semicon 2007 master -...

Veeco Technology UpdateSemicon West 2007

July 18, 2007

©2007 Veeco Instruments Inc. 20707 Investor Relations Presentation

Agenda/WelcomeDeb Wasser, SVP IR and Corp. Comm.

Ed Braun, Chairman – Introduction

John Peeler, Chief Executive Officer

Bob Oates, EVP, Veeco Process Equipment –Introduction

• HB-LED Opportunity: Sudhakar Raman, VP Marketing MOCVD

• Data Storage Opportunity: David Bruns, formerly VP Slider Operations (recently promoted to VP, GM, Veeco Asia)

Lloyd LaComb, SVP, Veeco Metrology

Q&A Session


Agenda/WelcomeAgenda/Welcome

Technology/Market Focused Presentations Technology/Market Focused Presentations

No Q2 Financials to be DiscussedNo Q2 Financials to be Discussed

We are reporting our results on Friday, July We are reporting our results on Friday, July 27th before the market open. Conference call 27th before the market open. Conference call at 10:00am EST.at 10:00am EST.

Details on call available on Details on call available on www.veeco.comwww.veeco.com IR IR sitesite


Safe Harbor StatementSafe Harbor Statement

To the extent that this presentation To the extent that this presentation discusses expectations or discusses expectations or otherwise makes statements about the future, such statements areotherwise makes statements about the future, such statements areforwardforward--looking and are subject to a number of risks and looking and are subject to a number of risks and uncertainties that could cause actual results to differ materialuncertainties that could cause actual results to differ materially ly from the statements made. These factors include the risk factorsfrom the statements made. These factors include the risk factorsdiscussed in the Business Description and Management's Discussiodiscussed in the Business Description and Management's Discussion n and Analysis sections of and Analysis sections of Veeco'sVeeco's Annual Report on Form 10Annual Report on Form 10--K for K for the year ended December 31, 2006 and subsequent Quarterly the year ended December 31, 2006 and subsequent Quarterly Reports on Form 10Reports on Form 10--Q and current reports on Form 8Q and current reports on Form 8--K.K. Veeco Veeco does not undertake any obligation to update any forwarddoes not undertake any obligation to update any forward--looking looking statements to reflect future events or circumstances after the dstatements to reflect future events or circumstances after the date ate of suchof such..

In addition, this presentation may review nonIn addition, this presentation may review non--GAAP financial GAAP financial measures. For GAAP reconciliation, please refer to the reconcilimeasures. For GAAP reconciliation, please refer to the reconciliation ation section in this presentation as well as Veecosection in this presentation as well as Veeco’’s financial press s financial press releases and 10K and 10Q filings available on www.veeco.comreleases and 10K and 10Q filings available on www.veeco.com

Edward Braun, Chairman of the Edward Braun, Chairman of the BoardBoard


Data Semiconductor HBData Semiconductor HB--LED ScientificLED ScientificStorageStorage Wireless ResearchWireless Research

Embedded Storage for CEEmbedded Storage for CEMicrodrives / Femto TFMHMicrodrives / Femto TFMHPerpendicular recordingPerpendicular recording

90 and 65nm90 and 65nm300mm300mm

HBHB--LED / Wireless, LED / Wireless, Automotive, Camera Cell Automotive, Camera Cell Phones, Backlit LCD TVPhones, Backlit LCD TV

Nanotech, Material &Nanotech, Material &Life ScienceLife Science

Veeco Provides Enabling Technology in Veeco Provides Enabling Technology in Process Equipment and Metrology for Process Equipment and Metrology for

Multiple Growth MarketsMultiple Growth Markets


Veeco’s Strategy For Growth

Offer a Offer a broad product linebroad product line of well differentiated enabling Process of well differentiated enabling Process Equipment and Metrology technologiesEquipment and Metrology technologies

Establish Establish strategic relationshipsstrategic relationships with technology leaders worldwidewith technology leaders worldwide

Capture Capture leading market shareleading market share in all product linesin all product lines

Leverage our exposure to Leverage our exposure to highhigh--growth end marketsgrowth end markets

Fuel our growth through internal Fuel our growth through internal development of multi generational development of multi generational new productsnew products aligned to our customersaligned to our customers’’ new technology strategic new technology strategic roadmapsroadmaps

Continually Continually improve our operationsimprove our operations to remain profitable through to remain profitable through industry cyclesindustry cycles

WE BELIEVE THERE IS A MULTIWE BELIEVE THERE IS A MULTI--HUNDRED MILLION DOLLAR HUNDRED MILLION DOLLAR GROWTH OPPORTUNITY FOR VEECO EXISTING IN THE GROWTH OPPORTUNITY FOR VEECO EXISTING IN THE

TECHNOLOGIES WE OWN TODAYTECHNOLOGIES WE OWN TODAY


Veeco Has Diverse…Multi-Product…Multi-Market…Worldwide Exposure

Revenue by ProductRevenue by ProductEquipment up 9%Equipment up 9%Metrology up 1%Metrology up 1%

Revenue by MarketRevenue by MarketHBHB--LED/Wireless up 39%LED/Wireless up 39%

Scientific Research up 18%Scientific Research up 18%Data Storage down 11%Data Storage down 11%

Revenue by RegionRevenue by RegionJapan up 33%Japan up 33%

Veeco benefits from product, market and geographic diversityVeeco benefits from product, market and geographic diversity

Q107 Q107 REVENUEREVENUE $99M up 6% Y/Y$99M up 6% Y/Y

EquipmentEquipment59%59%

Rev $58.1MRev $58.1MGM 40%*GM 40%*

MetrologyMetrology41%41%

Rev $41.1MRev $41.1MGM 49%GM 49% HBHB--LEDLED

/Wireless/Wireless21%21%

ScientificScientificResearchResearch

33%33%

Data Data StorageStorage

36%36%

SemiconductorSemiconductor10%10%

EuropeEurope15%15%

U.S.U.S.35%35%

AsiaAsiaPacificPacific

30%30%

JapanJapan20%20%


Veeco’s Technology/Market Universe

Process Equipment

61%

39%Metrology

Data StorageTFMH42%

Semiconductor13%

LED/Wireless20%

Scientific Research/Industrial

25%

Solar(emerging)

Process Equip.

