2b - geh-6353b mk 5 lm panel manual

8/10/2019 2b - GEH-6353B MK 5 LM Panel Manual

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GEH-6353B

Instructions

MARK V LM

Panel Manual


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Copyright 1998 by General Electric Company, U.S.A.

All rights reserved.

Printed in the United States of America.February 25, 1998

ARCNET is a registered trademark of Datapoint Corporation.

Ethernet is a trademark of Xerox Corporation.

HP is a trademark of Hewlett Packard Company.

MODBUS is a trademark of Gould Inc.Proximitor is a registered trademark of Bentley Nevada Corporation.

Speedtronic is a trademark of General Electric Company, USA.

QNX is a registered trademark of Quantum Software Systems Ltd.


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Safety Symbol Legend

WARNING

Commands attention to an operating procedure, practice, condition or statement, which, if not strictly

observed, could result in personal injury or death.

CAUTION

Commands attention to an operating procedure, practice, condition or statement, which, if not strictlyobserved, could result in damage to or destruction of equipment.

Note

Commands attention to an essential operating or maintenance procedure, condition, or statement that

must be highlighted.


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WARNING

This equipment contains a potential hazard of electric shock or burn. Only personnel who are

adequately trained and thoroughly familiar with the equipment and the instructions should install,

operate, or maintain this equipment.

Isolation of test equipment from the equipment under test presents potential electrical hazards. If the test

equipment cannot be grounded to the equipment under test, the test equipments case must be shielded toprevent contact by personnel.

To minimize hazard of electrical shock or burn, approved grounding practices and procedures must be

strictly followed.

To prevent personal injury or equipment damage caused by equipment malfunction, only adequately trained

persons should modify any programmable machine.


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Safety Symbol Legend (cont.)


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Notes:


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Mark V LM Turbine Control Manual GEH-6353B

CHAPTER 1 OVERVIEW

1-1. DEFINITION AND SCOPE............ ............ ............ ............ ............ ............ ............ ............. .... ........... ............ ............ ........1-11-2. EQUIPMENT OVERVIEW ................................................................................................................................................1-1

1-2.1. Mark V LM Control Panel ............ ............. ............ ............ ............ ............ ............ ........... ............ ............ ............ ........1-1

1-2.2. Operator Interface ............ ............ ............ ............ ............ ............ ............. ............ .... ........... ............ ............ ............ .....1-3

1-2.3. Communications...........................................................................................................................................................1-

1-2.3.1 STAGE LINK.........................................................................................................................................................1-3

1-2.3.2. COREBUS. .............................................................................................................................................................1-4

1-2.3.3. IONET. ...................................................................................................................................................................1-4

1-2.3.4. THE ARCNET INTERFACE BOARD. .................................................................................................................1-5

1-3. RELATED DOCUMENTATION .......................................................................................................................................1-5

CHAPTER 2 RECEIVING, HANDLING, AND STORAGE

2-1. INTRODUCTION ...............................................................................................................................................................2-2-2. RECEIVING AND HANDLING ........................................................................................................................................2-

2-3. STORAGE...........................................................................................................................................................................2-1

2-4. UNPACKING......................................................................................................................................................................2-2

2-5. TIME LIMITATIONS.........................................................................................................................................................2-3

CHAPTER 3 INSTALLATION AND INITIAL POWERUP

3-1. INTRODUCTION ...............................................................................................................................................................3-

3-2. OPERATING ENVIRONMENT.........................................................................................................................................3-1

3-3. CABLING, WIRING, AND POWER SOURCES............ .......... ........... ........... .......... ........... .......... ........... ........... .......... ....3-2

3-3.1. Spacing .........................................................................................................................................................................3-2

3-3.2. Power Sources ..............................................................................................................................................................3-2

3-3.3. Equipment Grounding...................................................................................................................................................3-43-4. POWER-OFF CHECKS......................................................................................................................................................3-4

3-4.1. Control Panel Inspection............. ........... .......... ........... .......... ........... .......... ........... ..................... .......... ........... .......... ....3-4

3-4.2. Board Inspections .........................................................................................................................................................3-5

3-4.3. Wiring and Circuit Checks............... ........... .......... ........... .......... ........... .......... ........... ..................... ........... .......... .........3-5

3-5. CONTROL PANEL INITIAL ENERGIZATION .......... .......... ........... .......... ........... .......... ........... ........... ............. .......... ....3-6

3-6. OPERATOR INTERFACE INSTALLATION AND STARTUP ........... .......... ........... .......... ........... .......... ........... .............3-7

3-6.1 Equipment Overview .....................................................................................................................................................3-7

3-6.2 Installation and Initial Startup............ ........... ........... .......... ........... .......... ........... .......... ........... ........... .......... ........... .......3-8

3-7 CONTROL PROCESSOR STARTUP .................................................................................................................................3-8

3-7.1 Setting the Stage Link........... .......... ........... ........... .......... ........... .......... ........... .......... .................... .......... ........... .......... ..3-9

CHAPTER 4 FUNCTIONAL DESCRIPTION

4-1. INTRODUCTION ...............................................................................................................................................................4-

4-2. HARDWARE STRUCTURE ..............................................................................................................................................4-1

4-3. APPLICATION SOFTWARE STRUCTURE.......... .......... ........... ........... .......... ........... .......... ........... ...................... ...........4-3

4-3.1. Big Block System .........................................................................................................................................................4-3

4-4. CONTROLLER OPERATION............................................................................................................................................4-4

4-5. CORE CONNECTION DRAWINGS................. .......... ........... .......... ........... .......... ........... .......... ..................... .......... .........4-4


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GEH-6353B Mark V LM Turbine Control Manual

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CHAPTER 5 PRINTED WIRING BOARD DESCRIPTIONS AND INTERCONNECTIONS

5-1. INTRODUCTION .............................................................................................................................................................. 5-1

5-2. BOARD IDENTIFICATION.............................................................................................................................................. 5-15-3. INITIAL CONFIGURATION ............................................................................................................................................ 5-1

5-3.1. Initial Hardware Jumper Settings................................................................................................................................. 5-2

5-3.2. Adjusting Replacement Boards.................................................................................................................................... 5-2

5-3.3. I/O Board Software Configuration............................................................................................................................... 5-2

5-4. PRINTED WIRING BOARDS........................................................................................................................................... 5-3

5-4.1. DS200AAHA ARCNET Connection Board ............................................................................................................. 5-3

5-4.1.1. AAHA CONNECTORS........................................................................................................................................ 5-3

5-4.1.2. AAHA CONFIGURATION. ................................................................................................................................ 5-3

5-4.2. DS200PANA ARCNET No-LAN Driver Board ...................................................................................................... 5-3

5-4.2.1. PANA CONNECTORS. ....................................................................................................................................... 5-4

5-4.2.2. PANA CONFIGURATION.................................................................................................................................. 5-4

5-4.3. DS200STCA Turbine Communication Board .......................................................................................................... 5-4

5-4.3.1. STCA CONNECTORS......................................................................................................................................... 5-55-4.3.2. STCA CONFIGURATION................................................................................................................................... 5-5

