2.1 and SLT3-PAY-2F4F2U-14.2.11

ĄĄ Switch Profile: SLT3-SWH-2F24U-14.4.3 or SLT3-SWH-2F4T16U-14.4.11

The Wild40 Seven Slot OpenVPX 3U Chassis is an OpenVPX-compati-ble chassis capable of accepting up to six 3U tall by 160mm OpenVPX Payload Front Plug-in Modules (FPMs) and one 3U tall by 160mm OpenVPX Switch FPM and up to seven 3U tall by 80mm Rear ''''Tran-sition Modules (RTMs). Plug-in Module slot spacing is 1″.

This chassis is equipped with a very high performance backplane which is capable of Serial I/O signaling at rates up to 10Gbps on the Data and Expansion Planes. The Data Plane of the backplane is con-nected to adjacent slots with one Fat Pipe connection. The Expansion Plane is a 3 slot star with two Fat Pipes connecting slots.

The Wild40 Seven Slot OpenVPX 3U Chassis includes a Chassis Moni-toring system which displays DC voltages, slot temperatures and fan Revolutions Per Minute (RPMs) on the front panel of the chassis and can be used to set fan speed. The Chassis Monitor can be accessed and controlled remotely via the Serial or Ethernet interfaces.

The card cage is recessed from the front of the chassis so that cabling can be used between Plug-in Modules and be contained within the frame of the chassis.

Wild40 Seven Slot OpenVPX 3U Chassis

Annapolis Micro Systems, Inc.www.annapmicro.com


DSP-FPGA Boards


Annapolis is famous for the high quality of our products and for our unparalleled

dedication to ensuring that the customer’s applications succeed.

We offer training and exceptional special application development support, as well as

more conventional support.

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http://www.annapmicro.com


FEATURES

ĄĄ 10U High with Front Mounted OpenVPX Card Cage

ĄĄ Primary 12 Slot OpenVPX High Speed Switched Backplane with RTM Support

ĄĄ Optional Secondary 5 Slot VME/VXS or 4 slot VPX Backplane for Power Only Payload Cards

ĄĄ Up to 3200 Watt Power Supply

ĄĄ Backplane Profile: BKP6-CEN12-11.2.X

ĄĄ Payload Profile: SLT6-PAY-4F1Q2U2T-10.2.1

ĄĄ Switch Profile: SLT6-SWH-16U20F-10.4.2

11U Rack mountable, 12-slot OpenVPX chassis with OpenVPX switched topology backplane capable of 10Gbps+ signalling com-promising of 2 switch and 10 payload 1" slots. Option of additional secondary 4-slot OpenVPX power-only (Shown) or 5-slot VME/VXS backplane.

The Wild40 12-Slot OpenVPX 6U Chassis is an OpenVPX-compatible (VITA 65) chassis capable of accepting up to ten 6U tall by 160mm OpenVPX Payload Front Plug-in Modules (FPMs) and two 6U tall by 160mm OpenVPX Switch FPMs and up to twelve 6U tall by 80mm Rear Transition Modules (RTMs) in its Primary Backplane. Plug-in Module slot spacing is 1″ VITA 48.1.

The Wild40 12-Slot OpenVPX 6U Chassis’ Primary Backplane is a very high performance backplane which is capable of Serial I/O signaling at rates up to 10Gbps on the Data Plane and up to 8Gbps on the Expan-sion Plane. The Data Plane of the backplane is arranged in a dual-star configuration with two Fat Pipe connections from each Switch Slot to each Payload Slot. The Expansion Plane is a chain connecting adjacent Payload Slots.

In addition to the Primary Backplane there is also an option for a Sec-ondary 4-Slot VPX Power-Only or 5-slot VME/VXS Backplane. The 4-slot VPX backplane supports four OpenVPX VITA65 slots with a 1″ VITA 48.1 slot spacing. These slots are not connected to each other on the Data or Expansion Planes, instead all of their connections go straight through the backplane to the RTM backplane connectors. These slots are ideally suited for Clock Distribution boards, Tuners or other non-IO intensive FPMs.

