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BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Archive - Keynote
March 5 - 8, 2017
Hilton Phoenix / Mesa Hotel
Mesa, Arizona
© 2017 BiTS Workshop – Image: tonda / iStock
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Copyright Notice
The presentation(s)/poster(s) in this publication comprise the Proceedings of the 2017 BiTS Workshop. The content reflects the opinion of the authors and their respective companies. They are reproduced here as they were presented at the 2017 BiTS Workshop. This version of the presentation or poster may differ from the version that was distributed in hardcopy & softcopy form at the 2017 BiTS Workshop. The inclusion of the presentations/posters in this publication does not constitute an endorsement by BiTS Workshop or the workshop’s sponsors. There is NO copyright protection claimed on the presentation/poster content by BiTS Workshop. However, each presentation/poster is the work of the authors and their respective companies: as such, it is strongly encouraged that any use reflect proper acknowledgement to the appropriate source. Any questions regarding the use of any materials presented should be directed to the author(s) or their companies. The BiTS logo and ‘Burn-in & Test Strategies Workshop’ are trademarks of BiTS Workshop. All rights reserved.
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
BiTS Workshop 2017 Schedule
Frontiers Day Monday March 7 - 9:00 am
Identifying the path to success for Industry 4.0
Thomas Sonderman
Rudolph Technologies
Sponsored by
Keynote
Address
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Identifying the Path to Success for Industry 4.0
Thomas Sonderman
VP & GM, Integrated Solutions Group
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Market Driven Challenges
5
SOURCE: NCTA
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
What is Industry 4.0? Wikipedia…
“… cyber-physical systems monitor physical processes, create a virtual copy of the physical world and make decentralized decisions.
Over the Internet of Things, cyber-physical systems communicate and cooperate with each other and with humans in real time…”
6
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Components of Industry 4.0 Attributes of all these connected “things”
• Discoverable
• Autonomous
• Model-based
• Communicative
• Self-monitoring
• Secure
• Standards-based
Imagine the collaborative behavior that could emerge !
7
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Solutions MUST Enable Industry 4.0 The Drive Towards Increased Productivity The evolution toward smart manufacturing is enabled by the confluence of
Connectivity
Computing Power
Intelligent Software
Ability to Manage MASSIVE DATA
Electronics Suppliers Who Act Decisively will Benefit
by Creating Added Value for their Customers
8
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Key Challenges in Bringing ICs to Market
Data Democracy • Multiple design groups
• Challenging wafer fab,
Assembly/Test and system
integration
• Complex entity name changes
Supply Chain Management
Design for Profitability • Product concept/circuit design
• Reticle set design
• Product design debug &
optimization
• Test program debug
Product Management
Ramp and Availability • Multiple data consumers
• Design
• Foundry management
• Customers
• Suppliers
Manufacturing
Real-Time Web Based
Reporting and Drill Down Layout Aware Analysis Fab-to-Field / Field-to-Fab
Integrated Solutions are Required
9
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Understanding Supply Chain Yield Dynamics
Requires Complex Enterprise Level Supply Chain Optimization:
• Big Data
• Digital Threads
• Package to Tool Correlations
• Real-time Dashboards
• Best in Class Yield Analytics
Component Matching
Package Interconnection Delays
Device Parametric Variation
Performance Failures
Structural Failures
Device Contamination
Process Tool Failure
Bump Coplanarity
Solutions Must Remove Risk from
the Electronics Supply Chain
10
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
IC Fabrication Information Flow
11
NitrideFurnace
DepositionSTI Masking
ShallowTrench Etch
Metrology Metrology Metrology
TEOS FurnaceDeposition
TrenchPlanarization
Masking
TrenchPlanarization
EtchMetrology Metrology Metrology
STI Polish Nitride StripMetrology Metrology
DepController
CDController
DepthController
Dep Controller(Development)
OverlayController
Etch LossController
ThicknessController
Oxide LossController
Dep Time andTemperatures
Dep Time andTemperatures
ExposureEtch Time
(By Chamber)
EtchTime
PolishTime
BathTimes
NitThk
NitThk
NitThk
NitRef CD
OxideThk
OverlayMeasurements
OverlaySettings
OxideThk
OxideThk
OxideThk
OxideThk
TrenchDepth
TrenchDepth
Flow of Data
Flow of WIP
OxideThk
EndpointTimes
Process Control
and Metrology
Design statistics
& care-abouts
Process Statistics
and capability
Knowledge
Aware Design
Data
Data
Process/Design
Sensitivities
Design-based
Yield Diagnostics
Adaptive Test
Data
Data
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
INTEGRATED SOLUTIONS
METROLOGY PROBE/TEST PROCESS
Product State Wafer State Tool state
4
Converting Data into Actionable Intelligence
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Big Data Defined
13
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Why Can’t Decisions Be Made Quicker?