5-4.3.3. STCA PULSE RATE INPUT CIRCUIT. ............................................................................................................. 5-5

5-4.3.4. STCA SYNCH CHECK CIRCUIT....................................................................................................................... 5-5

5-4.4. DS200TCCA COMMON ANALOG I/O BOARD................................................................................................... 5-5

5-4.4.1. TCCA CONNECTORS. ....................................................................................................................................... 5-6

5-4.4.2. TCCA CONFIGURATION. ................................................................................................................................. 5-6

5-4.4.3. TCCA 420 MA INPUT CIRCUIT. ..................................................................................................................... 5-6

5-4.4.4. TCCA 420 MA OUTPUT CIRCUIT. ................................................................................................................. 5-6

5-4.4.5. TCCA RTD CIRCUIT. ......................................................................................................................................... 5-6

5-4.4.6. TCCA THERMOCOUPLE CIRCUIT. ................................................................................................................. 5-6

5-4.4.7. TCCA SHAFT MONITORING............................................................................................................................ 5-6

5-4.5. DS200TCCB Common Extended Analog I/O Board.......... .......... ........... .......... ........... ........... .......... ............ .......... . 5-7

5-4.5.1. TCCB CONNECTORS......................................................................................................................................... 5-75-4.5.2. TCCB CONFIGURATION. ................................................................................................................................. 5-7

5-4.5.3. TCCB 420 MA INPUT CIRCUIT. ..................................................................................................................... 5-7

5-4.5.4. TCCB RTD CIRCUIT. ......................................................................................................................................... 5-7

5-4.5.4. TCCB GENERATOR AND BUS VOLTAGE, LINE CURRENT CIRCUITS............... .............. .............. ........ 5-7

5-4.6. DS200TCDA Digital I/O Board ............................................................................................................................... 5-8

5-4.6.1. TCDA CONNECTORS. ....................................................................................................................................... 5-8

5-4.6.2. TCDA CONFIGURATION. ................................................................................................................................. 5-8

5-4.6.3. TCDA CONTACT INPUT CIRCUITS. ............................................................................................................... 5-8

5-4.6.4. TCDA CONTACT OUTPUT (RELAY/SOLENOID) CIRCUITS. ..................................................................... 5-8

5-4.7. DS200TCEA Emergency Overspeed Board ............................................................................................................. 5-9

5-4.7.1. TCEA CONNECTORS......................................................................................................................................... 5-9

5-4.7.2. TCEA CONFIGURATION. ................................................................................................................................. 5-9

5-4.7.3. TCEA FLAME DETECTION CIRCUIT. .......................................................................................................... 5-105-4.7.4. TCEA TURBINE OVERSPEED CIRCUIT. ...................................................................................................... 5-10

5-4.7.5. TCEA AUTOMATIC SYNCHRONIZING CIRCUIT. ...................................................................................... 5-10

5-4.8. DS200TCEB Protective Termination Expander Board .......................................................................................... 5-10

5-4.8.1. TCEB CONNECTORS....................................................................................................................................... 5-11

5-4.8.2. TCEB CONFIGURATION................................................................................................................................. 5-11

5-4.8.3. TCEB PT AND CT CIRCUIT. ........................................................................................................................... 5-11

5-4.8.4. TCEB FLAME DETECTION CIRCUIT. ........................................................................................................... 5-11

5-4.8.5. TCEB EMERGENCY OVERSPEED CIRCUIT. ............................................................................................... 5-11


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5-4.9 DS200TCPD Power Distribution Module ........... ............ ............ ............ ............ ............ ............ ........... ............ ......5-11

5-4.9.1. TCPD CONNECTORS........................................................................................................................................5-12

5-4.9.2. TCPD CONFIGURATION. ................................................................................................................................5-12

5-4.9.3. TCPD SWITCHES. .............................................................................................................................................5-135-4.9.4. TCPD POWER. ...................................................................................................................................................5-13

5-4.10. DS200TCPS Power Supply Board........... ............ ............ ............ ............ ............ ............ ......... ............ ............ .....5-13

5-4.10.1. TCPS CONNECTORS. .....................................................................................................................................5-13

5-4.10.2. TCPS CONFIGURATION. ...............................................................................................................................5-13

5-4.11. DS200TCQA Analog I/O Board........... ............ ............ ............ ............ ............ ............ ........ ............ ............ .........5-14

5-4.11.1. TCQA CONNECTORS. ....................................................................................................................................5-14

5-4.11.2. TCQA CONFIGURATION. ..............................................................................................................................5-14

5-4.11.3. TCQA PULSE RATE INPUT CIRCUIT. .........................................................................................................5-14

5-4.11.4. TCQA 420 MA INPUT CIRCUITS. ...............................................................................................................5-14

5-4.11.5. TCQA 420 MA OUTPUT CIRCUIT. .............................................................................................................5-14

5-4.11.6. TCQA THERMOCOUPLE CIRCUIT. .............................................................................................................5-15

5-4.11.7. TCQA LVDT/R CIRCUIT. ...............................................................................................................................5-15

5-4.11.8. TCQA SEISMIC VIBRATION CIRCUIT. ........... ............ ............ ............ ............ ............ ............ ........... .........5-155-4.11.9. TCQA GENERATOR AND LINE CIRCUIT. ........... ............ ............ ............ ............. ............ ............ ............ ..5-15

5-4.12. DS200TCQC ANALOG I/O EXPANDER BOARD..............................................................................................5-15

5-4.12.1. TCQC CONNECTORS. ....................................................................................................................................5-16

5-4.12.2. TCQC CONFIGURATION. ..............................................................................................................................5-16

5-4.12.3. TCQC SERVO VALVE REGULATOR OUTPUT CIRCUIT. ............ ............ ............ ............ ............ ............ .5-16

5-4.12.4. TCQC PULSE RATE INPUT CIRCUIT. ........... ............ ............ ............ ............ ............ ............ .......... ............ .5-17

5-4.12.5. TCQC GENERATOR AND LINE FEEDBACK. ........... ............ ............ ............ ............. ............ ........... ..........5-17

5-4.12.6. TCQC IONET CIRCUIT. ..................................................................................................................................5-17

5-4.12.7. TCQC LVDT/LVDR EXCITATION CIRCUIT. ..............................................................................................5-17

5-4.12.8. TCQC 420 MA INPUT CIRCUITS. ...............................................................................................................5-17

5-4.13. DS200TCQE LM 6000 I/O Processor ........... ............ ............ ............. ............ ............ ............ ......... ............ ..........5-17

5-4.13.1. TCQE CONNECTORS. ....................................................................................................................................5-17

5-4.13.2. TCQE CONFIGURATION. ..............................................................................................................................5-185-4.13.3. TCQE LVDT/LVDR CIRCUIT............. ............. ............ ............ ............ ............ ............ ........ ........... ............ ....5-18

5-4.13.4. TCQE 420 MA OUTPUT CIRCUIT. ............ ............ ............ ............ ............ ............ ............. ........ ............ .....5-18

