status and opportunities in ev/hev power electronics
TRANSCRIPT
From Technologies to Market
Status and Opportunities in EV/HEV Power
Electronics
© 2017
2©2017 | www.yole.fr | Automotive World | [email protected]
OUTLINE
• EV/HEV MARKET Development: why and how?
• Are there remaining barriers?
• EV/HEV Market Forecast
• Technical Trends
• Innovations at module level: power packaging and integration
• Power devices: silicon and WBG
• Conclusion
3©2017 | www.yole.fr | About Yole Développement
MEMS &
Sensors
Displays
Compound
Semi – LED
& OLEDs
Imaging Photonics
MedTech
Manufacturing
Advanced Packaging
Batteries / Energy
Management
Power
Electronics
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
4
A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
M&A operations
Due diligences
www.yolefinance.com
Innovation and business maker
www.bmorpho.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
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6
WHAT HAS CONTRIBUTED TO MARKET GROW IN THE LAST YEARS?
CO2 reduction is a major factor for electric vehicle development
AggressiveEuropeanregulation in terms of CO2 reduction ishelping the electric cars market to grow
• CO2 reduction isone of the keychallenges to facefor the 21st century
• Pushed byaggressivelegislation, carmakers need todevelop cleanervehicles
• To achieve theseambitious targets,best solutioncurrently available isthe electrification ofvehicles, withdifferent levels ofelectrificationdepending on thestrategies ofdifferent carmanufacturers
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7
DIFFERENT TYPES OF VEHICLES AND THEIR MARKET
Different level of electrification and their associated CO2 reductions
CO2 reduction compared
to thermal vehicles (in %)
Level of electrificationThermal vehicle
(Taken as reference)
SSV/µHEV
Mild HEV
Full HEV
PHEV/ EREV
EV (BEV or FCV)
5 – 10%
10 – 25%
25 – 40%
50 – 100%
100%
Car example
Tesla Model S
Mitsubishi Outlander
Toyota Prius
Honda Civic
Mercedes Class A
VW Golf
Yole Développement 2015
Different levels of electrification are available depending on the level of CO2reduction required by targets
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8
DIFFERENT TYPES OF VEHICLES AND THEIR MARKET
Description of the different types of electrification
Eachelectrificationlevel has an associatedelectricalpower output
Functions SSV + µHEV Mild HEV Full HEVPHEV (with
EREV)
EV (BEV or
FCV)
Start/stop: stop engine idle
when a vehicle slows down
and comes to a stopX X X X X
Regenerate braking X X X X
Additional power for a few
seconds (electric motor) X X X X
Additional power for mid
distance (city traffic)X X X
Power for long distance (10
to 40 miles)X X X
Recharge battery on the
grid or with a generatorX X
Energy savings 5-10%
(up to 25% in city
traffic)
10- 25% 25 – 50% 50 – 100% 100%
Electric power 3-8 kW 4 - 20 kW 30 - 75 KW 70 – 100 kW 70 – 100 kW
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10
WHAT HAS CONTRIBUTED TO MARKET GROW IN THE LAST YEARS?
Range increase reassures customers and boosts sales
Thanks to battery cost decrease and technical solutions developed, electric cars range keep on increasing, pulling the market
Driving range as a function of battery energy capacity
Nissan LEAF
Renault Twizy
Mercedes SLS
AMG Coupé
Toyota RAV4EV
Tesla Model S
BYD E6Car sharing
and small
city cars
Big and luxury
BEV
Source: Yole Développement
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Yole Développement - 2016
11
WHAT HAS CONTRIBUTED TO MARKET GROW IN THE LAST YEARS?
Charging infrastructure has been increasingly available over the last few years
As of March 2016, there were almost 13,000 DC chargers worldwide
Considering CHAdeMO and CCS
chargers
-1 000
1 000
3 000
5 000
7 000
9 000
11 000
13 000
DC chargers units evolution worldwide
Japan Europe USA Others Total
Amount of DC
chargers was multiplied
by 2 in one year
• Charging infrastructureis a key point todevelop in order toencourage growth inthe electric vehiclemarket; before buying aBEV a customer willcheck whether they areable to charge itquickly, easily andlocally
• Our current estimatessuggest that there are1.5x more AC chargersthan BEVs
• Governments help todevelop thisinfrastructure byfinancing DC, rapidcharging points
©2017 | www.yole.fr | Automotive World | [email protected]
Yole Développement - 2016
12
WHAT ARE THE REMAINING BRAKES FOR ELECTRIFIED CARS GROWTH?