The chassis includes a Chassis Monitoring system which displays DC voltages, slot temperatures and fan Revolutions Per Minute (RPMs) on the front panel of the chassis and can be used to set fan speed. The Chassis Monitor can be accessed and controlled remotely via the Serial or Ethernet interfaces.

The card cage is recessed from the front of the chassis so that cabling can be used between Plug-in Modules and be contained within the frame of the chassis.

Wild40 12-Slot OpenVPX 6U Chassis



DSP-FPGA Boards


Annapolis is famous for the high quality of our products and for our unparalleled

dedication to ensuring that the customer’s applications succeed.

We offer training and exceptional special application development support, as well as

more conventional support.

PICMG System







FEATURES

ĄĄ General Features • 9.3 TB of Storage Per Each 6U VITA 65 Compliant OpenVPX Slot • Up to 4.5 GB/s Write and Up to 5 GB/s Read Bandwidth (write

bandwidth determined by system environmentals) • Scalable Depth and Bandwidth • Hot Swappable Drive Canister with 10,000 Insertion Cycles & Hot

Swappable Carrier (exclusive to WILDSTAR OpenVPX EcoSystem)

ĄĄ Backplane I/O • Up to 40Gb Ethernet on each of Four Fat Pipes on P1, for a total of

20GB/s on P1 • 1 Additional Fat Pipe on P4 providing QSFP+ connection via RTM • 1Gb Ethernet Connection on P4

ĄĄ System Management • Client/Server Interface for WILDSTAR FPGA Boards and Linux and

Windows-based CPU systems • Extensive System and Drive Diagnostic Monitoring and

Configuration over 1 Gb Ethernet via P1 and P4 Ethernet • Standard Intelligent Platform Management Interface (IPMI) to

Monitor Current, Voltage and Temperature • Front Panel Status LEDs for all 12 SSDs and all Backplane Control

and Data Plane Connections

ĄĄ Physical Features • 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX Payload Profile:

MOD6-PAY-4F1Q2U2T-12.2.1-n • Integrated Heat Sink • Air Cooled with Product Path to Conduction Cooling

When Storage capability is needed, Annapolis offers the highest density OpenVPX storage solutions on the market with up to 9.3 TB of capacity in a single 1" slot with up to 4.5 GB/s of write band-width. It also features a removable hot swappable canister with a connector rated for 10,000+ mating cycles. The WILD Data Storage Solution comes with standard images to support XAUI, 40GbE and AnnapMicro Protocol (Annapolis low FPGA utilization, full flow control protocol ideal for inter-FPGA communication).

The WILD Data Storage Solution is comprised of two pieces fitting in a single 1" OpenVPX slot, the “storage canister” which holds up to 12 1.8" SATA disks, and the “Storage Carrier” that plugs into the VPX backplane and holds the disk canister.

The Storage Carrier/Canister is specifically designed to sup-port 10,000+ insertion cycles of the disk canister for frequent drive removal. Both the canister and the entire assembly (Storage Canister + Storage Carrier) are also hot swappable for minimum system down time and highest reliability. This OpenVPX compliant payload card supports 40Gb serial I/O on the VPX Data Plane on P1 to support four channels of 40GbE (proper backplane required for faster rates).

To ensure safe and reliable processing, WILD Data Storage Solution boards come equipped with a proactive thermal management system. Sensors across the board monitor power and temperature, with auto-matic shutdown capability to prevent excessive heat buildup. WILD Data Storage Solution boards are built with a rugged, durable design. Sensors can be accessed with a chassis manager (ChMC).

New heatsinks have been tested with great success on WILD Data Storage Solution boards. These larger heatsinks also act as stiffeners for the boards, making them sturdier.