Ion Beam Etch (IBE)

Ion Beam Dep (IBD)

Physical Vapor Dep (PVD)

Atomic Layer Dep (ALD)

Lapping/Dicing

Metal Organic Chem.VaporDep (MOCVD)

Molecular Beam Epitaxy

% of $441m Revs 2006

Our Core Technologies Drive New Market Opportunities

Metrology

Automated AFM

Research AFM/SPM

Optical Interferometer

Stylus Profilers


Veeco’s Technology/Market Universe

Process Equipment

Metrology

Data StorageTFMH30%

LED/Wireless/Solar40%

Scientific Research/Industrial/Semiconductor

30%

Metrology

Automated AFM

Research AFM/SPM

Optical Interferometer

Stylus Profilers

Veeco’s Future Opportunity

Process Equip.

Ion Beam Etch (IBE)

Ion Beam Dep (IBD)

Physical Vapor Dep (PVD)

Atomic Layer Dep (ALD)

Lapping/Dicing

Metal Organic Chem.Vapor Dep(MOCVD)

Molecular Beam Epitaxy


Welcome John Peeler

John Peeler joined Veeco 7/1 as CEO

“Perfect fit” with our specs:

• Joined Veeco from JDSU, where he was head of $600m, highly profitable Test and Measurement Group

• 30 years diversified global management expertise

• Multi-product, multi-market experience

• Experienced at “$500m- $1B” revenue size

• Leadership skills – product development, marketing, sales, global operations, manufacturing/operational excellence

John Peeler, Chief Executive John Peeler, Chief Executive OfficerOfficer


My Background And Philosophy

Long history in high-tech, multi-product, multi-market businesses

Ran JDSU’s largest and most profitable business –Manage for growth and profitability

Understand complex business models, global distribution, cyclicality, “portfolio” businesses, multi-factories

My philosophy:

• Do a great job for our customers – help them achieve their business objectives better than our competitors do

• Be a company where high performance people want to work

• Deliver strong financial performance and returns for our investors

My approach is to develop plans and programs to achieve goals and then relentlessly manage to execution


After 2 ½ Weeks on the Job…

Lots of Great things at Veeco

• Impressive products and technology

• Leading market positions in key areas

• Attractive growth in several market segments

• Motivated and committed workforce

• Excellent teamwork between engineering, marketing and operations

• An enormous number of new products coming from R&D efforts

Key challenge: to take Veeco to the next level of growth and profitability


Initial Focus

Initial Learning Initial Learning –– JulyJuly--Early AugustEarly August•• Develop Business Unit and Functional group understandingDevelop Business Unit and Functional group understanding

•• Visit key factories and Veeco global regionsVisit key factories and Veeco global regions

•• Preliminary Assessment of People, Products and ProcessesPreliminary Assessment of People, Products and Processes

Situation Assessment Situation Assessment –– Mid AugustMid August-- Mid SeptMid Sept•• Lead the senior management team to assess organizational Lead the senior management team to assess organizational

strengths and weaknesses and develop plansstrengths and weaknesses and develop plans

•• Identify top opportunities, issues and resource prioritiesIdentify top opportunities, issues and resource priorities

Strategy and Plan Formulation Strategy and Plan Formulation –– Mid SeptMid Sept--Mid OctMid Oct•• Formulate and launch Strategic Initiative Programs and begin Formulate and launch Strategic Initiative Programs and begin

planning 2008planning 2008

•• Discuss strategy and initial plans with Veeco Board and InvestorDiscuss strategy and initial plans with Veeco Board and Investors s Late OctoberLate October

Process Equipment IntroductionProcess Equipment Introduction

Bob Oates, EVP, Veeco Process EquipmentBob Oates, EVP, Veeco Process Equipment


Data Semiconductor HBData Semiconductor HB--LED ScientificLED ScientificStorageStorage Wireless ResearchWireless Research

Embedded Storage for CEEmbedded Storage for CEMicrodrives / Femto TFMHMicrodrives / Femto TFMHPerpendicular recordingPerpendicular recording

90 and 65nm90 and 65nm300mm300mm

HBHB--LED / Wireless, LED / Wireless, Automotive, Camera Cell Automotive, Camera Cell Phones, Backlit LCD TVPhones, Backlit LCD TV

Nanotech, Material &Nanotech, Material &Life ScienceLife Science

Veeco Provides Enabling Technology in Veeco Provides Enabling Technology in Process Equipment and Metrology for Process Equipment and Metrology for

Multiple Growth MarketsMultiple Growth Markets

Primary PEMarkets


Veeco Process Equipment Core TechnologiesVeeco Process Equipment Core Technologies

GaNGaN MOCVDMOCVD

As/P MOCVDAs/P MOCVD

MBEMBE

IBD/IBE/DLCIBD/IBE/DLC

PVD/ALD/PVDPVD/ALD/PVD--HiRateHiRate

Lappers/SawsLappers/Saws

Core ProductsCore Products

HBHB--LED/WirelessLED/WirelessData StorageData Storage


Phases of Process Equipment Evolution

New Growth New Growth EnginesEngines

Improve Improve ProfitabilityProfitability

Grow Core Grow Core TechnologiesTechnologies

Continue MOCVD Continue MOCVD share gains for HBshare gains for HB--LEDLED

Maximize DS with Maximize DS with PVD, ALD, DLC and PVD, ALD, DLC and After Market salesAfter Market sales

Enter thin film Enter thin film solar deposition solar deposition

Increase Increase outsourcing outsourcing content of new content of new productsproducts

Common hardware Common hardware and software and software platformsplatforms

Shorter Shorter manufacturing manufacturing cyclescycles

Focus on Focus on operational operational excellenceexcellence

MOCVD for HBMOCVD for HB--LEDLED

(TurboDisc)(TurboDisc)

Saws and Lapping Saws and Lapping for Data Storagefor Data Storage

Investment in Investment in FluensFluens for Alumina for Alumina PVD depositionPVD deposition

Internal R&D focus Internal R&D focus on PMR Product on PMR Product Development Development

20072007--2010201020052005--2007200720032003--20062006

LED Market OpportunityLED Market Opportunity

Sudhakar Raman, VP MarketingSudhakar Raman, VP MarketingVeeco MOCVDVeeco MOCVD


Contents

LED Market Drivers

LED Technology & Performance

Customers

MOCVD Technology Update

Emerging Market Opportunity


Why Light Emitting Diodes (LED)

100,000 hours150-200 lumens/wattFuture white LEDs (2010+)

35,000 hours50 lumens/wattToday’s white LEDs

10,000 hours50 lumens/wattFluorescent lamp

1000 hours16 lumens/wattIncandescent bulb

LifetimeLifetimeBrightnessBrightnessLight SourceLight Source

Main Advantages:Main Advantages:• Energy Savings

• Lifetime

Additional Benefits• No moving parts

• No Mercury

• No Fragile glass environments

• No Toxic gases

• No Filament

Energy Savings and Lifetime

Source: US DOE

Cumulative energy savings of SSL over next 20 years in US alone could eliminate 258 Mtons of carbon emission, alleviate need for 133 power plants (1000MW), and account for savings of > $100B