An expensive electro-mobility also due to high battery cost
0
50
100
150
200
250
300
350
400
450
2014 2015 2016 2017 2018 2019 2020 2021 2022 2023
Pri
ce (
$/k
Wh)
Forecasts for battery pack price evolution
Source: “Energy Management for smart grid, cities and buildings: Opportunities
for battery electricity storage solutions” report, Yole Développement, 2015
In 2015, battery
pack was sold
around 370$/kWh
Official target for 2020 is
100$/kWh at cell level,
representing ~260$/kWh
for battery pack
• As unit cost alone is asignificant factor inchoosing a car, furthercosts are a seriousconsideration forbuyers.
• The differencebetween electric andthermal vehiclespresented on theprevious slide is inpart due to batterycost, whichrepresents a largeproportion of theoverall unit price.
• Even if targets for2020 are veryambitious, currentlevel of battery cost
Another financial barrier to uptake of electro-mobility: Battery cost.
©2017 | www.yole.fr | Automotive World | [email protected]
Yole Développement - 2016
14
FUTURE AND PERSPECTIVES FOR ELECTRIFIED VEHICLES
Electrified vehicles market and forecasts up to 2021 – not including SSVs
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Yole Développement - 2016
15
POWER ELECTRONICS AND AUTOMOTIVE APPLICATION
Presentation of definitions used in the report
Different markets are presented in the coming
slides
Car level
Power system level
Power module levelPower device level (die)
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16
POWER ELECTRONICS AND AUTOMOTIVE APPLICATION
Evolutions of markets relative to electrified cars between 2015 and 2021
Markets related to power electronics for EV/HEV are multiplied by 15 between the devices market and the systems market
2015
$465M
$4.1B
$671M
2015
3.2M $13B
Power systems (inverter + AC/DC +
DC/DC boost + DC/DC)
202121.58% CAGR
Cars (HEV + PHEV + BEV)
202127.14% CAGR
13.5M
2015
IGBTs Modules
2021
$1,63B
19 % CAGR
Power devices
2015
202120.1% CAGR
©2017 | www.yole.fr | Automotive World | [email protected]
$1,2 M
17
IGBT MARKET
EV/HEV in IGBT module market—evolution between 2015 and 2021
At module level, EV/HEV will represent almost half of the market by 2021
Total: $2.41B Total: $3.73B
©2017 | www.yole.fr | Automotive World | [email protected]
Yole Développement - 2016
18
POWER ELECTRONICS AND AUTOMOTIVE APPLICATION
Power electronics market for EV/HEV (system level)
Growth rate 16.42% 20.46% 22.47% 28.23% 27.92% 24.50% 17.57% 9.86%
21.58%
44.38%
23.34%
14.26%
19.54%
CAGR 15-21
Yole Développement - 2016
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20
POWER ELECTRONICS USED IN ELECTRIFIED VEHICLES
Technical targets: a power density roadmap
• Costs of EV/HEV systems are not yet competitive in comparison to combustion engines.
• Making EV/HEV systems competitive will require considerable investments in technology, integration with other vehicle systems, crossplatform sharing, etc.