WILD Data Storage Solution



DSP-FPGA Boards


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FEATURES

ĄĄ MultiProtocol Switch • 1/10/40/56 Gb Ethernet and SDR/DDR/QDR/FDR Infiniband • Up to Four Tb/s Non-Blocking Switching Capacity with up to Eight

Switch Partitions

ĄĄ Backplane & Front panel I/O • Backplane Ports: Twenty High Speed Four Lane Data Plane

Connections, Sixteen 1Gb Ethernet Lanes • Front Panel Ports: Eight QSFP+, Two SFP+, RJ45 Management

Port, USB UART, Status LEDs • Each Backplane and Front Panel Port can be Configured for either

Infiniband or Ethernet • Infiniband and IP Routing • Ethernet Gateways

ĄĄ System Management • System Management using Intelligent Platform Management

Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem)

ĄĄ Mechanical and Environmental • 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX Slot Profile: SLT6-SWH-16U20F-10.4.2-n • Integrated Heat Sink and Board Stiffener

The WILD OpenVPX 14Gbit Switch Card supports 1GbE, XAUI, 10GbE, 40GbE, 56GbE, and SDR/DDR/QDR/FDR Infiniband. It has dual 1/10GbE SFP+ front panel control plane uplinks and eight front panel data plane QSFPs. It supports up to 20 1GbE backplane control plane connections and 20 XAUI/40GbE/Infiniband data plane connections.

The WILD OpenVPX 14Gbit Switch Card is extremely versatile since it is capable of switching both Infiniband (SDR, DDR, QDR, FDR) and Ethernet (1Gb, 10Gb, 40Gb, 56Gb) traffic with up to 4 Tb/s of non-blocking switching capacity. The WILD OpenVPX 40 Gb Ethernet and FDR Infiniband Switch also supports chassis management and can act as a Chassis Manager (ChMC). The 1Gb Ethernet control plane supports up to 20 backplane ports and two front panel SFP+ which can run at 1GbE or 10GbE. The data and control planes are located on different virtual networks to ensure best performance on each.

Basic configuration is streamlined where all required features are selected by DIP switches. A front panel USB serial port allows con-figuration of management Ethernet interfaces if needed (DHCP is the default configuration). Software updates, if needed, are completed via a simple web interface which can also be disabled via USB serial con-sole. Front panel status LEDs show the status of every switch port (link/activity) as well as overall status and health of the WILD Open-VPX 40 Gb Ethernet and FDR Infiniband Switch.

The front panel RJ45 10/100/1000 BASE-T Ethernet port is used for switch management and is connected directly to the on-board Pow-erPC. There is also an optional “in band” Ethernet connection from the PowerPC to the control plane. Note that not all switch configurations support the “in-band” management connection.

WILD OpenVPX 40 Gb Ethernet and FDR Infiniband Switch



DSP-FPGA Boards


PICMG System







FEATURES

ĄĄ General Features • One Xilinx Virtex 7 VX690T or VX980T FPGA • Up to 2 GB of DDR3 DRAM for 12.8 GB/s of DRAM bandwidth • Up to 32 MB of QDRII+ SRAM for 8 GB/s of SRAM bandwidthĄĄ Backplane I/O

• 24x High Speed Serial IO lanes to VPX Backplane (P1/P2) for 30 GB/s of Full Duplex Bandwidth

• Two PCIe Gen3 8x Connections to VPX Backplane (P1) • Eight LVDS lines to P2 • Backplane Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols

• External clock and IRIG-B Support via Backplane • Radial Backplane Clock Support for OpenVPX backplane signals AUXCLK and REFCLK

ĄĄ Front Panel I/O • Accepts Standard Annapolis WILDSTAR Mezzanine Cards, including a wide variety of WILDSTAR ADC and DAC Mezzanine Cards

• Three optional built-in Front Panel QSFP+ Transceivers running at up to 52.4 Gbps each for 39 GB/s of Full Duplex Bandwidth

• Simultaneous QSFP and Mezzanine Card use • QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and userdesigned protocols