0

1000

2000

3000

4000

5000

6000

7000

8000

9000

10000

2006 2007 2008 2009 2010 2011

$M

Mobile/Signals/Auto/Other Signs/Displays General Illumination

LED Market Opportunity

Source: Strategies Unlimited

Signs and Displays Segment Grows at CAGR of 42%

CAGR: 17%


Current Market Drivers

Laptop BacklightingLaptop Backlighting

•• 1313”” –– 1515”” by Apple and HP being by Apple and HP being introducedintroduced

Mobile devicesMobile devices

•• Sony Ericsson, SamsungSony Ericsson, Samsung

•• Camera flash in cell phonesCamera flash in cell phones

AutomotiveAutomotive

•• Head lampsHead lamps

Audi R8 and Lexus 600hAudi R8 and Lexus 600h

•• DRL, CHMSL, Stop lightsDRL, CHMSL, Stop lights

Large screen displaysLarge screen displays

•• Beijing OlympicsBeijing Olympics

•• 6000 buses outfitted with indoor 6000 buses outfitted with indoor LED lightingLED lighting


Current Market Drivers

Penetration in SSL Penetration in SSL happeninghappening

•• Retail LightingRetail Lighting

•• Street LampsStreet Lamps

•• Spot lightingSpot lighting

•• ArchitecturalArchitectural

•• LandscapingLandscaping


The Next Big Thing - Large LCD Backlighting

All major players are investing

• Samsung, Sony, LG, Phillips

Several key MOCVD customers in R&D phase

Capacity purchases may happen 2H’08

No mercury

Color gamut > 105%

High dynamic contrast ratio

Key challenges are Cost, Uniformity and Brightness Source: Luminus

MOCVD technology is a key to success


Long Term Driver – 2009 & Beyond General Illumination

0

100

200

300

400

500

600

700

800

900

1000

Ma

rket

Siz

e (

$M

)

2006 2007 2008 2009 2010 2011

CAGR: 37%

Architectural and Retail Lighting account for > 60% in 2011Source: Strategies Unlimited


HB-LED: “Moore’s Law” – Brighter Diodes at Lower Cost

Semiconductor industry must lower cost per function by 50% every 18 months

• Each reduction creates new markets

LED industry has similar opportunity – “Haitz law”

• ~30% improvement per year

• Enables new markets

Transistors/Chip

Cos

t/Tra

nsis

tor Moore’s

law

Semiconductors

Lumens/Watt

Cos

t/Lum

en

High Brightness LEDs

HighLow

Low

Hig

h

HighLow

Low

Hig

h

HB-LEDs are just getting started!


LED Fabrication – MOCVD is Critical Production Step

Sapphire Wafers

Epitaxial Process

Thinning/Dice

Etch

Encapsulation/Lens

Contacts

Heat Sink/WB

P-GaN

N-GaNBuffer

Sapphire

MOCVD

Chip Processing

Packaging

MOCVD is >50% of the LED Fab Capital Expenditure


LED Technology Basics: Multiple Methods for Making White light

RGBChips

400 500 600 700

+ +

• Multi Chip: R+G+B (3 in 1 LED)

400 500 600 700

+

• Multi Chip: Blue + Orange Chip (2 in 1 LED)

BlueChip

OrangeChip

All of the above require MOCVD technology

400 500 600 700

• UV LED + RGB Phosphor

+ +

Preferred for Large LCD Backlighting400 500 600 700

+

• Blue + Yellow Phosphor

BlueChip

Preferred method for White Light


LED Industry Roadmap to Solid State Lighting

AllAllFlourescentFlourescentIncandescentIncandescentLowLow--FluxFluxMarkets Markets PenetratedPenetrated

1.51.50.40.4<2<2<5<52020200200Cost ($/Cost ($/klmklm))

404075757.57.56.76.72.72.711Input Power Input Power (W/lamp)(W/lamp)

340034001200120015001500100010002002002525Flux (lm/lamp)Flux (lm/lamp)

101011>100>100>100>100>20>202020Lifetime (Lifetime (KhrKhr))

8585161620020015015075752525Efficiency (lm/W)Efficiency (lm/W)

FluorescentFluorescentIncandescentIncandescentSSLSSL--LED LED 20202020

SSLSSL--LED LED 20122012

SSLSSL--LED 2007LED 2007SSLSSL--LED LED 20022002

TechnologyTechnology

Source: Optoelectronics Industry Development Association (OIDA)

• Luminous efficacy of LED is equal to or better than incandescent• LED manufacturers are making significant improvements to reduce cost/Klm

Cost Improvements will enable significant adoption in SSL (2010+)


White LED PerformanceWhite LED Performance

2000 2005 2010 2015 2020

50

100

150

200

Eff

icie

ncy

(lm/W

)

Lab Results Production Level

OIDA R

oadmap

• Lab results at >110 lm/w• Production at 70-90 lm/w• Customers are ahead of OIDA roadmap


LED Food Chain – 1 year ago

Chip

Com

pone

nts

Prod

uct

Syst

em

ChipMakers

LED Components

LED Modules/Controls

OEM’s &Luminaires

LightingSolution

Lum

ileds

Phill

ips

ColorKinetics

Osr

amO

pto

Cre

e

Nic

hia

Toy

oda

Gos

ei

Everlight

Optotech

HPO

Epistar

Highlink

SEMCO

SOD

SeoulSemi

Conductor

Samsung Display(SDI)

CO

TC

O

Osr

amSy

lvan

iaCMOAUO

FoxConn

SpaceCannon,

Xilver

GE

Gel

core

MOCVD = Veeco /Aixtron /Nippo Sanso


LED Food Chain – Today

Phill

ips –

Lum

ileds

, TIR

, Col

or K

inet

ics

Osr

amO

pto

Cre

e -C

otco

Nic

hia

Toy

oda

Gos

ei

Everlight

Optotech

HPO

Epistar/Highlink/Epitech SEMCO

SOD

SeoulSemi

Conductor

Samsung Display(SDI)

Chip

Com

pone

nts

Prod

uct

Syst

em

ChipMakers

LED Components

LED Modules/Controls

OEM’s &Luminaires

LightingSolution

Osr

amSy

lvan

iaCMOAUO

FoxConn

SpaceCannon,

Xilver

GE

Lum

inat

ion

Lex

edis

Tri

doni

c/A

tco

ZUM

TO

BE

LMOCVD = Veeco /Aixtron /Nippo Sanso


LED Chip Manufacturers – Large Customer Base

0

200

400

600

800

1000

1200

1400

20

06

Reven

ue

($

M)

Nichi

a

Osram

Lum

ileds

Cree

Epist

ar

SOD

Everli

ght

Rohm TG

Huga

Other Customers:- Sanan- Forepi- Century Epi- Rainbow- Arima- Showa Denko- GPI- Tekcore- etc.