Challenges
Traction Drive System
• Benchmarking technologies
• Innovative systems designs
Requirements: 55kW peak for 18 sec, 30kW continuous: 15 years life
Whole Traction Drive Systems Power Electronics Motors
Year Cost $/kW kW/Kg kW/l Efficency Cost $/kW kW/Kg kW/l Cost $/kW kW/Kg kW/l
2010 19 1.06 2.6 > 90% 7.9 10.8 8.7 11.1 1.2 3.7
2015 12 1.2 3.5 > 93% 5 12 12 7 1.3 5
2020 8 1.5 3.5 > 94% 3.3 14.1 13.4 4.7 1.6 5.7
2025 5 1.6 5 > 95% 2.1 15.8 17.6 2.9 1.7 7.4
Power Electronics• Innovative topologies
• Temperature-tolerant devices
• Packaging
• Capacitors
• Vehicle charging
• New materials
Electric Machines
• Permanent magnet (PM) motors
• Magnetic materials
• High-performance of non-PM motors
• Thermal system integration
• Heat transfer technologies
• Thermal stress and reliability
Specification: 55kW peak for 18 sec, 30kW continuous: 15 year life
Source: US Drive June 2013
DOE
objectives
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21
INVERTER LEVEL: TOPOLOGY AND MECHATRONICS
Converters co-integration• DC/DC Boost + Inverter + Generator• Inverter + LV-HV DC/DC• On board DC/DC + LV-HV DC/DC
• Improved cooling•Higher power density•Mechatronic improvement
Double sided cooling1-in-1 power modules
Co-integration motor + inverter:• Increase power density• Inverter mechatronic design
to fit with motor aspect ration
Main evolutions in power electronics:
In-wheel motor + inverter integration
Towards
system
integration
6-in-1 power modules
All-in-1 power modules
Coming technologies?
Widely used 6-in1 power modules
Towards more integration
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22
INVERTER LEVEL: TOPOLOGY AND MECHATRONICS
Summary: BEV
• Different mechatronics trends can be predicted depending on the electrification level and architecture of the cars
Motor + inverter integration would be mainly used for fully electric cars
BEV
PHEV
Full
HEV
Mild
hybrid
Small electric
motor + inverter
Mechatronics trends
Centralized power
unit box
Motor + inverter
integration could start
being implemented in
BEVs beyond 2020.
For PHEVs and full HEVs, a
centralized power unit box
might be preferred, as the
synergy between their
numerous converters can have
a bigger impact on size
reduction
?
New trend towards using
ICE’s cooling loop?
©2017 | www.yole.fr | Automotive World | [email protected]
23
INVERTER LEVEL: TOPOLOGY AND MECHATRONICS
Mild hybrid vehicles: Motor-Inverter integration
• So far the integration of power converters into the electric motor housing has only been seen in mild hybrid cars, as low powers are involved (5-15kW).
• This integration between the electric motor and the inverter will be a strong trend for this category of electrified vehicles.
• The electric motors are considered an auxiliary help for the ICE traction (belt-connection mainly).
• Continental provides a motor-inverter solution of permanent 5kW power (peak 13kW), for a 48V mild hybrid architecture.
• The weight of the whole assembly is 12kg.
• The mild hybrid Volkswagen Golf TSI is using this technology from Continental.
The 48V mild hybrid architecture is fast-spreading among car OEMs. In several cases, motor + inverter integrated solutions are used.
Continental’s 5kW (max. 13kW) motor + inverter
used by Volkswagen
Close integration is achieved with motor-inverter mechatronics in mild hybrid vehicles.
Mild hybrids
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24
SINGLE COOLING LOOP
Mild hybrid’s increasing temperature
• In today’s electric/hybrid cars, several cooling systemscan be found (see the picture below)
• The ICE has its own cooling system, and so too the power converter units and the battery (if needed)
By the end of 2016, the first 48V mild
hybrids will be commercialized. By 2018, single cooling loop technology will
be widespread.
©2017 | www.yole.fr | Automotive World | [email protected]
• There is a new trend towards using a unique cooling loop betweenthe ICE and the power electronics. This increases cooling looptemperature from a maximum of 70 - 90°C to 105°C.
• The temperature junction is increased to 150°C (just for mild hybrids)
• Nearby electronic components must handle temperatures up to ~110°C
• DC-link capacitors must use polyester films (PET)
• Several German and French car manufacturers are working on 48Vmild electric vehicles. These will be the first to use a commoncooling loop.
• This trend might expand to other hybrid vehicles where higherpower must be handled:
• The Tj will then be at 175°C. Yole expects this after 2021 - 2022.