5-4.13.5. TCQE LM VIBRATION INPUTS. ...................................................................................................................5-18

5-4.13.6. TCQE PROXIMETER VIBRATION INPUTS. ............ ............ ............. ............ ............ ............ ........... ............5-18

5-4.13.7. TCQE RTD CIRCUIT. ......................................................................................................................................5-18

5-4.13.8. TCQE PULSE RATE CIRCUIT. ......................................................................................................................5-18

5-4.13.9. TCQE LP SHAFT SHEAR CIRCUIT. ............ ............ ............ ............ ............ ............ ............. ........ ............ .....5-18

5-4.13.10. TCQE LOAD COUPLING SHEAR CIRCUIT. ............ ............ ............ ............ ............ ............ ............ ..........5-18

5-4.14. DS200TCRA Relay Output Board........... ............ ............ ............ ............ ............ ............ ......... ............ ............ .....5-19

5-4.14.1. TCRA CONNECTORS. ....................................................................................................................................5-19

5-4.14.2. TCRA CONFIGURATION. ..............................................................................................................................5-20

5-4.14.3. TCRA CONTACT OUTPUT CIRCUIT. ..........................................................................................................5-20

5-4.15. DS200TCSA Fuel Skid Interface Board ............. ............ ............ ............ ............ ............ ........... ............. ............ ...5-205-4.15.1. TCSA CONNECTORS......................................................................................................................................5-20

5-4.15.2. TCSA CONFIGURATION................................................................................................................................5-20

5-4.15.3. TCSA PRESSURE TRANSDUCER INTERFACE. ............ ............ ............ ............ ............ ............ ............ .....5-20

5-4.16. DS200TCTG Turbine Trip Board .........................................................................................................................5-21

5-4.16.1. TCTG CONNECTORS. ....................................................................................................................................5-21

5-4.16.2. TCTG CONFIGURATION. ..............................................................................................................................5-21

5-4.16.3. TCTG ETR RELAY CIRCUIT. ........................................................................................................................5-21

5-4.16.4. TCTG PTR RELAY CIRCUIT. ........................................................................................................................5-22


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5-4.16.5. TCTG GENERATOR BREAKER CLOSE CIRCUIT. .................................................................................... 5-22

5-4.16.6. TCTG MANUAL AND EXTERNAL TRIP CIRCUIT.................................................................................... 5-22

5-4.17. DS200UCIA UC2000 Mother Board.................................................................................................................... 5-22

5-4.17.1. UCIA CONNECTORS. .................................................................................................................................... 5-235-4.17.2. UCIA CONFIGURATION. .............................................................................................................................. 5-23

5-4.17.3. UCIA PRESSURE TRANSDUCER INTERFACE CIRCUIT. ........................................................................ 5-23

5-4.17.4. UCIA PANA BOARD AND UCPB BOARD COMMUNICATION CIRCUIT. .............. ............... .............. .. 5-23

5-4.17.5. UCIA GENIUS I/O CIRCUIT. ......................................................................................................................... 5-23

5-4.18. DS200UCPB CPU Board ..................................................................................................................................... 5-24

5-4.18.1. UCPB CONTROL ENGINE. ........................................................................................................................... 5-24

5-4.18.1.1. UCPB Connectors. ..................................................................................................................................... 5-24

5-4.18.1.2. UCPB Configuration.................................................................................................................................. 5-24

5-4.18.2. UCPB I/O ENGINE. ......................................................................................................................................... 5-24

5-4.18.2.1. UCPB Connectors. ..................................................................................................................................... 5-25

5-4.18.2.2. UCPB Configuration.................................................................................................................................. 5-25

5-5. PRINTED WIRING TERMINAL BOARDS ................................................................................................................... 5-25

5-5.1. DS200CTBA -Termination Module .......................................................................................................................... 5-255-5.1.1. CTBA CONNECTIONS..................................................................................................................................... 5-26

5-5.1.2. CTBA HARDWARE CONFIGURATION. ....................................................................................................... 5-26

5-5.2. DS200DTBA Contact Input Termination Module ............ ............ ............ ............ ............ ............ ............... ........... 5-26

5-5.2.1. DTBA CONNECTIONS..................................................................................................................................... 5-26

5-5.2.2. DTBA HARDWARE CONFIGURATION. ....................................................................................................... 5-26

5-5.3. DS200DTBB Contact Input Expansion Termination Module ........... ............ ............ ............ ............ .................. ... 5-27

5-5.3.1. DTBB CONNECTORS. ..................................................................................................................................... 5-27

5-5.3.2. DTBB HARDWARE CONFIGURATION. ....................................................................................................... 5-27

5-5.4. DS200DTBC Contact Output Termination Module ............................................................................................... 5-27

5-5.4.1. DTBC CONNECTORS. ..................................................................................................................................... 5-27

5-5.4.2. DTBC HARDWARE CONFIGURATION. ....................................................................................................... 5-27

5-5.5. DS200DTBD Contact Output Expansion Termination Module.............. ............ ............ ............ ............ ................ 5-28

5-5.5.1. DTBD CONNECTORS. ..................................................................................................................................... 5-285-5.5.2. DTBD HARDWARE CONFIGURATION. ....................................................................................................... 5-28

5-5.6. DS200PTBA Protection Termination Module ........... ............ ............. ............ ............ ............ ............. ............ ....... 5-28

5-5.6.1. PTBA CONNECTORS....................................................................................................................................... 5-29

5-5.6.2. PTBA HARDWARE CONFIGURATION. ........................................................................................................ 5-29

5-5.7. DS200QTBA Termination Module................ ............ ............ ............ ............ ............ ............ ......... ............ ............ 5-29

5-5.7.1. QTBA CONNECTIONS..................................................................................................................................... 5-29

5-5.7.2. QTBA HARDWARE CONFIGURATION. ....................................................................................................... 5-30

5-5.8. DS200TBCA Termination Module RTD Inputs ..................................................................................................... 5-30

5-5.8.1. TBCA CONNECTIONS..................................................................................................................................... 5-30

5-5.8.2. TBCA HARDWARE CONFIGURATION. ....................................................................................................... 5-30

5-5.9. DS200TBCB Termination Module RTD and 420 mA Input ............ ............ ............ ............ ............ ................. ... 5-30

5-5.9.1. TBCB CONNECTIONS. .................................................................................................................................... 5-30

5-5.9.2. TBCB HARDWARE CONFIGURATION......................................................................................................... 5-305-5.10. DS200TBQA Thermocouple Termination Module .............................................................................................. 5-31

5-5.10.1. TBQA CONNECTIONS................................................................................................................................... 5-31

5-5.10.2. TBQA HARDWARE CONFIGURATION. ..................................................................................................... 5-31

5-5.11. DS200TBQB Input Termination Module ............................................................................................................. 5-31

5-5.11.1. TBQB CONNECTIONS................................................................................................................................... 5-31

5-5.11.2. TBQB HARDWARE CONFIGURATION. ..................................................................................................... 5-32

5-5.12. DS200TBQC Analog Input, Milliamp Input/Output Termination Module............ ............... .............. ........... ....... 5-32