Today: Top 10 Manufacturers Capture >60%of the Market

Source: Strategies Unlimited


Regional MarketsRegional Markets…….Evolving.Evolving

HB-LED Supply by Region ($4B)

Japan49%

China4%

Korea10%

NA13%

Europe10%

Taiwan14%

Source: Strategies UnlimitedAsia-Pacific will grow significantly over next 3 years


Regional Market LandscapeRegional Market Landscape

Vertical Integration to increase product value

Phillips bought Color Kinetics

Cree bought Cotco

Strong Focus on SSL

Toshiba Lighting & Technology

Citizen Electronics

Matsushita Electric Works

Major Players

Osram

Phillips-Lumileds

Cree

Major Players

Nichia

TG

Show Denko (SDK)

Rohm

Key Drivers

Automobile

Lighting

Camera Flash

Signs/Displays

Key Drivers

Lighting

Automobile

7” – 12” led BLU

Mobile devices

North America/EuropeNorth America/EuropeJapanJapan


Regional Market LandscapeRegional Market Landscape

Seoul Semiconductor claims rapid adoption of SSL in Korea

AC LED

No AC to DC converter

Major Players

Semco

SOD

LG

Key Drivers

Lighting - commercial buildings

Street lamps

Auto Head lamps

Mobile devices

KoreaKorea

Heavy investment in SSL20% total energy savings by

2012

Investing > $250m/yr in SSL

Increased investment by Flat Panel makers

AUO

CMO

Foxconn

Major Players

Sanan

Lumei

Century Epi

Major Players

Epistar (Consolidation)

Arima

Everlight

Key Drivers

Signs/Displays

Street lamps

Lighting

Key Drivers

BLU for Laptops

Automobile

7” – 12” led BLU

Mobile devices

ChinaChinaTaiwanTaiwan


Brightness and Cost Improvements Drive Industry Growth and Applications

Cost per 1000 Lumens

Effic

ienc

y Lu

men

s/W

att

150

130

110

90

70

50

30

20

15

5

LCDBacklighting

MobilePhonesTraffic

Lights OutdoorSignage

General Lighting

2003

2004

2006

20072008

2005

>2011

2002

< $9< $9$12$12$20$20$28 $28 $50$50$70$70$95$95$125$125

Blue Keypads

GaNzilla I MOCVD

GaNzilla II MOCVD

K- 465 MOCVD

Next Gen MOCVD

Headlights

Laptops


Veeco TurboDisc Technology Advantage

AdvantageAdvantage

•• Strictly controlled flow and Strictly controlled flow and temperature dynamicstemperature dynamics

•• Thin boundary layerThin boundary layer

•• Sharp interfacesSharp interfaces

•• Scaleable Scaleable -- transfer of processtransfer of process

•• Excellent UniformityExcellent Uniformity

The heat causes the gas molecules to breakdown (crack) into atoms (Ga, N,

etc.)

NH3

TMGa

AlkylsHydrides


Next Generation K-series MOCVD Production Platform

KK--Series PlatformSeries Platform

•• Modular Upgradeable PlatformModular Upgradeable Platform

•• Common across GaN & As/P product linesCommon across GaN & As/P product lines

•• Only platform capable of continuous operationOnly platform capable of continuous operation

•• More productivity than any other platformMore productivity than any other platform

KK--Series GaN Series GaN –– K300 & K465K300 & K465

•• K300K300

Based on production proven Based on production proven GaNzillaGaNzilla II reliabilityII reliability

Upgradeable to K465 GaNUpgradeable to K465 GaN

•• K465K465

Our most advanced reactor technologyOur most advanced reactor technology

>50% greater throughput than competition>50% greater throughput than competition

Largest reactor capacityLargest reactor capacityExcellent Acceptance Since December ’06 Introduction… Helping Veeco Gain Share


TurboDisc K465 GaN Advantage TurboDisc K465 GaN Advantage

TurboDisc K465 GaN TurboDisc K465 GaN modular platform modular platform produces highest margin produces highest margin for HBfor HB--LED LED manufacturersmanufacturers•• Only automated, high capacity Only automated, high capacity

system delivers highest system delivers highest throughputthroughput

•• Next generation TurboDisc Next generation TurboDisc technology produces excellent technology produces excellent yieldyield

•• Extendable platform for long Extendable platform for long capital lifecapital life

45-120% More Throughput with TurboDisc K465 GaN

90903030Competitor BCompetitor B

1381384242Competitor ACompetitor A

2022024545TurboDisc K465 TurboDisc K465 GaNGaN

Wafers/Wafers/

DayDay22”” Wafer CapacityWafer Capacity


TurboDisc E450 AsP Advantage

40-50 % More Throughput with TurboDisc E450 AsP with World Class

Process Quality 6464909044”” waferwafer

20920931031022”” WaferWafer

Competitor Competitor ––Wafers/dayWafers/dayVeeco Veeco –– Wafers/dayWafers/day

Production proven E450 Production proven E450 produces the highest margin produces the highest margin for HBfor HB--LED manufacturersLED manufacturers•• RealTempRealTemp®® 200 temperature 200 temperature

control assures accurate process control assures accurate process reproducibilityreproducibility

•• Flow FlangeFlow Flange™™ enables excellent enables excellent uniformity and repeatability for uniformity and repeatability for high production yieldshigh production yields

•• Vacuum loadlock minimizes idle Vacuum loadlock minimizes idle time for highest production time for highest production throughputthroughput

•• Low maintenance TurboDiscLow maintenance TurboDisc®®technology enables highest technology enables highest uptimeuptime


Beyond TurboDisc K465 – Next-Generation Solutions, Higher Gross Margins

ApproachApproach

•• Modular platform with multiModular platform with multi--chamber capabilitychamber capability

•• Platform extendable for multiple Platform extendable for multiple technology generationstechnology generations

•• High level of commonality High level of commonality between GaN & As/Pbetween GaN & As/P

Expect to see continuous Expect to see continuous improvements in 2007 & 2008improvements in 2007 & 2008