• The capacitors must support temperatures up to 130°C
• Alternative films will require analysis: PET, PEN, PPS, etc.
• Regarding Dupont Teijin’s PENHV, some car manufacturers are testing these capacitors, but so far elevated cost is a critical barrier
• Laminated busbar technology will also be challenged by increased temperature, as its glue is limited to 105°C
25
INVERTER LEVEL: TOPOLOGY AND MECHATRONICS
Case study: Tesla S model
• The Tesla S inverter is another example of a particular form factor for the power converter in other to integrate a cylindrical axe defined by the electric motor.
• Each phase of the inverter is located in a lateral side of a triangle support, which correspond to the cooling system.
• Tesla uses discrete IGBTs which allows them to get the flexibility to adapt its inverter to the desired form factor.
Tesla uses a specific mechatronic on their S model inverter, in order to integrate the form factor of their motors
Tesla S model’s cylindrical inverter design
BEV
One leg of the inverter using 2x14 discrete IGBTs
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26
INVERTER LEVEL: TOPOLOGY AND MECHATRONICS
Case study: Tesla S model
• Luxury electric cars can also pretend to bring all-wheel drive solutions
• This is the case for theTesla S 85 kWh P85D model
• Two independent electric motors with their respective inverters are used for each wheel axle
• Needless to say, the use of several electric motors an inverters for an electric car will not be a trend for mass oriented BEVs
• All-wheel drive solutions will be an offer dedicated for niche luxury products
For their luxury high-end solution of Tesla S model, an all-wheel drive solution has been chosen
BEV
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Innovations at module level: power packaging and
integration
© 2017
28
POWER MODULE LEVEL: POWER PACKAGING AND INTEGRATION
Different types of modules used for automotive
Differenttypes of modules
existdepending on the numberof switches integrated
2in1 power module
MOTOR3-phase
6in1 power module
MOTOR3-phase
“all-in-1” power module
Optional boost
Optional boost
Toyota model
Source: ORNL
Source: ORNL
4in1 power module
MOTOR3-phase
Optional boost
Source: ORNL
1in1 power module
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29
POWER MODULE LEVEL: POWER PACKAGING AND INTEGRATION
Power module types and positioning of manufacturer
2in1 power module
6in1 power module
“all-in-1” power module
4in1 power module
2010 2014
Renault Zoe
Nissan Leaf
BYD e6
Volkswagen Golf
Volkswagen e-up!
Tesla Model S Tesla Model X
Ford C-max
Ford Focus electric
Toyota Prius
Toyota Prius
Toyota Camry
Lexus LS600h 2008
Honda Civic
Nissan Leaf
Toyota YarisToyota Auris
Mitsubishi Outlander
1in1 power module
Discrete devices
2015201320122011 2016
Chevy Volt
Honda Accord
Amount of switches in
1 module
Each car manufacturer has a specific strategy,
and the power module chosendepends on the
car model. A generic trend seems to be a
reduction in the amount of
switches in the module
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Yole Développement - 2016
30
POWER MODULE LEVEL: POWER PACKAGING AND INTEGRATION
How is a standard power module designed?
A standard power
module is a complex
assembly of different materials including
active devices
Heatsink
Thermal grease
Substrate
SBD IGBT
Baseplate
DBC
Busbar connection
Solder
Copper metallization
Plastic case
Die attachInterconnection
Gel filling
Substrate attach
- A power module with a baseplate is the standard design, used in most available power modules.
- Modules built with a substrate (mainly DBC, Direct Bond Copper) are the most common.
- Common failures in power modules are caused by thermal cycling. Mismatched coefficients of thermal expansion (CTE) can make layers detach from one another. Some gel fillings also cannot handle high temperatures.
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31
POWER MODULE LEVEL: POWER PACKAGING AND INTEGRATION
Main technical progress for packaging for automotive
In automotive industry, cost, reliability and weight are the most important parameters
Cost and reliability issues
Weight reduction
Layers suppression
Use of epoxy resin instead of silicon gel
Reliability and efficiency increase
Die attach innovations
Cooling improvements (double
side cooling…)
Cooling has a key role to play
considering the increase of
temperature inside the module
• Cost and reliability arethe most importantparameters in theautomotive industry.