ĄĄ Dual Core Processor APM86290 • Host Software: Linux API and Device Drivers • Each core runs up to 1.2 GHz • 2 GB of DDR3 DRAM • 4 GB SATA SSD and 16MB NOR Boot Flash • 4x PCIe Gen2 connection to Virtex 7 FPGAĄĄ Application Development

• Full CoreFire Next™ Board Support Package for Fast and Easy Application Development

• 10/40Gb Ethernet and AnnapMicro Protocol Cores Included • Open VHDL Model including Source Code for Hardware Interfaces • Open VHDL IP Package for Communication Interfaces • Chipscope Access through RTMĄĄ System Management

• System Management using Intelligent Platform Management Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem)ĄĄ Mechanical and Environmental

• 3U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX payload profile: MOD3-PAY-2F4F2U-16.2.10-n • Integrated Heat Sink and Board Stiffener • Available in Extended Temperature Grades • Air Cooled with Conduction Cooled path • RTM available for additional I/O

The WILDSTAR 7 for OpenVPX 3U contains one VX690T or VX980T Virtex 7 FPGA per board with up to 2 GB of DDR3 DRAM for 12.8 GB/s of DRAM bandwidth and up to 32 MB of QDRII+ SRAM for 8 GB/s of SRAM bandwidth. It has up to 1 million logic cells and 1.6 million multiplier bits per board.

These FPGA boards include a Xilinx Virtex 7 FPGA with 64 High Speed Serial connections performing up to 13.1 Gbps. There is two 36-bit QDRII+ SRAM interfaces clocked up to 500 MHz and two 32-bit DDR3 DRAM ports clocked at up to 800 MHz.

With included High Speed Serial (HSS) FPGA cores (including 40GBASE-KR), there is up 10 GB/s of bandwidth on the VPX data plane which can go directly to other VPX cards or to a switch, depend-ing on backplane topology. In addition, there is up to 20 GB/s of bandwidth on the VPX Expansion Place. When using 40GBASE-KR, there is the added reliability of Forward Error Correction (FEC) to achieve a much lower Bit Error Rate (BER).

If IO is required, Annapolis offers extraordinary density, bandwidth and analog conversion choices. Each 3U card has 1 mezzanine IO sites which can support up to 2 WILDSTAR Mezzanine cards as well as a QSFP+ option (on WS7 and WS A5 board) that allows for 3 QSFP+ transceivers per slot. These options can be mix and matched to meet customer needs. Some configurations utilize a second slot (for exam-ple the QSFP+ option and WILDSTAR Mezzanine card used in a single IO Site).

WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for more system reliability. This feature is unique to Annapolis and was developed because our experience with OpenVPX systems has shown it invaluable so a whole chassis does not need to be shutdown to remove a single board.

Annapolis OpenVPX FPGA cards include an on-board dual core 1.2 GHz PowerPC with direct FPGA 4x PCIe connection which can be used by customers for application requirements. It is also used query board health like FPGA temperature and power. It is connected to the OpenVPX control plane via 1GbE.

There are also plenty of user backplane signals available on the Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA HSS, IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps signalling and supports multiple channels of 40GbE.

WILDSTAR 7 for OpenVPX 3U



DSP-FPGA Boards


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FEATURES

ĄĄ General Features • Dual Channel ADCs and DACs running at up to 1500MSps each

at 12-bits • Ultra Low latency from ADC SMA input to DAC SMA output • Digital Bypass Mode (SMA-to-SMA): < 24ns • Fabric Space Mode (SMA-to-SMA): < 39ns • Digital Bypass Mode has built-in run-time adjustable delay

providing additional delay from 0ns up to 62 Sclk periods • Capability to have four ADC channels and four DAC channels in

one 6U OpenVPX slot when plugged into WILDSTAR OpenVPX FPGA cards

• Support for WILDSTAR 7 (Xilinx Virtex™-7) and WILDSTAR A5 (Altera Stratix® V) PCIe and OpenVPX mainboards

• Firmware and Software Board Support Interface provided in CoreFire Next and VHDL source