LED Manufacturers• Lower MOCVD CoO• Improve Yield

Veeco Process Development Programs- UCSB- KOPTI

+ =

GaNzilla I

GaNzilla II

K-Series GaN

E450 LDM

Next Generation

Product Roadmap


Estimated Market Share - GaN & As/P

2006 Est. Market Share

NS7%

Veeco32%

A61%

2007 Est. Market Share (Q1)

NS9%

Veeco44%A

47%

Goal: Continue to gain share due to GaNzilla/K-series performance advantage and E450 performance advantage

GaNzillaGaNzilla II gained significant share due to high productivity and reliabII gained significant share due to high productivity and reliabilityilityIntroduced ROY solution through E450 As/P Introduced ROY solution through E450 As/P •• Best in Uniformity, Productivity and ReliabilityBest in Uniformity, Productivity and Reliability

Introduction of KIntroduction of K--series GaN continues to drive market share gainseries GaN continues to drive market share gain


0

50

100

150

200

250

300

350

400

450

500

2006 2007 2008 2009 2010 2011

$M

GaN MOCVD B/G TAM AsP MOCVD ROY TAM

MOCVD TAM Forecast 20-30% CAGR

Source: Veeco Estimate

Small Display Backlighting Driven

Large Display Backlighting Driven

General Lighting Driven


Veeco’ Emerging Solar Opportunity

WW Solar Cell Consumption (MW)

01,0002,0003,0004,0005,0006,0007,0008,0009,000

10,00019

99

2000

2001

2002

2003

2004

2005

2006

2007

2008

2009

2010

MW

Other Thin Films

CIGS

Cadmium Telluride

Amorphous - Si

Other (i.e Ribbon)

Poly - Si

Mono-Si

Thin Film

Crystalline Si

2006-2010 CAGR% Total = 40.7%Cryst. Si = 37.1%Thin Film= 71.3%

Source: Information Network,Photon Consulting

Veeco is uniquely positioned in Thin Film Solar


Major Solar Cell TechnologiesMajor Solar Cell Technologies

Crystalline Si Thin Film

Mono-Si Poly-Si a-Si CuInGaSe2(CIGS)

CdTe(Cad-Tel)

III-Vs(Multi-Jct.)

Si Wafer Glass, Stainless Steel, Plastic Ge Wafer

Terrestrial$/Watt

TerrestrialLower $/Watt

Simpler Production Process

Space40% Efficiency


Current Veeco Products for SolarCurrent Veeco Products for Solar

Crystalline Si Thin Film

Mono-Si Poly-Si a-Si CuInGaSe2(CIGS)

CdTe(Cad-Tel)

III-Vs(Multi-Jct.)

Deposition Sources

MOCVD

Veeco’s Solution Space - 2008 Opportunity >$15-20M


Early Stage, High-Growth Opportunity

LED market opportunity in its infancy – traffic lights, key pads

Veeco’s “sweet spot:”technology-focused, immature worldwide market

We have key enabling technology, MOCVD

Each LED generation requires new MOCVD equipment

Our focus on process development, support and strategic customer relationships will enable our success

HDD Market and Technology HDD Market and Technology UpdateUpdate

David Bruns, VP/GM Veeco AsiaDavid Bruns, VP/GM Veeco Asia


Outline

HDD industry outlook

• Technology

• Capacity

• CAPEX drivers

Veeco’s growth strategy for the Data Storage market sector

Summary


Living in the Digital World

Digital world continues to drive storage requirements

Flash continues to make inroads into low-capacity storage market… and stimulates HDD technology investment

Industry consolidation is a reality … vertical integration is the response 320 GB


HDD Demand Continues… Driven by Multiple Markets

• Consumer applications are high-growth segments that complement base desktop, mobile and enterprise segments

• Small Form Factor (SFF) drives are beneficiaries of this growth and are driving areal density requirements

Unit Growth by Market Segment

-

100

200

300

400

500

600

700

800

2004 2005 2006 2007 2008 2009 2010

Mill

ions

Year

Enterprise DesktopPersonal Storage PortableConsumer

44 %

54 %

Areal density

Technology Advances

Consumer applications

New Process Equipment

SFF Drives


The HDD Value Proposition is Cost-Effective Storage

• HDD areal density growth of 30-40% required to maintain lead over flash

• HDD wins over Flash in large capacity consumer applications

Areal density growth

Technology Advances

Flash Competition

New Process Equipment

$$/GByte

Flash vs. HDD

$0.10

$1.00

$10.00

$100.00

2005 2006 2007 2008 2009 2010

NAND </= 1.0in HDD 1.8in HDD 2.5in HDD SSD

Source: IDC-June 2007


SSD Penetration in Notebook PCs

0%10%

20%

30%

40%50%

60%

70%

80%

90%100%

2006 2007 2008 2009 2010 2011

HDD SSDSource: IDC-June 2007

HDD core mobile markets will continue as a Data Storage industry growth segment


Areal Density Growth Requires Investment

0.0001

0.001

0.01

0.1

1

10

100

1000

10000

1970

1972

1974

1976

1978

1980

1982

1984

1986

1988

1990

1992

1994

1996

1998

2000

2002

2004

2006

2008

2010

Gb/

in2

~ $21B

25%

60%

100%

35 - 40%

MRNanoHeads

GMRPico

Heads

TuMR/PMR

sub-PicoHeads

AFCMedia

~$30.9B


2000-2010 is expected to require a 50% increase in R&D

spending to support industry technology

development


Thin Film Magnetic Heads (TFMH)

ABS

Areal density gains are driven by TFMH technology improvements


Component Demand Solid Long-Term Growth

M

500 M

1,000 M

1,500 M

2,000 M

2,500 M

2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011

Heads Platters


11% CAGR


Industry Dynamics are Shifting…

Consolidation continues Consolidation continues –– TDK purchase of ALPS, HGST TDK purchase of ALPS, HGST

GDL plant shutdownGDL plant shutdown

Overall industry financial health continues to improveOverall industry financial health continues to improve

Wafer size increase being evaluatedWafer size increase being evaluated

HDD MfgHDD Mfg’’ss

ArealAreal density gains require introduction of new processing density gains require introduction of new processing

stepssteps

FemtoFemto adoption nearly completeadoption nearly complete

Rapid PMR adoption (<15% to 50% by end of 07)Rapid PMR adoption (<15% to 50% by end of 07)