• Cost encompassesother parameters:
• Weight (and thuspower density)
• Efficiency (morelosses representmore consumptionand thus higher cost,and CO2 regulationsare tough)
• These imperatives havehuge impact at thepackaging level.
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32
POWER MODULE LEVEL: POWER PACKAGING AND INTEGRATION
Reducing the number of layers is important
• Some modules have been developed that combine substrate and baseplate into a single layer.
• The new layer must combine the roles of the two former layers:
• Allow electrical conduction on the surface and insulation underneath, and thermal conduction all through the layer. Die-attach must be of good quality as well.
• Act as a mechanical and thermal support for the module
• Mitsubishi Electric (JP), the worldwide leader for power module manufacturing, launched its new IGBT power module at PCIM 2015 (Germany, May 2015). This new module uses an Insulated Metal Baseplate (IMB).
In order to reduce the number of
layers, some manufacturers are combining the substrate and baseplate.
Source: Mitsubishi Electric
presentations
An IMB consists of an
insulating resin sheet with
high thermal conductivity,
copper baseplate and thick
copper foil.©2017 | www.yole.fr | Automotive World | [email protected]
33
POWER MODULE LEVEL: POWER PACKAGING AND INTEGRATION
Comparison of encapsulants used for power packaging in automotives
Epoxy resinand silicone gel are the mainstays in automotivepower packaging.
• There are two mainsolutions currentlyused for powermodule filling inautomotives.
• Silicone gel is themost mature andwidespreadsolution.
• Epoxy resin is nowwell developed andis grabbing moreand more marketshares, thanks togood thermal andmechanicalperformance and amuch lower pricecompared tosilicone gel.
Material
Tensile
Strength
(MPa)
Elastic
Modulus
(GPa)
Conductivity
(W/mK)
Coefficient
of
Expansion
(ppm/°C)
Resistivity
(Ω.cm)
Dielectric
Constant
Silicone gel 10.3 2.21 0.15-0.31 70 1015 -1017 2.9-4.0
Parylene 45-76 / 0.08-0.12 35-69 / /
Polyurethane 5.5-55 0.172–34.5 0.07–0.31 100–200 3 x 108 5.9–85
Epoxy 55-82 2.76–3.45 0.17–0.21 45–65 1013–1016 3.2–3.8
Acrylic 12.4–13.8 0.69–10.34 0.12–0.25 50–90 7 X 1013 /
Different types of materials that can be used for power packaging
Silicone gel and epoxy resin are the most widespread solutions for automotives.
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34
POWER MODULE LEVEL: POWER PACKAGING AND INTEGRATION
Overmolded modules and double-side cooling: a future generic feature?
Double sidecooling fits wellwith overmoldedmodules. Considering the context, weexpect thosemodules to become more widely used in the future
2020 202520152010
Level of electrification / Power of the module
Mild HEV
Full HEV
PHEV
BEV
Cost
reductionTime
Other
companies
Major companies already have overmolded double-side
cooled modules in their portfolio
• Overmolded moduleswere first used due totheir low cost,especially in hybridvehicles.
• Double-sided coolingallows better thermalmanagement in areduced volume, whichis a key constraint inhybrid vehicles.
• On the other hand,with the increase injunction temperature,thermal management isalso key for fullyelectric vehicles.Pressure to reducecost is also very strongon this segment.
• We are confident instrong development ofovermolded double-sidedcooled modulesin the future.
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Yole Développement - 2016
35
POWER MODULE LEVEL: POWER PACKAGING AND INTEGRATION
Double-side cooling: designed for a better thermal management
• To improve thermal dissipation, some manufacturers decided to cool the module on both sides: this is the double-side cooling technology
New Infineon module, targeting
automotive application, combines
molded package and double side
cooling
• As explained by Infineon:
• Electrical isolation is provided by DCB (Direct Copper Bonded) ceramic substrate. Heat is transported to the lower heatsink by soldering the chip directly onto the substrate. The heat to the upper heatsink is realized by “spacers”, which adjust the height of the module. This does not only improve manufacturability but provides the necessary space to integrate multiple safety features like current and temperature sensors.