14
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
New Paradigms are Required
15
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Electronics Supply Chain Optimization
16
Trace Data
Tool Level
Fab Level
Fab 1 Adv. Package Multi-chip
Product
Centralized
dB’s
Chamber
Process Area
Fab 2
Enterprise YMS
Sophisticated Yield Management System
Supply Chain Traceability (Digital Threading)
Dashboards for Complete Visibility from Technician to CEO
Bi-Directional Communication
Enterprise FDC
Fault Detection with Wafer/Die Level Correlations
Analytics Across the Value Chain
Deep into
the process
Big Data
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Design /IP Optimization Process Optimization Test Optimization
Data Analysis and Correlation
Data Generation and Warehousing
Test Chip
Data
Design
Statistics
Defect
Data
Test and
Diagnostics
Bitmap
Data
Process
Metrology
Equipment
Data
OPC
Data
Productivity
Data
System
Test Data
DPPM
Integrated Yield Improvement Infrastructure
Leakage Perf/Power
Yield/Cost Cycle Time
Control
Metrology
Equipment
Cycle time
DFT
Repair Adaptive test
Burn-in
17
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
DATA STREAMS
Intelligent Analysis Engines
18
DATA WAREHOUSE
Defect data Metrology
data
MES &
Equip data
Sort Yield,
Parametric
Design
info
Parametric
Test data
E-Test Tools Defect Tools Metrology
Tools
Control
Tools
Process
Tools
ADVANCED ANALYTICS ENGINE
Control
Real-time
Data Collection
On demand
Analytics
Wafer-centric Tool-centric
Thread
Synchronization
Engines
Deep
Learning
Algorithms
Adaptive
Knowledge
Library
Data Modelling
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Advanced Predictive Analytics PIES Algorithms for Machine Learning
• Probability Bayesian Predictor
• Information Adaptive Decision Trees
• Error Partial Least Squares
• Similarity k-nearest Neighbor
19
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Predictive Analytics for Industry 4.0 Comprehensive Algorithm Suite
20
PCA
Unsupervised Visual
PLS
Supervised Visual
Adaptive Decision
Trees
Supervised Prioritization
MLR
Supervised Quantification
ANOVA
Univariate Validation
Cluster
Un-Supervised Prioritization
Dynamic Time
Warping
UVA / MVA Pre-filter
Multivariate Analysis
Which lots behave differently?
NPI Modeling Algorithms
Which parameters are critical?
Predictive Analysis
What is the predicted yield?
TYPES OF MACHINE LEARNING
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
PLS (Partial Least Squares Regression)
Observed variables Predicted variables
• Multi-variate prediction modeling
• Linear Regression: Y ~ X
• Project observed (X) variables and
predicted (Y) variables to a new space
Correlation Chart & Data in new space
Prediction Result
21
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Parameteric Interpolation Thin Plate Spline Regression (TPS)
Measured samples
Predicted values
22
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Decision Tree Mathematics
What is a decision tree?
• Sequential statistical test
• Identify primary cause/effect
• Continuous Variables
• Liner regression or curve fitting
• Categorical Variables
• ANOVA
• Time Based data
• Split data based on primary effect
• Repeat to create tree with 2N branches
• More than one valid predictor
• Show best answer first
• Presentation-ready graphics
23
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Intelligent Digital Threading™
24
FAB 1
B FAB 2
AP
PERFORMANCE
YIELD
ACTIONABLE DATA, NOW! ™
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
ACTIONABLE DATA, NOW! ™ METROLOGY
25
PROCESS
STEP
Yield Spec
Target Limit
Recipe
Runtime
Sensor
Eq
History
T.F.
3D
THREAD SYNC ENGINE ™
Spec
Metrology
Images
With Die
Die
Wafer
Lot
Batch
F.T
X-Ray
PRODUCT
EQUIP
FAB 2 ANALYTICS
YMS
Viz
VM YM
SPR
FDC
Defect
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Digital Threading - Multichip Module Helping Automotive Customer Achieve “Zero Defect” Goals
Cap Wafer
Lot: E1234.3
Shipment to Customer
Assembly External
CMOS ASIC House
Test Center
Assembly
Assembly
Final Parts after Assembly (SMB)
Lot: U5678.15
Sensor after waferbonding Lot: E1234.3
ASIC Wafer Lot: U5678.2
WaferBonding
Sensor Wafer
Lot: L58280001.4
Traceability throughout the supply chain driving yield improvement
26
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
27
Front End Final
Test Sort
• A long cycle time process – Die bank
• After die bank the lot is split into many lots
• Prior to die bank there are 4 lots moving through the fab. These are
the 4 lots in this multi-chip module
• Wafer fabrication of all
module components
• Traces parent lots and
all children through:
• Sort
• Assembly
• Final test
ASIC Sensor1
Sensor2 Cap
4-Chip Module
Digital Threading – Multi-chip Module
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Post Digital Threading, you can analyze all
components’ data collected:
• Inline parametric
• WET or E-test data
• Sort Bin/Parametric
• Final Bin/Parametric
28
Fail Bin 25 has the
highest ratio at
Final Test. The
corresponding
parametric
parameter is Isb_H,
which was tested at
Sort as well.
MCM – Analysis Of All Manufacturing Data
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Genealogy associates sort lot number with final test lot number
• Combined dataset shows parametric shift due to packaging
Plot the sort parametric value and the final test
patrametric value
• There is a paramteric shift during packaging
• The yield on this multi-chip module is very
sensitive to paramertric variation
FT_2.0_Isb_H
Sort_Isb_H_1
Cum Probability Plot – Parameter @ FT and Sort
29
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Advanced RF Device Digital Threading – Duplexer Example
30
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Advanced RF Device Digital Threading – Duplexer Example
31
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Intelligent Visualization
Yield by week
& location
Yield by
product family
Yield by
layer ID
Yield by
product ID Yield by AOI
tool ID
Yield by
lot ID Yield by class method
& defect class
Filters & display
settings
32
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Industry 4.0 Analytics Platform
33
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote
Summary
34
• The Goal is Actionable Intelligence
• New Analytical Paradigms will be Required
• Requirements:
• The Right Data Actionable, Secure, Relevant and High Integrity
• At the Right Time Current, Accurate and Transparent
• In the Right Format Visible, Predictive and Prescriptive
BiTS 2017
March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Keynote