TechnologyTechnology

TrendTrendAreaAreaImpact Impact ononVeecoVeeco

Only one OEM TFMH supplier remainsOnly one OEM TFMH supplier remains

Strong technology challenge from Samsung with a 3Strong technology challenge from Samsung with a 3--

platter, 1 TB HDDplatter, 1 TB HDD

WDC purchase of Komag (media) reinforces the vertical WDC purchase of Komag (media) reinforces the vertical

integration model of our customersintegration model of our customers

CompetitionCompetition

Overall storage demand is healthyOverall storage demand is healthy……Pressure from flash for Pressure from flash for

≤≤1.81.8”” HDDHDD

Seasonal slowness in 1H07Seasonal slowness in 1H07…… industry predictions of a industry predictions of a

robust 2Hrobust 2H

HDD HDD

MarketMarket


Cost-effective HDD Supply = Vertical Integration

HDD Markets

HDD Manufacturers

TFMH Manufacturers

Capital Equipment Suppliers

Consumer Electronics

Desktop MobileEnterprise


Technology Advances to Remain on the ArealDensity Curve

Rapid adoption ofRapid adoption of PMRPMR andand TMR TMR Technology Technology

and Transition toand Transition to FemtoFemto SlidersSliders

Areal DensityAreal Density GrowthGrowth

125 to 500 Gbits/in125 to 500 Gbits/in22

Femto, PMR and TMR technologies have stringent

requirements for Process Equipment and Metrology

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

2005 2006 2007 2008 2009 2010

Year

Ado

ptio

n [%

]

0

100

200

300

400

500

600

700

800

900

1000

GB

its/in

2

PMR

Areal Density

TMR

CPP-GMR

Femto

40% CAGR


Small Form Factors Demand New Veeco Solutions

Mini Micro Namo Pico Femto(100%) (70%) (50%) (30%) (20%)

19751987 1990 1995 2006-7

Femto FF increases heads/wafer by >25%, delivering increased areal density at lower

price points.

2007 and beyond – wafer starts will be needed to increase capacity

Device Feature Manufacturing Challenges Process SolutionAir Bearing Surface (ABS) Etch

Increased number of critical step etches with improved sigma control

NEXUS IBE

ABS Characterization Metrology advances to support advanced ABS designs

HD8100

Slider Shape Control Stress management during mechanical processing of femto sliders

Veeco Advanced Slider Lapper

Reliability Reduction of particles via improved mechanical processing.

Veeco ADS line of saws

Flyheight Reduction Improved head overcoat capability required to reduce head-media spacing.

NEXUS DLC-FCA


Sensor Changes Demand New Veeco Process Solutions

Device Feature Manufacturing Challenges Process Solution

Sensor Definition Symmetrical interface engineering across wide range of materials

Low-energy NEXUS IBE

Sensor Materials Nano-scale engineering requires new materials and deposition techniques

Flexible NEXUS platform with IBD, PVD, ALD capability.

Sensor Isolation Dense conformal film integrated with sensor definition (etch)

NEXUS IBE-ALD

Surface finish CPP devices subject to "smearing" & sensitive to surface roughness


Scaling Non-destructive quality control of sensor shape & advanced litho patterns

Veeco X3D

Current Perpendicular to Plane (CPP)

Tunneling Effect (<1,000Gb/in2)

Current In Plane (CIP)

GMR Effect (<200Gb/in2)


Perpendicular Recording Demands New Veeco Solutions

PMR: arranges magnetic transitions perpendicular to the media surface, enabling increased storage capacity for the same media area.

Device Feature Manufacturing Challenges Process Solution

Pole DefinitionSymmetrical, low-damage interface engineering of re-entrant feature, followed by alumina encapsulation.

Low-energy NEXUS IBE with integrated ALD

Pole Materials New, high-moment materials and nano-laminates.

Flexible NEXUS platform with IBD, PVD, ALD capability.

Reader-writer offset PMR requries tight machining control of both reader and writer shapes


Pole Tip Recession (PTR)

PTR measurement exceeds optical limits; AFM capability is required

Vx series AFM

Scaling Non-destructive quality control of pole shape & advanced litho patterns

Veeco X3D


Veeco… A Strategic Partner in Every Step of the TFMH Manufacturing Process

New in 2007


2007 New Product Lineup – Introducing NEXUS PVD & ALD

NEXUS PVD-MTNEXUS PVDi

NEXUS PVD-HR NEXUS ALD

Sensor & HMM

Alumina & Metals

Isolation& Seed for TMR /PMR

High RateAlumina


Veeco NEXUS PVD-MT Multi-Target Planetary PVD System

30% Lower Cost of Ownership

• Highest Throughput

• Lowest Acquisition Cost

Higher Yield

• 50% Better Thickness Repeatability

• 25% Better Uniformity

Multi-application and multi-Generational asset

• Sensor: TMR MgO & CPP-GMR

• HM Materials: Laminated poles


Veeco NEXUS PVD-HR High-Rate Alumina Deposition System

Lowest Cost of Ownership• 3x Higher Rate

• Less Floor Space

Higher Yield• 2-4x Better Uniformity

• Tunable Film Properties

Robust Design• Automated handling

• Production-proven platform

Addresses larger wafer format processing requirement

DepositionZone

OxidationZone


Veeco NEXUS ALD Atomic Layer Deposition System

Broadest Process Capability

• Low-stress, high-rate Al2O3

• Conformal metal coatings

Low Cost of Ownership

• Low Acquisition Cost

• 5 hr PM cycle time

Integration Ready

• Clusterable w/ PVD, IBE, IBD

• Sensor-etch and isolation


New Product PenetrationNew Product Penetration

250250

2525

3232

99

3030

5151

105105

20062006

20201212IB EtchIB Etch

220220

2525

1616

2323

3434

110110

20072007DDCC

260260

SawsSaws3939

LappersLappers

1818DLCDLC

MetrologyMetrology2525

MetrologyMetrology

3434IB Etch & IB Etch & DepDep

ALDALD124124

PVDPVD20082008BBAA

Wafer

Slid

er

TAM

Tool of record Tool in qual or demoTool not currently being considered


Looking at the Next Form Factor Change

State-of-the-art wafer format for Data Storage TFMH mfg is 6” wafers

8” wafer format allows a 50% increase in sliders/wafer… without investment in facility expansion

Larger wafer format requires retooling in >50% of the process steps to achieve comparable yields


Growing in a Mature Data Storage Market

Blanket the TFMH manufacturing space with world-class new products

• Maintain leadership position in core products

• Introduce new products for total fab coverage

Exploit the Veeco global install base with industry-specific after-market support

• Veeco has the largest fleet of Data Storage TFMH capital equipment in the world…more than 3,000 tools