• The realized tests also show that thermal resistance directly depends on the heatsinks attachment force, as shown on the chart on the left => interface between DBC and heatsink remains an important step to master
Source: Infineon presentations
Heatsinks are assembled
to each DCB, on the
bottom and on the top of
the module
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36
• Infineon went further in the development of a new module, providing a product that benefits both from a double-sided cooling system and from the reduction of the amount of layers
POWER MODULE LEVEL: POWER PACKAGING AND INTEGRATION
Double side cooling module can be directly exposed to cooling circuit
This module doesn’t integrate
a heatsink for cooling
Source: Infineon presentations
• The module presented (intended for mainly automotive applications) can be used with a standard assembly with a heat sink as seen in the previous slide, but it can also be directly exposed to the cooling circuit
• This represents a very interesting development as previous designs comprised 3 layers between the die and the cooling system (substrate, baseplate, heat sink), whereas the new design has only one. This design also does not require the use of thermal interface material (TIM)
• According to Infineon, the thermal resistance of the entire module can be reduced by more than 40% using direct cooling instead of an assembly with a heat sink and TIM
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37
POWER MODULE LEVEL: POWER PACKAGING AND INTEGRATION
Presentation of Bosch Automotive double side cooled module
Bosch has a power module + inverter solution
for electrified vehicles Source: Bosch presentation
Heatsink in copper
300µm Insulating layer in Aluminum
nitride – 85µm
Top Copper Leadframe –
1mm
Detailed view of the cross-section (Optical photo).
Top Solder SAC – 120µm
Source: System Plus Consulting
• Bosch Automotive Electronics has developed a double-side cooled 2-in-1 power module, integrated into their inverter for electrified vehicles
• The Bosch power module is used by the Volkswagen Group in many electrified cars (e-Golf, e-Up!, Audi A3 e-tron, etc.)
• The Bosch power module is specially designed for automotive applications:
• IGBT developed in partnership with Infineon
• Molded Package
• Chips soldered on massive copper substrate for enhanced thermal spreading and junction temperature management
• Thin Film Insulator
• Temperature sensor inside the package
• Inductance: 10nH
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38
POWER MODULE LEVEL: POWER PACKAGING AND INTEGRATION
Presentation of the Mitsubishi double-side cooled module
• Mitsubishi Electric was one of the first companies to offer double-side cooled modules for automotive applications.
• Mitsubishi modules are used in many electrified cars from Japanese manufacturers, including the Honda Fit.
Mitsubishi electric power modules are
widely used by Japanese car
makers
• T-PM J-Series
• 2-in-1 transfer-molded package
• 600V/300A capability
• On-Chip current sensor & temperature sensor
• Tjmax = 175 °C
Source: System Plus Consulting
Package Top view back view
Bottom Copper Leadframe – 3mm
Total Height
6.5mmheat sink – 100µm
Insulating layer – 210µm
Top Copper LeadframeIGBTDiode
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39
POWER MODULE LEVEL: POWER PACKAGING AND INTEGRATION
Roadmap of power module packaging design
In the future power
modules will have been entirely
reshaped, with the changes
depending on the power targeted
Bosch example• Molded package• Double side soldering• Low inductance
Mitsubishi example• Six Pack IGBT/Diode Package• Cooling fin• Thick copper layer for thermal
spreading• Direct substrate cooling
Mid-power modulesDesign evolution
Die on heatsink• Die attach: film
sintering? Gold sintering? Glue? Silver oxalate?
• Ceramic heatsink?• Ball bonding?
2018
2020
2014
2025
• Wide use of leadframe• Over-molded package• Top interconnections• Ag sintering for die attach
• Encapsulation with parylene• Ribbon bonding• Silver (Ag) sintering for die
attach• Pin-fin baseplate
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41
POWER DEVICES: SILICON AND WBG
Power device technology positioning
WBG devices are primarily positioned in high-end applications
1200V or more
600V or less
Pro
du
ct r
ange
Voltage
IGBTThyristor
IGCT…
SiC
MOSFET
Triacs
Bipolaretc.