ĄĄ ADC and DAC and Performance • Sample Rate: 300 – 1500MHz • ADC and DAC Resolution: 12 bits

ĄĄ SMA I/O • Two Analog Inputs • Two Analog Outputs • One High Precision Trigger Input • One External Clock Input • Mechanical and Environmental

ĄĄ Mechanical and Environmental • Integrated Heatsink and EMI/Crosstalk Shields • Commercial and Industrial Temperatures Available

ĄĄ Clock Synchronization • Software-selectable external clock input or onboard clock • All ADCs on a mezzanine card are synchronized to the same sample • All ADCs across multiple mezzanine cards can be synchronized to

the same sample using • WILDSTAR Clock Distribution Boards • Provides capability to configure 40+ ADC and DAC channels in one

COTS Annapolis 19" OpenVPX Chassis

This ultra low latency Dual 1.5GSps ADC/DAC card is specifically designed for DRFM applications with 24ns latency from SMA to SMA.

The WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card was designed from the ground up for latency sensitive DRFM appli-cations. The Board Support Interface, which is available in VHDL or CoreFire Application Design Suite, was also designed from the begin-ning to be suited for DRFM applications. This interface provides a Digital Bypass Mode to achieve the lowest possible latency and a Fabric Space Mode to allow the user to do additional processing and manipulation of the ADC data before returning it out the DAC. The Fabric Space Mode adds only 14ns of latency. The Board Support Interface also includes a built-in Bypass Delay which can be controlled to be from 0 to 62 ADC sample clock periods. This allows the user to “walk” the latency out from the minimum Digital Bypass Mode latency to slightly beyond the Fabric Space Latency, providing for a smooth latency transition between the two modes.

The CoreFire Next Design Suite, Annapolis’ FPGA Design Tool, allows the user to design a 24ns latency DRFM-optimized application in minutes.

The WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card is shipped with a custom heatsink which enables proper cooling of the ADC. An on-board temperature monitor is also supplied which allows for real-time monitoring of the ADC’s internal die temperature.

The WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card provides high fidelity and high speed analog-to-digital conver-sion along with a rugged design. This card is compatible with with WILDSTAR 7 and WILDSTAR A5 mainboards.

WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card



DSP-FPGA Boards


PICMG System







FEATURES

ĄĄ 1x Mini PCI Express Gen 1.0 ĄĄ Dual Independent Dual Redundant MIL-STD-1553 ChannelĄĄ Two independent DDC Total-AceXtreme® EngineĄĄ BC or Multi-RT with Concurrent Bus MonitorĄĄ Programmable Bus Controller, Remote Terminal or Bus MonitorĄĄ Supports MIL-STD-1553 A/B and MIL-STD-1760ĄĄ IRIG-106 Chapter 10 MT SupportĄĄ Optional 8 I/O LinesĄĄ Optional Digital Irig Input ĄĄ Support for Linux®, Windows®, VxWorks ®drivers

The MIL-STD-1553 (1553) PCIe-Mini expansion module is a 2 Channel dual redundant 1553 controller module, where each controller can support BC or Multi-RT with Concurrent bus monitor. The controller can support the MIL-STD-1553 A/B and the MIL-STD-1760 traffic.This module can operate in a Mini PCI Express slot.Utilizing the DDC Total-AceXtreme® Engine, this 1553 card is able to perform:1553 Bus Monitor (MT) • IRIG-106 Chapter 10 Compatibility • Filter Based on RT Address, T/R bit, Sub-Address • Advanced Bit Level Error Detection to Isolate Bus Failures1553 Remote Terminal (RT) • Emulate up to 32 RT Addresses Simultaneously • Multiple Buffering Techniques • Programmable Command Illegalization • Programmable Busy by Sub-address1553 Bus Controller (BC) • Streaming and Minor/Major Frame Scheduling of Messages • High and Low Priority Asynchronous Message Insertion • Modify Messages or Data while BC is running