Match the Veeco business model to the HDD market cyclical realities

• Outsourcing allows Veeco to manage cyclicality in a niche market


After-Market Business Represents the Largest Veeco Data Storage Opportunity

Spare Parts Repairs Upgrades Site Svcs

Regional Depots

Regional Repair Centers Local Service Teams

Improved Tool UtilizationAsset Extendibility

Variable cost control

We estimate that 2006 Data Storage After-Market TAM was >$150M… our business was half that…Significant

opportunity to increase share

Veeco Investment Required

Customer Benefits Realized


Summary

The digital life increasingly drives digital storage demands

Flash memory is a friend and a foe to the HDD industry

• Digital storage is now ubiquitous

• The HDD industry will drive areal density to remain the storage medium of choice… HAMR is next

HDD consolidation and industry cycles will continue…business has stabilized

Veeco will maintain a business model to maximize products, technology deployment and market coverage

Driving Metrology Growth

Lloyd LaComb,Senior Vice President, TechnologyVeeco Metrology & Instrumentation


Veeco’s Leading Metrology Solutions

NT9800Dimension V AFM Dektak 150BioScope II

2006 Revenues $172M

Leadership positions in• Semiconductor, Data Storage, General Industrial, MEMS Metrology

• Nano/Bio Research – university & nano-center focused business

2007 & Focus for Nano-Bio Research AFM and Optical• Launch Next Generation Products and Drive Emerging Opportunities

2007 Focus for Automated AFM• Launch New Platform

• Drive Next Level of Market Adoption via new Key applications in Semi & DSDS

Dimension AFP


Driving Metrology Growth

Five Key Areas of Veeco Product Development Focus:• Semiconductor Metrology

• Data Storage Metrology

• Medical Device & Bio Life Science Applications

• Nano Materials Development & Education

• Emerging Opportunity in Solar Metrology

R = 100nm

R = 10 nm


Semiconductor Key Application Space – Broad Based Veeco Products

Advanced Etch/Lithography CD

• X3D provides accurate 3D metrology for RMS & Unique capability for LWR & Sidewall roughness

Etch Depth

• X300 provides direct, stable, no-model, in-line, etch depth metrology with low CoO

CMP

• AFP provides in-line CMP and etch depth metrology for 65nm and below

Mask

• X3D provides required resolution for defect repair & accurate 3D metrology of mask Resist & MoSi features

FinFets 45/32nm

CMP STI


Semiconductor Industry Today: 45nm -Significant CD Metrology Concerns

Data from leading Semiconductor manufacturers

Key Issues:

• Accuracy

• Optical CD model development

• Tool to Tool matching

These specific applications are not adequately addressed by CDSEM & OCD

0

1

2

3

4

5

6

7

8

PR Shrinka

geCurre

nt too

lbase

capabili

tyOve

rlay A

lignment

Matchin

g/FMP

Accurac

y

Scatterom

etry D

evelopment

Throughp

ut

DBM

AFM has potential to resolve these critical CD issues

3D AFM will be required


Current Fab CD Metrology Strategy

Current >65nm CD Metrology Strategy

CD or X-Section SEM Scatterometry (OCD)

•In-Die•Bias Control

•Test Structure

While SEM and OCD are key fab tools…

• Critical CD application also utilize 3D AFM

• CD-SEM or X-Sectional SEM used to validate Optical CD models


Emerging Fab CD Metrology Strategy

65nm & 45nm CD Metrology Strategy

Scatterometry (OCD)

•Test Structure

CD-SEM


3D-AFM


Total Measurement Uncertainty (TMU) from Edge effects, Material Bias etc. drives the 3D-AFM as the fab reference system

Increased AFM adoption driven by a higher throughput, more accurate system


Veeco is Meeting Future Fab Requirements

Introducing our New Semiconductor Platform in 2007

• 45nm & 32nm Capable

• Improved Throughput (3x)

• Improved Accuracy & repeatability (2x)

• Reduced CoO

First tool shipped…additional orders received…multiple customer evaluations occurring

Official product launch Fall ‘07

Applicable to both Semi and DS requirements


New Platform = Increase in Veeco AFM Serviceable Market Size in Semi and DS

Multiple metrology technologies required for critical applications (Gate, STI, Trench, Contact, Pole Shape)• In-line capability with productivity improvements

3D Metrology required for Reference Metrology• Accuracy at <45nm will be required

New materials and 3D structures (FinFets, Metal Gates)

Semiconductor Module Dimension System New PlatformEtch CD/Depth 1 to 2 2 to 3

(Gate, STI, Trench,) + (FinFet,Divot, DSL, Spacer, Contact)CMP & CIS 0 to 2 0 to 3

(Optical, AFM & Stylus) (STI, D&E) + (DieMap & Defect Detection)Lithography 0 1 to 2

(Reference/Modeling) + (LER/LWV/Profile)Total Tools/Semi Fab 1 to 4 3 to 8PhotomaskPhotomask 1 2

(MoSi, Resist, COG) (MoSi, Resist, COG, Defect)Data StorageData Storage 1 3 to 5


Veeco’s Key AFM Applications in Data Storage

Write Pole Geometry Resist/Post RIE

• X3D provides in-line, non-destructive and repeatable CD & SWA metrology of pole geometry with the industries lowest CoO

Damascene Trench – Resist/Metal

• X3D provides direct, in-line, damascene metrology with the industries lowest CoO and improved SWA

CMP, Defects & Roughness

• AFP provides in-line CMP, etch depth and roughness metrology for 65nm and below

PTR Slider

• VxPTR provides automated PTR metrology

Perpendicular MagneticRecording Trench Metrology

Perpendicular Magnetic Recording Pole Metrology


Veeco’s Key Optical Metrology Applications in Data Storage

Material Corrected Optical PTR in Slider• HD Series with Dual AccuPhase provides higher

accuracy PTR at automated production speeds for lower cost of process control.

Localized Slider Flatness • Monitor critical fly height information with the wide

view of the HD Series. Process control improves disk drive performance in higher density drives.

Emerging opportunities for optical in Wafer• Developing opportunities for wafer roughness, step

heights and film thicknesses. Replaces some stylus and FIB/SEM applications.

Optical PTR with Material Correction

Flatness Monitor withLocalized Flatness Deviation


Veeco’s Semiconductor Packaging Opportunity –SP Product Line

Market: High end semiconductor packaging applications

• Flip Chip, Chip Scale Package, 3D packaging, etc.

Two products:

• SP3X50 platform - panels up to 16”x20”

• SP9900 platform - panels up to 24”x24”

Business worth greater than $10M annually to Veeco with current customer base & many opportunities to expand business

New customers (> 400 suppliers in packaging, ~ 100 with FC/CSP capability)

Market adjacencies - OLED panels, printed electronics, medical test devices

©2006 Veeco Instruments Inc.