3.3kV and more200V
GaN GaN
• Historically, silicon had a complete monopoly over the semiconductor industry in integrated circuits (IC), microchips and power electronics
• Other semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) have been in development for some decades now
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42
Converters SSVMild
HEV
Full
HEV
PHEV (with
EREV)
EV (BEV
or FCV)
1. Start/stop moduleMOSFET
1.5 to 10kW
Av: 3.5kW
2. DC/DC converter 14V (toMOSFET – 1.5 / 3kW – Av: 2.25kW
3. DC/AC inverter ( + DC/DC
booster option )
MOSFET or
IGBT
5 /20kW
Av: 15kW
IGBT – 20 / 150kW
Av: 70kW
4. GeneratorIGBT – 20 / 40kW
Av: 30kW
5. Battery charger
MOSFET - 3/6kW – Av: 4.5kW
and then
IGBT - 10 / 20kW – Av: 15kW
Total average
power / car 3.5kW 17.25kW 52.25kW 56.75 to 102.5kW
(for a single motor setup)
These applications are specific to EV/HEV. Standard ICE power device applications such as oil pump, steering, braking and HVAC are not considered.
Auxiliary inverters have not been considered because they use few power devices.
POWER DEVICES: SILICON AND WBG
Device types and power levels: opportunities for WBG
WBG devices could
replace Si-based IGBTs
and MOSFETs in
EV/HEV applications.
Could be replaced by WBG
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POWER DEVICES: SILICON AND WBG
IGBT technology evolution and roadmap
PT(planar)
1988
1995
1985
NPT(planar)
1997
Trench gate
Thin wafer
technologies
2002
FS (planar)
Trench FS
(thin wafer)
2008
2011
CSTBT
Trench FS
LPT-
CSTBT
Advanced
trench FS
2014
Trench
enhanced FS
LPT-CSTBT
(thin wafer)
SPT+
2007
Evolution
2020
Advanced HiGT
SJ IGBT
SiC IGBT
There is still room for improvement for
Si-based devices
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44
POWER DEVICES: SILICON AND WBG
How WBG adds value
WBG materials offerhigherjunctiontemperatureand reducedsize comparedto silicondevices
• WBG devices allow reduced system size and weight.
High electron mobilityHigh Junction T°
No recovery time
during switching
Low lossesless energy to dissipate
Fewer cooling
needs
System size and
weight
reduction
High switching
frequency
Smaller filters
and passives
Intrinsic
properties
Impact on
operation
Impact on
power module
Impact on
power system
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45
POWER DEVICES: SILICON AND WBG
Converters and inverters in EV/HEV: where are SiC & GaN?
The choice of SiC or GaN in
EV/HEV is complex
DC/DC
boost
converter
DC/AC
Inverter
Powertrain
Electric
motor
DC/AC
inverter
AC/DC
converter
200-
450VDC
DC/AC
Inverter
Air conditioner
Torque to
drive wheels /
braking
energy
recovery
DC/DC
converterEngine
generator
12V
battery
AC electric
accessory load
Toyota only
High voltage
battery
Power device positioning within an EV/HEV
Yole Développement
Battery
charger
DC electric
accessory load
• GaN and SiC arecandidates for newinverter and converterdevices for EV/HEV.
• Technologicallyspeaking, SiC is used forhigh-power DC/ACinverters and GaN isbetter adapted to low-power DC/DC andAC/DC converters.
• However, the choice ofSiC or GaN is morecomplex and dependson numerous criteria.
• SiC technology mightalso be implemented inlow-power convertersdue to GaN’scomparative lack oftechnological maturity.
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46
POWER DEVICES: SILICON AND WBG
GaN vs SiC * : Yole’s vision of WBG penetration in EV/HEV by 2020
GaN and SiChave
opportunities in different applications.
On-board charger topology (3 or 7kW)
The topology of on-board fast charger is similar to that of inverter: SiC possible
400V
Standard InverterTopology (generator)
400V
230V
Already SiC
SiC Possible
SiC Possible
GaN or SiCTransistor + SiC diode
GaN or SiCTransistor
LV-HV DC/DC converter topology
GaN or SiCTransistor + SiC diode
GaN Possible
DC/DC booster
SiC Possible
on-board
Wireless charger
* Our vision is based on the current status, the situation could evolve with further development.