5-5.12.1. TBQC CONNECTIONS................................................................................................................................... 5-32


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5-5.12.2. TBQC HARDWARE CONFIGURATION. ......................................................................................................5-32

5-5.13. DS200TBQE LM6000 Analog Termination Module ............ ............ ............ ............ ............ ............ ............... .....5-33

5-5.12.1. TBQE CONNECTIONS....................................................................................................................................5-33

5-5.13.2. TBQE HARDWARE CONFIGURATION. ......................................................................................................5-335-6. TERMINAL BOARDS......................................................................................................................................................5-33

5-6.1. TB1 .............................................................................................................................................................................5-3

5-6.2. TB2 .............................................................................................................................................................................5-3

5-6.3. TB3 .............................................................................................................................................................................5-3

5-6.4. 1TB.............................................................................................................................................................................5-3

CHAPTER 6 GENERAL INPUT AND OUTPUT CAPACITIES AND SPECIFICATIONS

6-1. CONTACT INPUTS ...........................................................................................................................................................6-1

6-2. CONTACT and SOLENOID OUTPUTS............................................................................................................................6-1

6-3. THERMOCOUPLE INPUTS..............................................................................................................................................6-2

6-4. RESISTANCE TEMPERATURE DEVICE (RTD) INPUTS .............................................................................................6-3

6-5. SEISMIC (VELOCITY) VIBRATION MEASUREMENT DEVICE INPUTS .......... ........... ........... .......... ........... .......... ...6-46-6. PROXIMITY TRANSDUCER INPUTS........... ............ ............ ............ ............ ............ ............ ........... ........... ............. .......6-4

6-7. FLAME DETECTOR INPUTS...........................................................................................................................................6-4

6-8. PULSE RATE INPUTS.......................................................................................................................................................6-5

6-9. LVDT/LVDR POSITION FEEDBACK INPUTS ........... ............ ............ ............ ............. ............ ............ ........ ............ .......6-5

6-10. SERVO VALVE OUTPUTS .............................................................................................................................................6-6

6-11. ANALOG VOLTAGE AND CURRENT INPUTS AND OUTPUTS ..............................................................................6-6

CHAPTER 7 APPLICATION SPECIFIC FUNCTIONS

7-1. PULSE RATE INPUTS.......................................................................................................................................................7-1

7-2. THE MASTER TRIP CIRCUIT AND THE PROTECTION CORE ..................................................................................7-1

7-2.1. The Trip Board: TCTG.................................................................................................................................................7-4

7-3. SETTING THE PRIMARY AND EMERGENCY OVERSPEED TRIP SETPOINTS ............. .............. ............... ............7-57-3.1. Primary Overspeed Protection ............ ............ ............ ............ ............ ............ ............ ........ ............ ............ ............ ......7-5

7-3.2. Emergency Overspeed Protection........... ............ ............. ............ ............ ............ ............ ......... ............ ............ ............7-6

7-4. SERVO VALVE DRIVE SYSTEM....................................................................................................................................7-6

7-4.1. The Servo Valve ...........................................................................................................................................................7-6

7-4.2. Regulator Feedback Devices.................. ............ ............ ............ ............ ............ ............ ....... ............ ............ ............ ....7-7

7-4.2.1. LVDT OR LVDR POSITION FEEDBACK. ........................................................................................................7-7

7-4.2.2. PRESSURE FEEDBACK......................................................................................................................................7-7

7-5. FLAME DETECTION ........................................................................................................................................................7-7

7-6. VIBRATION MEASUREMENT AND PROTECTION ............ ............. ............ ............ ............ ............ ............ ............ ....7-8

7-6.1. Seismic (Velocity) Sensors ............ ............ ............ ............ ............ ............ ............. ........ ............. ............ ............ .........7-8

7-6.1.1. CONFIGURING SEISMIC VIBRATION PICKUPS IN THE MARK V LM............... .............. ............... ..........7-9

7-6.2. Accelerometer Inputs ............ ............ ............ ............ ............ ............ ............ ............ ..... ............ ............ ............ ...........7-9

7-6.3. Proximity Transducer Inputs....... ............ ............. ............ ............ ............ ............ ............ ........... ............ ............. .........7-97-7. SHAFT VOLTAGE AND CURRENT MONITOR INPUTS ...........................................................................................7-11

CHAPTER 8 TROUBLESHOOTING

8-1. INTRODUCTION ...............................................................................................................................................................8-

8-2. GENERAL TROUBLESHOOTING ...................................................................................................................................8-2

8-3. I/O CORE TROUBLESHOOTING.....................................................................................................................................8-3

8-3.1. TIMN (Terminal Interface Monitor).......... .......... ........... .......... ........... .......... ........... .......... .............. ........... .......... .......8-4


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8-3.1.1. CHECKING THE PROM REVISION LEVEL(S) OF THE BOARD(S) WITH THE LOWEST I/O STATUS. 8-5

8-3.2 Checking I/O Board Ionet Termination Resistor and Address Hardware Jumpers ............. .............. .............. .......... .... 8-7

8-4. TROUBLESHOOTING WITH THE OPERATOR INTERFACE ..................................................................................... 8-7

8-4.1 Diagnostic Alarm Display............................................................................................................................................. 8-8

CHAPTER 9 PARTS REPLACEMENT

9-1. INTRODUCTION .............................................................................................................................................................. 9-1

9-2. REPLACING BOARDS..................................................................................................................................................... 9-1

9-3. REPLACING EPROMS..................................................................................................................................................... 9-2

9-4. PREVENTATIVE MAINTENANCE ................................................................................................................................ 9-3

9-5. RENEWAL PARTS............................................................................................................................................................ 9-4

9-5.1 Part Numbers ................................................................................................................................................................ 9-5

CHAPTER 10 STAGE LINK CONFIGURATIONS

10-1. OVERVIEW ................................................................................................................................................................... 10-110-2. INTRODUCTION .......................................................................................................................................................... 10-1

10-2.1. Terms of Reference.................................................................................................................................................. 10-1

10-3. STAGE LINK CHARACTERISTICS ............................................................................................................................ 10-1

10-3.1. The Mark V LM Panel ............................................................................................................................................ 10-2

10-3.2. The Operator Interface ............................................................................................................................................. 10-2

10-4. CABLE RECOMMENDATIONS .................................................................................................................................. 10-3

10-5. STAGE LINK RULES.................................................................................................................................................... 10-4

10-6. SEGMENT RULES........................................................................................................................................................ 10-4

10-7. TOTAL EFFECTIVE DISTANCE RULES ................................................................................................................... 10-6

10-8. EXAMPLES ................................................................................................................................................................... 10-6

10-8.1. Example 1: A Simple Plant Application .................................................................................................................. 10-6

10-8.3. Example 2: Complex Plant Application.......... ........... .......... ........... .......... ........... .......... .......................... .......... ...... 10-7

10-9. FIBER OPTICS .............................................................................................................................................................. 10-810-9.1. Advantages............................................................................................................................................................... 10-8