SP9900 ASP $550KHDI Interconnect / FCBGA

©2007 Veeco Instruments Inc. 880707 Investor Relations Presentation©2006 Veeco Instruments Inc.

Veeco Opportunity – Medical Devices

Large TAM - 8-10% CAGR (Frost & Sullivan)

Metrology needed for:

• Heart Stents

• Pacemakers and other implantable devices

• Artificial joints

• MEMS power sources

• Sharps

NT9300/9800 Applications Enable Critical Manufacturing Challenges• Surface Quality

• Critical Dimensions

• Drug Film Thickness

• Tribology Studies

• Environmental degradation

Current Customers• Boston Scientific, Medtronic, J&J

Guidant, WL Gore


AFM enables scientists to examine biological structure beyond the optical limit

Veeco has the worlds largest installed base of Biological AFM’s

The ASP for a biological AFM is $200k – $250kVeeco has partnered with Pasteur de

Lille, the premier European cell biology research center, to further disease

research and treatments.

Tubular MicellesTubular Micelles1.72 micron image1.72 micron image

1 Å 100 nm 100 μm 100 mm

AFM Optical

DNA Cell

Proteins

Veeco’s Bio-Instrumentation Opportunity

Sara E. Cross, “Application of Atomic force Microscope-Based Cytological Analysis: A novel Technique Platform for Cancer Diagnosis and Evaluation,”

Seeing at the Nanoscale V

00 5050 100100 150150 200200 250250 300300 350350 400400001122334455667788

Co

un

tsC

ou

nts

Cell Stiffness

Cancerous Cells Normal Normal

CellsCells

AFM Can Identify Cancer in Tissue By Quantifying Cell Stiffness… Analysis of a tissue sample

using a Veeco AFM


Bio-Life Science Activity-Reaching Out To…

Bio Research Base

• Partnerships with industry leading researchers in US and Europe including:

Pasteur Institute, Dr. Frank Lafont

University of Muenster, Dr. Oberleithner

Life Science Community

• Veeco founded and co-Sponsored AFM BioMed, the premier International Meeting on AFM in Life Sciences and Medicine.

Industrial Partners

• Veeco is in active Marketing and Engineering partnership with Leica Instruments to expand our products and channel through the education and promotion of combined light and force microscopy.

Living in a world of Forces:Axon Manipulation to Regeneration


Capitalizing on the Demand for NanomaterialsMetrology

0

200

400

600

800

1000

1200

1400

1600

198919901991199219931994199519961997199819992000200120022003200420052006

# AFM papers on mechanical properties

Lack of nanomaterialmetrology is a “key

bottleneck”Nanoscale domains in a

block copolymerStrong growth in scientific

publications

Nanoscale structures impact macroscopic material performance of wide range of consumer products

• Electronics packaging, tires, automotive parts, food packaging, shoes, etc.

Strong demand for measurements of material properties at the nanoscale


Veeco Enables Broad-Based Research

Innova• Launched: Q2 2007

• Geared to second tier universities and industrial customers… lower cost option to our mainstream MultiModeor Dimension

Market Position

The Nano-Suite

The Innova delivers high-resolution imaging with a wide range of functionality for physical and materials sciences.

Innova is the entry point into Veeco’s R&D SPM suite. It takes researchers to the upgrade point for ultimate performance, function, and/or automation.


Expanding Veeco’s Educational Market Opportunity

Caliber based “Fundamentals of Nanotechnology”curriculum, to proactively address:Nascent Eastern European and APAC educational institutions that are simultaneously advancing their education and research efforts on limited budgets

The Nanotechnology in Schools Act: An effort by congress to increase the level of technical education in US schools

Brand Leadership and Opinion Ownership with leading research and educational institutions through a demonstrated commitment to Nanotechnology and Education

Caliber based “Fundamentals of Nanotechnology”curriculum, to proactively address:Nascent Eastern European and APAC educational institutions that are simultaneously advancing their education and research efforts on limited budgets

The Nanotechnology in Schools Act: An effort by congress to increase the level of technical education in US schools

Brand Leadership and Opinion Ownership with leading research and educational institutions through a demonstrated commitment to Nanotechnology and Education


Expanding Veeco’s Educational Market Opportunity

New Caliber

• Launched: Q4 2006

Market Position

Curriculum Development

Caliber delivers highly reliable functionality and performance at a tremendous value

Classroom and laboratory exercises that explore nanotechnology, physics, and engineering being developed in 2007

©2007 Veeco Instruments Inc. 950707 Investor Relations Presentation©2006 Veeco Instruments Inc.

Veeco Metrology Opportunity in Solar CellVeeco Metrology Opportunity in Solar Cell

Market• 43% CAGR 2003 – 2010 (Yole Research )

(9.2GWatt)

• Strong Gov’t incentives to drive development

Veeco Growth Strategy• NT-9300/9800 Applications Target

• Film ThicknessSi, AR coating, Front collector traces

• Top Surface Roughness

Current Customers• 1st Solar – EU/USA

• Bangkok Solar - Asia

• BP Solar - EU

• Global Solar - USA

• REC Scancel - EU

• TopSolar – Asia

• >20 customers


Nano RulerNano Ruler

World Leader in Surface Science and Metrology

Magnetic Bits (HDD)Magnetic Bits (HDD)160nmx40nm (100Gb/in2).160nmx40nm (100Gb/in2).MEMSMEMS

10um 10um –– 1mm1mm

TransistorTransistor0.5um 0.5um –– 90nm90nm

Quantum DotsQuantum Dots20nm wide ea.20nm wide ea.

Silicon AtomSilicon Atom0.2nm dia0.2nm dia

Nan

otec

hN

anot

ech

1,000,000nm1,000,000nm

100,000nm100,000nm

10,000nm10,000nm

1,000nm1,000nm

100nm100nm

10nm10nm

1nm1nm

0.1nm0.1nm

NanoNano

Mic

rote

chM

icro

tech

Veeco Has the Broadest Line of Tools For Micro to Nano ApplicationsVeeco Has the Broadest Line of Tools For Micro to Nano ApplicatiVeeco Has the Broadest Line of Tools For Micro to Nano Applicationsons

DMEMS OpticalDMEMS Optical

Dimension VDimension V

Dektak StylusDektak Stylus

Multimode VMultimode V

Installed Base of >20,000 Installed Base of >20,000 toolstools

PolymersPolymers5nm 5nm –– 500nm500nm

Q&A Session

semicon 2007 master -...

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