PCIe-Mini-1553-2

Mezzanines


ALPHI Technology Corporationwww.Alphitech.com


FEATURES

ĄĄ Adds removable SSD to your ATCA, cPCI SBCĄĄ Boot or StorageĄĄ XMC PCIe Gen2 x1 interface per VITA 42.3ĄĄ Air or conduction cooledĄĄ Uses COTS CFast drivesĄĄ CFast secured by rugged retainer clipĄĄ 10,000 mating cyclesĄĄ CFast capacities currently up to 120GBĄĄ 1.8" SATA version available (up to 800GB) ĄĄ PMC versions also availableĄĄ Drivers for Windows, Linux and VxWorks

The XMC Removable CFast Module is a mezzanine storage module with a dual-channel PCI Express to SATA 3 controller that is rated for a temperature range of -40C to +85C.

Provides boot drive and/or disk storage for VPX, VME, cPCI, and ATCA SBCs with XMC slot.

CFast is same form factor as Compact Flash but with SATA interface thus providing faster throughput. The CFast connectors are rated for 10,000 mating cycles to support frequent insertions/removals.

XMC Removable CFast Module

Mezzanines


Red Rock Technologieswww.redrocktech.com [email protected]

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http://www.alphitech.com

http://www.redrocktech.com



FEATURES

PXS1PXS0108 1U MicroTCA® ChassisĄĄ Low cost MicroTCA platformĄĄ Active backplane removes the need for expensive Power Entry Modules

(PEMs)ĄĄ Side-to-side push-pull cooling removes the need for expensive Cooling

Units (CMs)ĄĄ Supports up to 6 mid-height AMCsĄĄ Supports 2 MCHs

PXS0309 3U ATCA® Hybrid Chassis with 8 AMCsĄĄ 19" rack mount 3U ATCA Hybrid AMC ChassisĄĄ 1 ATCA slot and 8 mid-size AMC slotsĄĄ 40GbE or 10GbE fabric across the backplane

Pixus Technologies’ MicroTCA® chassis and systems are based on the PICMG® MicroTCA.0 R1.0 specification. The 1U and 3U platforms support up to 8 AMC modules to provide a superior level of flexibility and compute density.

With support for AC and DC input power, the 19" rackmount systems support a range of applications at the edge of the network in telecom, industrial, and military environments. Applications include network appliances, deep packet inspection, surveillance, protocol conversion, and SIGINT.

MicroTCA systems from Pixus leverage over 20 years of superior cooling, backplane, and packaging innovation with proven Pixus and Rittal tech-nologies. MicroTCA chassis and systems can be modified to meet customer requirements without NRE.

MicroTCA® Systems

MicroTCA





FEATURES

ĄĄ Low cost – supports the use of “off-the-shelf” server PSUs and simplified fan tray modules.ĄĄ Fully redundant – redundant FAN Trays and power supplies.ĄĄ High-Power Cooling – cooling power of up to 80 watts per

AMC/MCH.ĄĄ AC Power Supply – Dual Redundant 1kW hot swappable PSU units.ĄĄ High-speed Backplane – 10/40 GbE fat pipe; 1GbE for

Management, IPMI for FRU’s.ĄĄ AC/DC configurations – AC 110-230 VDC.ĄĄ Compliance – EIA Compliant; RoHS Compliant; PICMG MicroTCA.0

R1.0ĄĄ Option for lower cost – Non-Redundant system.

Asis has managed to break the mTCA chassis cost barriers without compromising on the standard’s advanced features and performance. ASIS mTCA chassis’ unique architecture enables the use of “off-the-shelf“ server PSUs and simplified fan tray modules, while still maintaining distributed power and smart fans, as required by the mTCA standard.

• Form factor – 2U; 19"

• 10G/40G Backplane

• 12 mid- or compact AMCs (80W each)

• 2 MCH

• 300mm depth

• Fully redundant chassis (fan trays and power supplies)

Low Cost mTCA

MicroTCA


Asis Ltd.www.asis-pro.com


PICMG System










picmg systems & technology spring 2015 resource guide

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