10-9.2. Disadvantages .......................................................................................................................................................... 10-9

10-9.3. Review of Components............................................................................................................................................ 10-9

10-9.3.1. BASICS. ........................................................................................................................................................... 10-9

10-9.3.2. CABLE. .......................................................................................................................................................... 10-10

10-9.3.3. HUBS.............................................................................................................................................................. 10-10

10-9.3.4. CONNECTORS. ............................................................................................................................................. 10-10

10-9.4. System Considerations........................................................................................................................................... 10-11

10-9.5. Installation ............................................................................................................................................................. 10-11

10-9.6. Specifications......................................................................................................................................................... 10-11

10-9.6.1. FOUR FIBER CABLE WITHOUT ARMOR................................................................................................. 10-12

10-9.6.2. FOUR FIBER CABLE WITH ARMOR. ........................................................................................................ 10-13

10-9.6.3. FIBER OPTIC HUB. ...................................................................................................................................... 10-1410-9.6.4. FIBER OPTIC CONNECTORS. .................................................................................................................... 10-14

10-10. TYPICAL STAGE LINK ADDRESSES.................................................................................................................... 10-14

APPENDIX A HARDWARE JUMPERS

A-1. INTRODUCTION............................................................................................................................................................A-1

A-1.1. Table Formatting............ ........... ........... .......... ........... .......... ........... .......... ........... .................. ........... .......... ........... ......A-1

A-1.2. Hardware Jumper Configurations.............. ........... .......... ........... .......... ........... .......... ........... ........... ........... .......... ........A-2


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APPENDIX B HARDWARE DOCUMENTS

APPENDIX C POWER DISTRIBUTION CORE DIAGRAMS

C-1. INTRODUCTION AND APPLICATION NOTES ...........................................................................................................C-1

C-2. SPECIAL USE CONTACT OUTPUTS AND RELATED COMPONENTS ............ ............. ............ ............ ............ ....... C-6

APPENDIX D SIGNAL FLOW DIAGRAMS

D-1. DEFINITIONS OF ABBREVIATIONS............ ............ ............ ............ ............ ............ ............ ......... ............ ............. ......D-2

D-2. SIGNAL FLOW DIAGRAMS........... ............. ............ ............ ............ ............ ............ ............ ..... ............ ............ ............. .D-3

APPENDIX E FUSE RATINGS

E-1. POWER DISTRIBUTION - TCPD ................................................................................................................................... E-1

E-2. POWER SUPPLY - TCPS ................................................................................................................................................. E-2E-3. POWER SUPPLY - TCEA ................................................................................................................................................ E-2


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Figure 1-1. Mark V LM Panel Layout............................................................................................................................................ 1-2

Figure 1-2. Three Port Active Repeater ......................................................................................................................................... 1-4

Figure 5-1. Sample board part number, DS series.............. ............ ............ ............ ............ ............. ............ ............ ............ ......... 5-35

Figure 5-2. AAHA board layout................................................................................................................................................... 5-36Figure 5-3. PANA board layout ................................................................................................................................................... 5-37

Figure 5-4. STCA board layout .................................................................................................................................................... 5-38

Figure 5-5. TCCA board layout. .................................................................................................................................................. 5-39

Figure 5-6. TCCB board layout.................................................................................................................................................... 5-40

Figure 5-7. TCDA board layout. .................................................................................................................................................. 5-41

Figure 5-8. TCEA board layout.................................................................................................................................................... 5-42

Figure 5-9. TCEB board layout. ................................................................................................................................................... 5-43

Figure 5-10. TCPD board layout.................................................................................................................................................. 5-44

Figure 5-11. TCPS board layout. ................................................................................................................................................. 5-45

Figure 5-12. TCQA board layout. ................................................................................................................................................ 5-46

Figure 5-13. TCQC board layout. ............................................................................................................................................... 5-47

Figure 5-14. TCQE board layout.................................................................................................................................................. 5-48

Figure 5-15. TCRA board layout. ................................................................................................................................................ 5-49Figure 5-16. TCSA board layout. ................................................................................................................................................. 5-50

Figure 5-17. TCTG board layout.................................................................................................................................................. 5-51

Figure 5-18. UCIA board layout. ................................................................................................................................................. 5-52

Figure 5-19. UCPB board layout.................................................................................................................................................. 5-53

Figure 5-20. CTBA terminal board layout. .................................................................................................................................. 5-54

Figure 5-21. DTBA terminal board layout. .................................................................................................................................. 5-54

Figure 5-22. DTBB terminal board layout. .................................................................................................................................. 5-54

Figure 5-23. DTBC terminal board layout. .................................................................................................................................. 5-55

Figure 5-24. DTBD terminal board layout. .................................................................................................................................. 5-55

Figure 5-25. PTBA terminal board layout............ .......... ........... ........... .......... ........... .......... ........... ............ ........... .......... ........... .. 5-55

Figure 5-26. QTBA terminal board layout. .................................................................................................................................. 5-56

Figure 5-27. TBCA terminal board layout. .................................................................................................................................. 5-56

Figure 5-28. TBCB terminal board layout. .................................................................................................................................. 5-56Figure 5-29. TBQA terminal board. ............................................................................................................................................. 5-57

Figure 5-30. TBQB terminal board layout. .................................................................................................................................. 5-57

Figure 5-31. TBQC terminal board layout. .................................................................................................................................. 5-57

Figure 5-32. TBQE terminal board layout. .................................................................................................................................. 5-58

Figure 7-1. Simplified Block Diagram - TCEA Boards ........... ............ ............ ............ ............ ............. ............. ............ ............ .... 7-3

Figure 8-1. Pinout connections for DB-9 TIMN Interface Cable ............. ............ ............ ............ ............ ................. ............. ........ 8-4

Figure A-1. Table Formatting.................. ............ ............ ............ ............. ............ ............ ....... ........... ............. ............ ............ .......A-1

Figure A-2. Feedback Resistors ........... ............ ............ ............ ............ ............ ............ ............. ........... ............ ............ ............ ....A-11

Figure A-3. Feedback Jumpers........ ............ ............ ............ ............ ............ ............ ............ ...... ........... ............ ............ ............ ....A-11

Figure B-1. Hardware document example Panel Layout.............. ............ ............ ............ ............ ............... ............ ............ ........B-2

Figure B-2. Hardware document example core. ............ ............ ............ ............ ............ ............ .............. ............ ............ ..B-3

Figure B-3. Hardware document example core. ............ ............ ............ ............ ............ ............ .............. ............ ............ ..B-4

Figure B-4. Hardware document example core. ............ ............ ............ ............ ............ ............ .............. ............ ............ ..B-5Figure B-5. Hardware document example core. ............. ............ ............ ............ ............ ............ ............. ............ ............ ....B-6

Figure B-6. Hardware document example core. ................................................................................................................B-7

Figure B-7. Hardware document example core. ................................................................................................................B-8

Figure B-8. Hardware document example core. .......... .......... ........... ........... .......... ........... .......... ............ ........... .......... .....B-9

Figure B-9. Hardware document example core.............................................................................................................B-10