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47
POWER DEVICES: SILICON AND WBG
Roadmap of implementation of SiC devices in EV/HEV
SiC diodes are already used in on-
board chargers. Full
SiCpowertrain solutions
require more maturity.
AC/DC
charger
DC/DC
Diode
Switch+
diode
AC/DC
DC/AC
Powertrain
Year
Power
2kW
3kW
7kW
55kW+
2015 2018 2023
Augmentation of
current capacity
900V/30A from Cree could be well-
positioned for this segment
Introduction of SiC components into
devices in EV/HEV (axes not in scale)Yole Développement
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48
POWER DEVICES: SILICON AND WBG
SiC component evaluation by Toyota
Test of SiCcomponents in hybrid vehicle and fuel cell bus.
• Project led by:Toyota (JP)
• Evaluation of the performance of SiC power semiconductors,which could lead to significant efficiency improvements inhybrids and other vehicles with electric powertrains.
• Goal: to assess the improvement in efficiency achieved by thenew SiC power semiconductors.
• Two types of testing vehicles:• Toyota Camry hybrid prototype
• Fuel cell bus
• Toyota Camry hybrid prototype:• SiC power semiconductors (transistors and diodes) installed in
the power control unit (PCU)’s internal voltage step-upconverter and the inverter that controls the motor.
• Fuel cell bus:• SiC diodes installed in the fuel cell voltage step-up converter,
which is used to control the voltage of electricity from the fuelcell stack.
• The bus is currently in regular commercial operation in ToyotaCity.
• The technologies behind these SiC power semiconductorswere developed in Japan jointly by:
• Toyota
• Denso Corporation
• Toyota Central R&D Labs., Inc.
• The SiC transistor is a trenched MOSFET manufactured witha 4-inch SiC wafer.
Toyota Camry hybrid prototype with
SiC components
SiC diode chips
SiC transistor chips
Toyota fuel cell bus with
SiC diodes
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POWER DEVICES: SILICON AND WBG
SiC devices add value in EV/HEV: Toyota’s vision
Toyota’s goal is 10% improvement in fuel efficiency and PCU downsizing of 80%. Over 5% fuel efficiency improvement was confirmed.
• According to Toyota, approximatively 20% of an HEV’s total electrical power loss is associated with powersemiconductors. SiC power devices allow increased fuel efficiency and reduced PCU size.
• Toyota’s goal is 10% improvement in fuel efficiency and PCU downsizing of 80%. Over 5% fuel efficiency improvementwas confirmed.
• They adopted a trench structure SiC device.
Courtesy of Toyota
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50
SIC & GAN POWER DEVICE MARKET
to 20201
The total WBG device
market is expected to catch up in EV/HEV in the coming
years
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51©2017 | www.yole.fr | Automotive World | [email protected]
CONCLUSION
• EV/HEV Market is promised to an important growth driven by CO2 reductionregulations
• Most of the challenges are beeing overcome maket this market become a reality
• With such an important growth, important technology evolutions are expected inthe field of:
• Power converters
• Power Modules
• Power Devices
• Cost, relibility and value proposition will be the path toward emergence of thesetechnologies.
• To catch EV/HEV business opportunities, the overall supply chain is reshaping withemergence of new players
53
Biography & contact
ABOUT THE AUTHOR
Pierric Gueguen
Dr. Pierric Gueguen is Business Unit Manager for power electronics and compound semiconductor activities at Yole Développement. He
has a PhD in micro- and nanoelectronics and a master’s degree in micro- and nanotechnologies for integrated circuits. He worked as a PhD
student at CEA-Leti in the field of 3D integration for integrated circuits and advanced packaging. He then joined Renault SAS, and worked
for four years as technical project manager in the company’s R&D division. During this time, he oversaw power electronic converters and
integration of wide band gap devices into electric vehicles. He is author and co-author of more than 20 technical papers and 15 patents.
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