Figure B-10. Hardware document example core.............. ........... .......... ........... .......... ........... .................. ........... .......... .B-11

Figure C-1. Core Incoming AC & DC Circuits................ ........... .......... ........... .......... ........... ........................... .......... .......... C-2

Figure C-2. Core DC Power Distribution .......... .......... ........... .......... ........... .......... ........... ......................... ........... .......... .....C-3

Figure C-3. Core AC Power Distribution .......... .......... ........... .......... ........... .......... ........... ......................... ........... .......... .....C-4


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Figure C-4. Contact Output 16 Circuit ............ ............ ............. ............ ............ ............ ............ ........ ............ ............ ............ .......... C-6

Figure C-5. Contact Ouput 17 Circuit ............ ............ ............ ............ ............ ............ ............ ........ ............ ............ ............ ............ C-7

Figure C-6. Contact Output 18 Circuit ............ ............ ............. ............ ............ ............ ............ ........ ............ ............ ............ .......... C-8

Figure D-1. Milliamp Input Connection Examples and Notes ............ ............ ............ ............ ............. ................ ............ ............ ..D-8Figure D-2. core Stage Link connections AAHA/UCPB ........... ............ ............. ............ ............ ............... ............ ............ .D-9

Figure D-3. core COREBUS connections AAHA/PANA............... ............ ............ ............ ............ ............... ............ .......D-10

Figure D-4. core RTD inputs TBQE/TCQE ...................................................................................................................D-11

Figure D-5. core Pulse Rate inputs on TBQE ............. ............ ............ ............ ............ ............ ............ ............ ............. ...D-13

Figure D-6. core LVDT/R excitation and feedback signal on QTBA/TBQE .............. .............. .............. .......... ............ .D-14

Figure D-7. core 420/200 mA outputs on TBQE ............. ............ ............ ............ ............ .............. ............ ............ ....D-15

Figure D-8. core Vibration Inputs on TBQE........... ............ ............ ............ ............ ............ ............ ............. ............ .......D-17

Figure D-9. core Proximity Transducer inputs on TBQE ........... ............ ............ ............ ............ ................. ............ .......D-18

Figure D-10. core Proximity Transducer inputs on TBQE ............. ............ ............ ............ ............ ................. ............ ...D-19

Figure D-11. core Proximity Transducer inputs on TBQE ............. ............ ............ ............ ............ ................. ............ ...D-20

Figure D-12. , and cores 420 mA inputs on TBQC............. .............. .............. .............. .... .......... .......... .D-21

Figure D-13. , and cores LVDT/R excitation and feedback on QTBA/TBQC ............. .............. .............. ...D-22

Figure D-14. , and cores LVDT/R excitation and feedback on QTBA/TBQC ............. .............. .............. ...D-23Figure D-15. , and cores Servo outputs on QTBA/TCQC ............... .............. .............. .............. .... ............ ..D-24

Figure D-16. , and cores Servo outputs on QTBA/TCQC ............... .............. .............. .............. .... ............ ..D-24

Figure D-17. , and cores Thermocouple inputs on TBQA .............. ............... .............. .............. .... ............ ..D-25

Figure D-18. , and cores MegaWatt Transducer inputs on QTBA.............. .............. .............. ......... ........... .D-26

Figure D-19. , and cores - Pulse Rate inputs on QTBA............. .............. .............. .............. ..... ........... .......... .D-28

Figure D-20. , and cores Pulse Rate inputs on QTBA .............. .............. .............. .............. .... .......... .......... .D-29

Figure D-21. , and cores 420 mA outputs on TBQC............... .............. .............. .............. ... .......... ........D-30

Figure D-22. , and cores TIMN monitor and IONET connections on QTBA............. .............. ............... ....D-31

Figure D-23. , and cores Power Supply monitoring................... .............. .............. .............. .. ........... .......... .D-32

Figure D-24. and cores Vibration inputs on TBQB .......... ........... .......... ........... .......... ........... ............... .......... ......D-33

Figure D-25. and cores Analog Current and Voltage inputs on TBQB.............. .............. .............. ........ ............ ...D-34

Figure D-26. and cores Compressor Stall Detector/milliamp input on TBQB..................... ............... ........... .......D-35

Figure D-27. core 420 mA inputs on CTBA ............. ............ ............ ............ ............ ............ ............ ............ ............D-36Figure D-28. core 420 mA inputs on TBCB ............. ............ ............ ............ ............ ............ ............ ............ ............D-37

Figure D-29. core 01 and 420 mA inputs on TBCB ........... ............. ............ ............ ............ .............. ............ ............ .D-38

Figure D-30. core Thermocouple inputs on TBQA/TCCA ........... ............ ............ ............ ............ ................. ............ .....D-39



Figure D-33. core RTD inputs on TBCA/TCCA ........... ............ ............ ............ ............ ............ ............. ............ ............D-43

Figure D-34. core RTD inputs on TBCA/TCCA ............ ............ ............ ............ ............ ............ ............. ............ ..........D-44

Figure D-35. core RTD inputs on TBCB/TCCB............ ............ ............ ............ ............ ............ ............. ............ ............D-45

Figure D-36. core 420 mA outputs on CTBA ............ ............ ............ ............. ............ ............ ............ ............ ............D-46

Figure D-37. core Shaft Voltage monitoring on CTBA ........... ............ ............ ............ ............ ................ ............ ...........D-47

Figure D-38. core TIMN monitor and IONET connection on CTBA............. .............. .............. .............. ..... ........... ......D-48

Figure D-39. core COREBUS connection on CTBA ........... ............ ............ ............ ............ ............. ............. ............ .....D-49

Figure D-40. and cores Ignition Transformer on DTBD ............ ............... .............. .............. ...... .......... .......... .D-50Figure D-41. and cores Digital inputs on DTBA .......... ........... .......... ........... .......... ........... ............... .......... ......D-51

Figure D-42. and cores Digital inputs on DTBB .......... ........... .......... ........... .......... ........... ............... .......... ......D-52

Figure D-43. and cores Relay outputs on DTBC .......... ........... .......... ........... ........... .......... ............... .......... ......D-53

Figure D-44. and cores Relay outputs on DTBD.......... ........... .......... ........... ........... .......... ............... .......... ......D-54

Figure D-45. core Emergency Trip Pushbutton connections on PTBA.............. .............. .............. .............. ........... ........D-56

Figure D-46. core Circuit breaker (52G) close circuit ............ ............ ............ ............ ............ ................. ............ ............D-57

Figure D-47. core Emergency Trip circuit ............ ............ ............ ............. ............ ............ ............ ............ ............ .........D-58

Figure D-48. core Overspeed magnetic pick ups on PTBA........... ............ ............ ............ ............ ................. ............ .....D-59


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Figure D-49. core Flame intensity inputs on PTBA ............. ............ ............ ............ ............ ............... ............ ............ ....D-60

Figure D-50. core Bus Generator PT and CT inputs on PTBA ............. .............. .............. .............. ........ ......... ........... ....D-60

Figure D-51. core Alarm Horn circuit and Bus Generator continued ............. .............. ............... ............. .......... ........... ..D-61

Figure D-52. core Generator Voltage and Current signal interface ............ ............... .............. .............. .......... .......... ......D-62Figure D-53. Mark V LM Synchronize.......... .......... ........... .......... ........... .......... ........... .......... ....................... .......... ........... .........D-63


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Table 3-1. Power Source Requirements ............ ............ ............ ............ ............ ............. ............ ........ ............ ............ ............ .........3-2

Table 3-2. Power Supply Voltages and Test Points ........... ............ ............ ............ ............ ............ ............. ............ ............ ............3-7

Table 3-3. Stage Link Values............ ............ ............. ............ ............ ............ ............ ............ ..... ............ ............ ............ ............ ....3-9

Table 6-1. Contact Inputs............ ............ ............ ............. ............ ............ ............ ............ .... ........... ............ ............ ............ ............6-1Table 6-2. Contact Outputs .............................................................................................................................................................6-2

Table 6-3. Electromechanical Relay Contacts.......... ............ ............ ............ ............ ............ ............ ........... ............ ............. ...........6-2

Table 6-4. Thermocouple Inputs ............ ............ ............ ............ ............ ............. ............ ........... ............ ............ ............. ............ ....6-3

Table 6-5. Thermocouple Ranges ...................................................................................................................................................6-3

Table 6-6. RTD Inputs ....................................................................................................................................................................6-3

Table 6-7. RTD Statistics.............. ............ ............ ............. ............ ............ ............ ............ ... ............ ............ ............ ............ ..........6-4

Table 6-8. Seismic Vibration Measurement Device Inputs............ ............ ............ ............ ............. ............... ............ ............ .........6-4

Table 6-9. Proximity Transducer Inputs......... ............. ............ ............ ............ ............ ............ ......... ............ ............ ............ ...........6-4

Table 6-10. Flame Detector Inputs................ ............ ............ ............ ............ ............. ............ ...... ............ ............ ............. ............ ..6-4

Table 6-11. Pulse Rate Inputs .........................................................................................................................................................6-5

Table 6-12. LVDT/LVDR Position Feedback Inputs................. ............ ............ ............ ............ ............ ............ ............ ............ .....6-5

Table 6-13. Servo Valve Outputs ........... ............ ............ ............ ............ ............ ............ ............ ............ ............ ............. ............ ....6-6

Table 6-14. Analog Voltage and Current Inputs and Outputs ........... ............ ............. ............ ............ ................ ............ ............ .....6-7Table 7-1. Solenoid Output ............. ............ ............ ............ ............ ............ ............ ............ .... ............ ............ ............ ............ ........7-4

Table 8-1. General Troubleshooting Chart. ............ ............ ............ ............ ............ ............ ............ ........... ............ ............ ............ .8-3

Table 8-2. TIMN I/O Status Cfg Stat Column Codes. ............ ............ ............ ............. ............ ............ ............ ............ ............. ......8-5

Table 8-3. Mark V LM Board I/O State and Status Meanings. ............ ............ ............ ............ ............ ................ ............ ............ ...8-6

Table 101. Stage Link Addresses ............ ............ ............. ............ ............ ............ ............ ......... ........... ............ ............ ............ .10-15

Table A-1. X, Y, Z Card Definition Determined According to Binary Summation............... .............. .............. ........ .......... .......... A-8

Table A-2. Binary Values for J28 and J29 .......... .......... ........... .......... ........... ........... .......... ........... ........... ........... .......... ........... ......A-9

Table A-3. Feedback Resistors ....................................................................................................................................................A-11

Table A-4. Feedback Resistors and Jumpers (RF) ........................................................................................................................A-11

Table C-1. DC Distribution............................................................................................................................................................C-5

Table C-2. DC Distribution............................................................................................................................................................C-5

Table C-3. AC Distribution............................................................................................................................................................C-5


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1-1

CHAPTER 1

OVERVIEW

1-1. DEFINITION AND SCOPE

This manual provides information about the Mark V LM turbine control panel. The information includes receiving and handling

of the panel, installation of the panel, a summary of its basic operations, a description of the printed wiring boards, applications

and specifications of the I/O, and information on renewal parts and troubleshooting.

1-2. EQUIPMENT OVERVIEW

This section provides a basic overview of the equipment involved with the Mark V LM control panel. These include

communications, the operator interface, and the control panel itself.

1-2.1. Mark V LM Control Panel

GE Turbine Control Systems have been produced for several decades and have enjoyed widespread acceptance in both new unit

and retrofit applications. The Mark V LM represents the latest in a line of microprocessor-based turbine control systems designed

specifically for controlling turbines. The Mark V LM is used on aero-derivative gas turbines.

Unit control and protection is accomplished by using the Mark V LM in combination with sensors and devices mounted on the

unit and its auxiliaries.

Printed wiring boards and terminal boards in a Mark V LM control panel are contained in or are mounted on cores. Cores are

sheetmetal housings that can have stationary and movable printed circuit board holders called card carriers. The cores have a

maximum of five printed circuit boards mounted on the card carriers. In addition, up to four I/O terminal boards can be mounted

on a single core. The combination of boards contained in each core is dependent on the application.

The control panel consists of a single control processor, known as . This control processor also functions as a communicator

processor. Other cores which make up a typical Mark V LM control panel include a protective core, ; a power distribution

core, ; control processor I/O cores, , , , and ; and digital I/O cores, and . (See Figure 1

- 1.).


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1-2

MARK V LM PANEL LAYOUT

Mark V LM

I/O CONTROL

1-STCA/UCPB

2-TCQA

3-open

4-TCQC5-TCPS

6-QTBA

7-TBQB

8-TB3

9-TBQC

I/O CONTROL

1-STCA/UCPB

2-TCQA

3-TCQE

4-TCQC5-TCPS

6-QTBA

7-TBQE

8-TBQA

9-TBQC

I/O CONTROL

1-STCA/UCPB

2-TCCA

3-TCCB

4-open5-TCPS

6-CTBA

7-TBCB

8-TBQA

9-TBCA

CONTROLLER

1-UCIA/UCPB/PANA

2-TCSA

3-open

4-open

5-TCPS

6-AAHA1

6-AAHA2

6-COM1,COM2,GENIUS

PROTECTIVE

1-TCEA

2-TCEB

3-TCEA

4-TCTG

5-TCEA

6-PTBA

POWER

DISTRIBUTION

1-TCPD

I/O CONTROL

1-STCA/UCPB

2-TCQA

3-open

4-TCQC

5-TCPS

6-QTBA

7-TBQB

8-open

9-TBQC

DIGITAL I/O

1-TCDA

2-open

3-open

4-TCRA

5-TCRA

6-DTBA

7-DTBB

8-DTBC

9-DTBD

DIGITAL I/O

1-TCDA

2-open

3-open

4-TCRA

5-TCRA

6-DTBA

7-DTBB

8-DTBC

9-DTBD

Stagelink

to

COREBUS(Arcnet)

IONETIONET

3PL

3PL 3PL 3PL

Figure 1-1. Mark V LM Panel Layout


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1-3

1-2.2. Operator Interface

The primary operator interface consists of a color monitor, keyboard, cursor positioning device (CPD), printer(s), and central

processing unit (CPU). The interface is connected to the Mark V LM control panel via an ARCNET cable. The devices can be

located in the installations central control room or a turbines control compartment.

One operator interface can be used to control multiple turbines; also more than one operator interface may be used to control a

single turbine. The operator can thereby select the units he wishes to monitor or issue commands to. All operator interfaces arecapable of issuing commands to a unit at any time while communicating with Mark V LM control panels. For the purposes of this

manual, it is assumed that the operator interface is controlling a single turbine and driven device.

Using the operator interface, commands may be issued to the turbine and driven device (for example, START, STOP,

COOLDOWN ON, AUTO, RAISE SPEED/LOAD, and so on) and displays may be accessed to view the status of the turbine and

driven device (for example, ALARMS, WHEELSPACE TEMPERATURES, VIBRATION FEEDBACK, and so on). The

associated printer(s) enable the operator to manually select and copy any display, to automatically log selected parameters, and to

log alarms.

The operator interface performs no control or protection functions of the turbine and driven device; it is a means of issuing

commands to the Mark V LM control panel and monitoring unit operation. Turning the operator interface off, turning the

computer on, re-booting the computer, or disconnecting or reconnecting the ARCNET cable linking the Mark V LM control panel

and the operator interface (while the turbine and driven device are operating) will have no effect on the Mark V LM control panelor unit operation.

1-2.3. Communications

Information is communicated, shared, and acted upon in the Mark V LM Control System via three separate networks. The one

external network, the Stage Link, is the primary means of communication between the operator interface and the Control Engine

located in the core of the control panel. This link uses ARCNET configuration.

The COREBUS is a separate ARCNET communication network internal to the Mark V LM control panel. The function of the

COREBUS is to provide a communication link between the I/O control processors (, , , ) and the Control

Engine ().

The third internal network is known as the I/O network (IONET). The IONET is a serial communications network that is

connected in a daisy chain configuration. The purpose of the IONET is to transfer signals from the digital I/O cores (,

) and the protective core () to the I/O control processors. There are two separate IONETs, one connecting and

and one connecting , , and (see Figure 1-1.).

1-2.3.1 STAGE LINK. The Stage Link consists of a coax cable that is terminated at both ends with BNC connectors. It runs from

the ARCNET interface board in the operator interface, to in the control panel. The ARCNET interface board is a high

impedance source that enables the operator interface to communicate on the Stage Link. Connection to the Stage Link hardware

requires the use of a "T" type BNC connector. This device also permits the Stage Link to continue to further processors on the

network. It is necessary to terminate the cable of the last operator interface on the link with a 93 ohm termination resistor on the

open connection of the "T" type BNC connector. See Chapter 10 of this manual for connectivity rules.

The Stage Link connection on the core is an active three port repeater (see Figure 1-2). This device consists of three ports(two external and one internal). The internal port communicates from the processor to the external ports. Either external port

receives a signal, amplifies it, and then passes it to the core and the other external port. Similarly, a signal originating in the

core is amplified and sent out both external ports. In the event of interrupted power to the repeater, a bypass relay provides

continuation of the Stage Link.

Loss of the core results in a loss of communication between the control panel and the affected operator interfaces on the

Stage Link. Due to the three port repeater design of , the Stage Link continues to operate between other devices, but is not

able to communicate with the affected control panel.


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1-4

PORTPORT

PROCESSOR

STAGELINK STAGELINK

Figure 1-2. Three Port Active Repeater

1-2.3.2. COREBUS. The COREBUS is an ARCNET communication network linked between the control engine and the I/O

engines , , , and (See Figure 1-1.). The COREBUS has two main purposes: the BMS and the input/output

communication between the control engine and the I/O cores.

The BMS, or Basic Messaging system, is the backbone of the system that allows basic message packets to be transmitted from the

control engine to the various I/O engines. Supported by the BMS is the UDM, or User Defined Memory system. The UDM is

what allows the controller to send a message to one of the I/O cores, asking it for a memory allocation.

The COREBUS also handles input/output traffic between the control engine and the I/O cores. Every 10 milliseconds (known as a

frame), the I/O cores transmit a packet of the data to the control engine, which stores them all in the database. Included among

s data is information transmitted from the TCEA boards and TCDA board over the IONET. This information can come in

the form of high speed data (once per frame) or low speed data (spread across 4-8 frames). Once every frame, towards the end of

the frame, the control engine transmits all the output data in one packet across the COREBUS. Each I/O core receives this packet,

then takes the information that it needs from it.

1-2.3.3. IONET. The I/O Network (IONET) is a communication network internal to the Mark V LM panel that permits data

exchange between the STCA boards located in the I/O control cores ( and ), the TCDA boards in the digital I/O cores

( and ) and the TCEA boards located in . This network allows the control to perform digital I/O (TCDA) and

protection (TCEA) related functions. Information transmitted over the network is address-specific. As a result, data is sent to

either the TCDA or TCEA boards according to their hardware jumper address settings. On start-up of the control panel, the

control engine downloads unit parameters to the TCDA and TCEA boards for I/O configuration and internal diagnostics. During

operation, operating parameters from these cards are sequentially exchanged with the STCA over the IONET for unit control.


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The configuration explained above allows TCEA and TCDA boards to be added to the network as necessary. Termination of the

IONET is accomplished by setting the hardware jumpers on the last TCDA board of the network (See Appendix A for hardware

jumper setting information). Each board must have a specific network address, also set by hardware jumpers, that matches a

software description. If a board needs to be removed for service, the network connection is broken at that point.

Three TCEA boards (known as , , and ) are required in the core. These three TCEA boards are linked in a

daisy chain configuration. These boards operate on the same IONET and all communicate with the core.

1-2.3.4. THE ARCNET INTERFACE BOARD. The ARCNET interface board is a device that allows the operator interface to

communicate with the Mark V LM control panel via the Stage Link network. Located in a spare 16-bit slot in the PC, the board

passes signals onto the network through a "T" type BNC connector (this latter device is located at the back of the PC). The last

connection on the Stage Link requires a 93 ohm termination resistor on the open end of the "T" type connector. All supported

ARCNET interface boards (several ARCNET boards are supported) are high impedance "BUS" type cards.

Supported ARCNET controller boards may implement hardware jumpers or switches for hardware configuration. Each of these

boards retains the ability to configure the dual-ported memory base address, the I/O base address, the PCs ARCNET address, and

the interrupt request level (IRQ). Other selectable features are card specific. Information regarding configuration of specific

boards is provided in the operator interface manuals.

1-3. RELATED DOCUMENTATION

Related technical documents include the User and Maintenance Manual (GEH-6354), which covers basic information

necessary to run the operator interface; and the Applications Manual (GEH-6355), which has information about

specific applications of the . Future operator interfaces will have different manuals and may be used for more information on

related topics.


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Notes:


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